BUK7S0R9-40H

BUK7S0R9-40H N-channel 40 V, 0.9 mΩ standard level MOSFET in LFPAK88 2 May 2019 Product data sheet 1. General description Automotive qualified N-channel MOSFET using the latest Trench 9 low ohmic superjunction technology, housed in a copper-clip LFPAK88 package. This product has been fully designed and qualified to meet beyond AEC-Q101 requirements delivering high performance and reliability. 2. Features and benefits Fully automotive qualified to beyond AEC-Q101: -55 °C to +175 °C rating suitable for thermally demanding environments LFPAK88 package: Designed for smaller footprint and improved power density over older wire bond packages such as D²PAK for today’s space constrained high power automotive applications Thin package and copper clip enables LFPAK88 to be highly efficient thermally LFPAK copper clip technology enabling improvements over wire bond packages by: Increased maximum current capability and excellent current spreading Improved RDSon Low source inductance Low thermal resistance Rth LFPAK Gull Wing leads: Flexible leads enabling high Board Level Reliability absorbing mechanical and thermal cycling stress, unlike traditional QFN packages Visual (AOI) soldering inspection, no need for expensive x-ray equipment Easy solder wetting for good mechanical solder joint Unique 40 V Trench 9 superjunction technology: Reduced cell pitch and superjunction platform enables lower RDSon in the same footprint Improved SOA and avalanche cap...