transistors. BC55PA Datasheet

BC55PA Datasheet PDF


Part

BC55PA

Description

1A NPN medium power transistors

Manufacture

nexperia

Page 22 Pages
Datasheet
Download BC55PA Datasheet


BC55PA Datasheet
BCP55; BCX55; BC55PA
60 V, 1 A NPN medium power transistors
Rev. 8 — 24 October 2011
Product data sheet
1. Product profile
1.1 General description
NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages.
Table 1. Product overview
Type number[1]
Package
Nexperia
BCP55
SOT223
BCX55
SOT89
BC55PA
SOT1061
JEITA
SC-73
SC-62
-
[1] Valid for all available selection groups.
JEDEC
-
TO-243
-
PNP complement
BCP52
BCX52
BC52PA
1.2 Features and benefits
High current
Three current gain selections
High power dissipation capability
Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061)
Leadless very small SMD plastic package with medium power capability (SOT1061)
AEC-Q101 qualified
1.3 Applications
Linear voltage regulators
Low-side switches
Battery-driven devices
Power management
MOSFET drivers
Amplifiers
1.4 Quick reference data
Table 2. Quick reference data
Symbol Parameter
Conditions
Min Typ Max Unit
VCEO
IC
ICM
hFE
collector-emitter voltage
collector current
peak collector current
DC current gain
hFE selection -10
hFE selection -16
open base
single pulse; tp 1 ms
VCE = 2 V; IC = 150 mA
VCE = 2 V; IC = 150 mA
VCE = 2 V; IC = 150 mA
-
-
-
[1] 63
[1] 63
[1] 100
-
-
-
-
-
-
60 V
1A
2A
250
160
250
[1] Pulse test: tp 300 s; = 0.02.

BC55PA Datasheet
Nexperia
BCP55; BCX55; BC55PA
60 V, 1 A NPN medium power transistors
2. Pinning information
Table 3.
Pin
SOT223
1
2
3
4
Pinning
Description
base
collector
emitter
collector
SOT89
1
2
3
emitter
collector
base
SOT1061
1
2
3
base
emitter
collector
Simplified outline Graphic symbol
4
123
2, 4
1
3
sym016
321
2
3
1
sym042
3
12
Transparent top view
3
1
2
sym021
3. Ordering information
Table 4. Ordering information
Type number[1] Package
Name Description
BCP55
SC-73
plastic surface-mounted package with increased
heatsink; 4 leads
BCX55
SC-62
plastic surface-mounted package; exposed die pad for
good heat transfer; 3 leads
BC55PA
HUSON3 plastic thermal enhanced ultra thin small outline
package; no leads; 3 terminals; body 2 2 0.65 mm
[1] Valid for all available selection groups.
Version
SOT223
SOT89
SOT1061
BCP55_BCX55_BC55PA
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 24 October 2011
© Nexperia B.V. 2017. All rights reserved
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Features Datasheet pdf BCP55; BCX55; BC55PA 60 V, 1 A NPN medi um power transistors Rev. 8 — 24 Octo ber 2011 Product data sheet 1. Produc t profile 1.1 General description NPN medium power transistor series in Surfa ce-Mounted Device (SMD) plastic package s. Table 1. Product overview Type num ber[1] Package Nexperia BCP55 SOT22 3 BCX55 SOT89 BC55PA SOT1061 JEITA SC-73 SC-62 - [1] Valid for all avail able selection groups. JEDEC TO-243 - PNP complement BCP52 BCX52 BC52PA 1.2 Features and benefits  High current  Three current gain selections  High power dissipation capability  E xposed heatsink for excellent thermal a nd electrical conductivity (SOT89, SOT1 061)  Leadless very small SMD plasti c package with medium power capability (SOT1061)  AEC-Q101 qualified 1.3 A pplications  Linear voltage regulato rs  Low-side switches  Battery-dr iven devices  Power management  MOSFET drivers  Amplifiers 1.4 Quic k reference data Table 2. Quick reference data Symbol Parameter Conditions Min Typ Ma.
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