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SMBJ5373B Dataheets PDF



Part Number SMBJ5373B
Manufacturers Microsemi
Logo Microsemi
Description Surface Mount Silicon 5Watt Zener Diodes
Datasheet SMBJ5373B DatasheetSMBJ5373B Datasheet (PDF)

SMBJ5333B thru SMBJ5388B Available Surface Mount Silicon 5 Watt Zener Diodes DESCRIPTION The SMBJ5333B - SMBJ5388B series of surface mount 5.0 watt Zeners provides a selection from 3.3 to 200 volts with different tolerances as identified by suffix letter on the part number. It is equivalent to the JEDEC registered 1N5333 thru 1N5388B with identical electrical characteristics and testing. These parts are available with either Sn/Pb plating or a RoHS compliant matte-tin finish. This J-bend desi.

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SMBJ5333B thru SMBJ5388B Available Surface Mount Silicon 5 Watt Zener Diodes DESCRIPTION The SMBJ5333B - SMBJ5388B series of surface mount 5.0 watt Zeners provides a selection from 3.3 to 200 volts with different tolerances as identified by suffix letter on the part number. It is equivalent to the JEDEC registered 1N5333 thru 1N5388B with identical electrical characteristics and testing. These parts are available with either Sn/Pb plating or a RoHS compliant matte-tin finish. This J-bend design (SMBJ) in the DO-214AA allows for greater PC board mounting density. These plastic encapsulated Zeners have a moisture classification of “Level 1” with no dry pack required. Microsemi also offers numerous other Zener products to meet higher and lower power applications. Important: For the latest information, visit our website http://www.microsemi.com. FEATURES • Surface mount equivalent to JEDEC registered 1N5333 thru 1N5388 series. • Ideal for high-density and low-profile mounting. • Zener voltage available 3.3 V to 200 V. • Plus/minus 10%, 5% and 2% voltage tolerances are available. (See part nomenclature block.) • RoHS compliant versions available. DO-214AA J-Bend Package NOTE: All SMB series are equivalent to prior SMS package identifications. Also available in: DO-215AA Package (Gull-wing surface mount) SMBG5333 – SMBG5388 T-18 Package (axial-leaded) 1N5333 – 1N5388 APPLICATIONS / BENEFITS • Regulates voltage over broad operating current and temperature ranges. • Wide selection from 3.3 to 200 V. • Non-sensitive to ESD per MIL-STD-750 method 1020. • Withstands high surge stresses. • Minimal changes of voltage versus current. • High specified maximum current (IZM) with adequate heat sinking. • Moisture classification is “Level 1” per IPC/JEDEC J-STD-020B with no dry pack required. MAXIMUM RATINGS Parameters/Test Conditions Junction and Storage Temperature Thermal Resistance Junction-to-Lead Thermal Resistance Junction-to-Ambient (1) Off-State Power Dissipation @ 25 oC (2) Forward Voltage @ 1.0 A Solder Temperature @ 10 s Symbol TJ and TSTG R ӨJL R ӨJA PD VF TSP Value -65 to +150 25 90 5.0 1.2 260 Unit oC oC/W oC/W W V oC Notes: 1. When mounted on FR4 PC board (1oz Cu) with recommended footprint (see pad layout). 2. 5 watts at T L < 25 oC, or 1.38 watts at T A = 25 ºC when mounted on FR4 PC board with recommended footprint (also see Figure 1). MSC – Lawrence 6 Lake Street, Lawrence, MA 01841 Tel: 1-800-446-1158 or (978) 620-2600 Fax: (978) 689-0803 MSC – Ireland Gort Road Business Park, Ennis, Co. Clare, Ireland Tel: +353 (0) 65 6840044 Fax: +353 (0) 65 6822298 Website: www.microsemi.com T4-LDS-0246-2, Rev. 1 (120180) ©2012 Microsemi Corporation Page 1 of 5 SMBJ5333B thru SMBJ5388B MECHANICAL and PACKAGING • CASE: Void-free transfer molded thermosetting epoxy body meeting UL94V-0. • TERMINALS: C-bend (modified J-bend) tin-lead or RoHS compliant annealed matte-tin plating solderable per MIL-STD-750, method 2026. • MARKING: Part number without SMBx prefix (e.g. 5334B, 5334Be3, MX5348C, 5376A, etc.). • POLARITY: Cathode indicated by band. Diode to be operated with the banded end positive with respect to the opposite end. • TAPE & REEL option: Standard per EIA-481-1-A with 12 mm tape (add “TR” suffix to part number). Consult factory for quantities. • WEIGHT: 0.1 grams. • See Package Dimensions on last page. Surface Mount Package J-Bend Lead Frame JEDEC type number (See Electrical Characteristics table) PART NOMENCLATURE SMB J 5334 A (e3) RoHS Compliance e3 = RoHS Compliant Blank = non-RoHS Compliant Breakdown Voltage Tolerance A = +/- 10% B = +/- 5% C = +/- 2% Symbol IR IZ, IZT, IZK I ZM I ZSM VR VZ ZZT or Z ZK SYMBOLS & DEFINITIONS Definition Reverse Current: The maximum reverse (leakage) current that will flow at the specified voltage and temperature. Regulator Current: The dc regulator current (IZ), at a specified test point (IZT), near breakdown knee (IZK). Maximum Regulator (Zener) Current: The maximum rated dc current for the specified power rating. Maximum Zener Surge Current: The non-repetitive peak value of Zener surge current at a specified wave form. Reverse Voltage: The reverse voltage dc value, no alternating component. Zener Voltage: The Zener voltage the device will exhibit at a specified current (IZ) in its breakdown region. Dynamic Impedance: The small signal impedance of the diode when biased to operate in its breakdown region at a specified rms current modulation (typically 10% of IZT or IZK) and superimposed on IZT or IZK respectively. T4-LDS-0246-2, Rev. 1 (120180) ©2012 Microsemi Corporation Page 2 of 5 SMBJ5333B thru SMBJ5388B ELECTRICAL CHARACTERISTICS @ TL = 30oC TYPE NUMBER SMBJ5333B SMBJ5334B SMBJ5335B SMBJ5336B SMBJ5337B SMBJ5338B SMBJ5339B SMBJ5340B SMBJ5341B SMBJ5342B SMBJ5343B SMBJ5344B SMBJ5345B SMBJ5346B SMBJ5347B SMBJ5348B SMBJ5349B SMBJ5350B SMBJ5351B SMBJ5352B SMBJ5353B SMBJ5354B SMBJ5355B SMB.


SMBJ5372B SMBJ5373B SMBJ5374B


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