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SMBJ5351B Dataheets PDF



Part Number SMBJ5351B
Manufacturers Microsemi
Logo Microsemi
Description Surface Mount Silicon 5Watt Zener Diodes
Datasheet SMBJ5351B DatasheetSMBJ5351B Datasheet (PDF)

SMBJ5333B thru SMBJ5388B Available Surface Mount Silicon 5 Watt Zener Diodes DESCRIPTION The SMBJ5333B - SMBJ5388B series of surface mount 5.0 watt Zeners provides a selection from 3.3 to 200 volts with different tolerances as identified by suffix letter on the part number. It is equivalent to the JEDEC registered 1N5333 thru 1N5388B with identical electrical characteristics and testing. These parts are available with either Sn/Pb plating or a RoHS compliant matte-tin finish. This J-bend desi.

  SMBJ5351B   SMBJ5351B



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SMBJ5333B thru SMBJ5388B Available Surface Mount Silicon 5 Watt Zener Diodes DESCRIPTION The SMBJ5333B - SMBJ5388B series of surface mount 5.0 watt Zeners provides a selection from 3.3 to 200 volts with different tolerances as identified by suffix letter on the part number. It is equivalent to the JEDEC registered 1N5333 thru 1N5388B with identical electrical characteristics and testing. These parts are available with either Sn/Pb plating or a RoHS compliant matte-tin finish. This J-bend design (SMBJ) in the DO-214AA allows for greater PC board mounting density. These plastic encapsulated Zeners have a moisture classification of “Level 1” with no dry pack required. Microsemi also offers numerous other Zener products to meet higher and lower power applications. Important: For the latest information, visit our website http://www.microsemi.com. FEATURES • Surface mount equivalent to JEDEC registered 1N5333 thru 1N5388 series. • Ideal for high-density and low-profile mounting. • Zener voltage available 3.3 V to 200 V. • Plus/minus 10%, 5% and 2% voltage tolerances are available. (See part nomenclature block.) • RoHS compliant versions available. DO-214AA J-Bend Package NOTE: All SMB series are equivalent to prior SMS package identifications. Also available in: DO-215AA Package (Gull-wing surface mount) SMBG5333 – SMBG5388 T-18 Package (axial-leaded) 1N5333 – 1N5388 APPLICATIONS / BENEFITS • Regulates voltage over broad operating current and temperature ranges. • Wide selection from 3.3 to 200 V. • Non-sensitive to ESD per MIL-STD-750 method 1020. • Withstands high surge stresses. • Minimal changes of voltage versus current. • High specified maximum current (IZM) with adequate heat sinking. • Moisture classification is “Level 1” per IPC/JEDEC J-STD-020B with no dry pack required. MAXIMUM RATINGS Parameters/Test Conditions Junction and Storage Temperature Thermal Resistance Junction-to-Lead Thermal Resistance Junction-to-Ambient (1) Off-State Power Dissipation @ 25 oC (2) Forward Voltage @ 1.0 A Solder Temperature @ 10 s Symbol TJ and TSTG R ӨJL R ӨJA PD VF TSP Value -65 to +150 25 90 5.0 1.2 260 Unit oC oC/W oC/W W V oC Notes: 1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see pad layout). 2. 5 watts at T L < 25 oC, or 1.38 watts at T A = 25 ºC when mounted on FR4 PC board with recommended footprint (also see Figure 1). MSC – Lawrence 6 Lake Street, Lawrence, MA 01841 Tel: 1-800-446-1158 or (978) 620-2600 Fax: (978) 689-0803 MSC – Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Website: www.microsemi.com T4-LDS-0246-2, Rev. 1 (120180) ©2012 Microsemi Corporation Page 1 of 5 SMBJ5333B thru SMBJ5388B MECHANICAL and PACKAGING • CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0. • TERMINALS: C-bend (modified J-bend) tin-lead or RoHS compliant annealed matte-tin plating solderable per MIL-STD-750, method 2026. • MARKING: Part number wi.


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