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RB520CS3002L Dataheets PDF



Part Number RB520CS3002L
Manufacturers nexperia
Logo nexperia
Description VF MEGA Schottky barrier rectifier
Datasheet RB520CS3002L DatasheetRB520CS3002L Datasheet (PDF)

RB520CS3002L 200 mA low VF MEGA Schottky barrier rectifier 25 June 2013 Product data sheet 1. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in DFN1006-2 (SOD882) leadless ultra small Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Average forward current: IF(AV) ≤ 200 mA • Reverse voltage: VR ≤ 30 V • Low forward voltage: VF ≤ 450 mV • Low reverse .

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RB520CS3002L 200 mA low VF MEGA Schottky barrier rectifier 25 June 2013 Product data sheet 1. General description Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in DFN1006-2 (SOD882) leadless ultra small Surface-Mounted Device (SMD) plastic package. 2. Features and benefits • Average forward current: IF(AV) ≤ 200 mA • Reverse voltage: VR ≤ 30 V • Low forward voltage: VF ≤ 450 mV • Low reverse current: IR ≤ 0.5 μA • AEC-Q101 qualified • Leadless ultra small SMD plastic package 3. Applications • Low current rectification • High efficiency DC-to-DC conversion • Switch mode power supply • Reverse polarity protection • Low power consumption applications 4. Quick reference data Table 1. Symbol IF(AV) Quick reference data Parameter average forward current VR reverse voltage VF forward voltage IR reverse current Conditions δ = 0.5 ; f = 20 kHz; Tamb ≤ 115 °C; square wave δ = 0.5 ; f = 20 kHz; Tsp ≤ 135 °C; square wave IF = 10 mA; tp ≤ 300 µs; δ ≤ 0.02 ; Tj = 25 °C; pulsed VR = 10 V; Tj = 25 °C Min Typ Max Unit [1] - - 200 mA - - 200 mA - - 30 V - 330 450 mV - 0.14 0.5 µA [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Nexperia RB520CS3002L 200 mA low VF MEGA Schottky barrier rectifier 5. Pinning information Table 2. Pin 1 2 Pinning information Symbol Description K cathode[1] A anode Simplified outline 12 Transparent top view DFN1006-2 (SOD882) [1] The marking bar indicates the cathode. Graphic symbol 1 2 sym001 6. Ordering information Table 3. Ordering information Type number Package Name RB520CS3002L DFN1006-2 Description leadless ultra small plastic package; 2 terminals Version SOD882 7. Marking Table 4. Marking codes Type number RB520CS3002L Marking code ZA RB520CS3002L Product data sheet All information provided in this document is subject to legal disclaimers. 25 June 2013 © Nexperia B.V. 2017. All rights reserved 2 / 13 Nexperia RB520CS3002L 200 mA low VF MEGA Schottky barrier rectifier 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions VR reverse voltage IF(AV) average forward current δ = 0.5 ; f = 20 kHz; Tamb ≤ 115 °C; square wave δ = 0.5 ; f = 20 kHz; Tsp ≤ 135 °C; square wave IFSM non-repetitive peak forward tp = 8.3 ms; Tj(init) = 25 °C; half sine current wave Ptot total power dissipation Tamb ≤ 25 °C Tj Tamb Tstg junction temperature ambient temperature storage temperature Min Max Unit - 30 V [1] - 200 mA - 200 mA - 3A [2] - 315 mW [1] - 565 mW [3] - 865 mW - 150 °C -55 150 °C -65 150 °C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on a ceramic PCB, Al2O3, standard footprint. 9. Thermal characteristics Table 6. Symbol Rth(j-a) Thermal characteristics Parameter thermal resistance from junction to ambient Conditions in free air Rth(j-sp) thermal resistance from junction to solder point Min Typ Max Unit [1][2] - - 395 K/W [1][3] - - 220 K/W [1][4] - - 145 K/W [5] - - 70 K/W [1] For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a significant part of the total power losses. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [4] Device mounted on a ceramic PCB, Al2O3, standard footprint. [5] Soldering point of cathode tab. RB520CS3002L Product data sheet All information provided in this document is subject to legal disclaimers. 25 June 2013 © Nexperia B.V. 2017. All rights reserved 3 / 13 Nexperia RB520CS3002L 200 mA low VF MEGA Schottky barrier rectifier 103 Zth(j-a) (K/W) 102 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 10 0.02 0 0.01 006aac533 1 10- 5 10- 4 10- 3 10- 2 10- 1 FR4 PCB, standard footprint 1 10 102 103 tp (s) Fig. 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 103 006aac534 Zth(j-a) (K/W) 102 10 duty cycle = 1 0.75 0.5 0.33 0.25 0.2 0.1 0.05 0 0.02 0.01 1 10- 5 10- 4 10- 3 10- 2 FR4 PCB, mounting pad for cathode 1 cm2 10- 1 1 10 102 103 tp (s) Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values RB520CS3002L Product data sheet All information provided in this document is subject to legal disclaimers. 25 June 2013 © Nexperia B.V. 2017. All rights reserved 4 / 13 Nexperia RB520CS3002L 200 mA low VF MEGA Schottky barrier rectifier 103 Zth(j-a) (K/W) 1.


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