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BZA862AVL Dataheets PDF



Part Number BZA862AVL
Manufacturers NXP
Logo NXP
Description Quadruple low capacitance ESD suppressor
Datasheet BZA862AVL DatasheetBZA862AVL Datasheet (PDF)

DISCRETE SEMICONDUCTORS DATA SHEET dbook, halfpage MBD127 BZA800AVL series Quadruple low capacitance ESD suppressor Product data sheet Supersedes data of 2003 Apr 01 2003 Oct 20 NXP Semiconductors Quadruple low capacitance ESD suppressor Product data sheet BZA800AVL series FEATURES • Low diode capacitance • Low leakage current • SOT353 (SC-88A) surface mount package • Common anode configuration. APPLICATIONS • Communication systems • Computers and peripherals • Audio and video equipment..

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DISCRETE SEMICONDUCTORS DATA SHEET dbook, halfpage MBD127 BZA800AVL series Quadruple low capacitance ESD suppressor Product data sheet Supersedes data of 2003 Apr 01 2003 Oct 20 NXP Semiconductors Quadruple low capacitance ESD suppressor Product data sheet BZA800AVL series FEATURES • Low diode capacitance • Low leakage current • SOT353 (SC-88A) surface mount package • Common anode configuration. APPLICATIONS • Communication systems • Computers and peripherals • Audio and video equipment. PINNING PIN 1 2 3 4 5 DESCRIPTION cathode 1 common anode cathode 2 cathode 3 cathode 4 DESCRIPTION Monolithic transient voltage suppressor diode in a five lead SOT353 (SC-88A) package for 4-bit wide ESD transient suppression. MARKING TYPE NUMBER BZA856AVL BZA862AVL BZA868AVL MARKING CODE R3 R2 R1 handbook, halfpage5 4 123 1 3 2 4 5 MGT580 Fig.1 Simplified outline (SOT353; SC-88A) and symbol. ORDERING INFORMATION TYPE NUMBER BZA856AVL BZA862AVL BZA868AVL NAME − − − PACKAGE DESCRIPTION plastic surface mounted package; 5 leads plastic surface mounted package; 5 leads plastic surface mounted package; 5 leads VERSION SOT353 SOT353 SOT353 2003 Oct 20 2 NXP Semiconductors Quadruple low capacitance ESD suppressor Product data sheet BZA800AVL series LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL PARAMETER Per diode IZ IF IFSM Ptot PZSM Tstg Tj ESD working current continuous forward current non-repetitive peak forward current total power dissipation non repetitive peak reverse power dissipation storage temperature junction temperature electrostatic discharge CONDITIONS MIN. Tamb = 25 °C Tamb = 25 °C tp = 1 ms; square pulse Tamb = 25 °C; note 2; see Fig.5 square pulse; tp = 1 ms − − − − − IEC 61000-4-2 (contact discharge) HBM MIL-Std 883 −65 − 15 10 Notes 1. DC working current limited by Ptot(max). 2. Device mounted on standard printed-circuit board. MAX. UNIT note 1 200 3.5 300 6 mA mA A mW W +150 150 − − °C °C kV kV ESD STANDARDS COMPLIANCE STANDARD IEC 61000-4-2, level 4 (ESD) HBM MIL-Std 883, class 3 CONDITIONS >15 kV (air); >8 kV (contact discharge) >4 kV THERMAL CHARACTERISTICS SYMBOL Rth j-a Rth j-s PARAMETER thermal resistance from junction to ambient thermal resistance from junction to solder point; note 1 Note 1. Solder point of common anode (pin 2). CONDITIONS all diodes loaded one diode loaded all diodes loaded VALUE 410 200 185 UNIT K/W K/W K/W 2003 Oct 20 3 NXP Semiconductors Quadruple low capacitance ESD suppressor Product data sheet BZA800AVL series ELECTRICAL CHARACTERISTICS Tj = 25 °C unless otherwise specified. SYMBOL PARAMETER VF forward voltage IR reverse current BZA856AVL BZA862AVL BZA868AVL VZ working voltage BZA856AVL BZA862AVL BZA868AVL rdif differential resistance BZA856AVL BZA862AVL BZA868AVL SZ temperature coefficient BZA856AVL BZA862AVL BZA868AVL Cd diode capacitance BZA856AVL BZA862AVL BZA868AVL diode capacitance BZA856AVL BZA862AVL BZA868AV.


BZA856AVL BZA862AVL BZA868AVL


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