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IS31FL3737 Dataheets PDF



Part Number IS31FL3737
Manufacturers ISSI
Logo ISSI
Description 12x12 DOTS MATRIX LED DRIVER
Datasheet IS31FL3737 DatasheetIS31FL3737 Datasheet (PDF)

IS31FL3737 12×12 DOTS MATRIX LED DRIVER WITH INDIVIDUAL AUTO BREATH FUNCTION July 2016 GENERAL DESCRIPTION FEATURES The IS31FL3737 is a general purpose 12×12 LEDs matrix driver with 1/12 cycle rate. The device can be programmed via an I2C compatible interface. Each LED can be dimmed individually with 8-bit PWM data which allowing 256 steps of linear dimming. IS31FL3737 features 3 Auto Breathing Modes which are noted as ABM-1, ABM-2 and ABM-3. For each Auto Breathing Mode, there are 4 timing.

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IS31FL3737 12×12 DOTS MATRIX LED DRIVER WITH INDIVIDUAL AUTO BREATH FUNCTION July 2016 GENERAL DESCRIPTION FEATURES The IS31FL3737 is a general purpose 12×12 LEDs matrix driver with 1/12 cycle rate. The device can be programmed via an I2C compatible interface. Each LED can be dimmed individually with 8-bit PWM data which allowing 256 steps of linear dimming. IS31FL3737 features 3 Auto Breathing Modes which are noted as ABM-1, ABM-2 and ABM-3. For each Auto Breathing Mode, there are 4 timing characters which include current rising / holding / falling / off time and 3 loop characters which include Loop-Beginning / Loop-Ending / Loop-Times. Every LED can be configured to be any Auto Breathing Mode or NoBreathing Mode individually. Additionally each LED open and short state can be detected, IS31FL3737 store the open or short information in Open-Short Registers. The Open-Short Registers allowing MCU to read out via I2C compatible interface. Inform MCU whether there are LEDs open or short and the locations of open or short LEDs. The IS31FL3737 operates from 2.7V to 5.5V and features a very low shutdown and operational current. IS31FL3737 is available in QFN-40 (5mm×5mm) package. It operates from 2.7V to 5.5V over the temperature range of -40°C to +125°C.  Supply voltage range: 2.7V to 5.5V  12 current source outputs for row control  12 switch current inputs for column scan control  Up to 144 LEDs (12×12) in dot matrix  Programmable 12×12 (48 RGBs) matrix size with de-ghost function  1MHz I2C-compatible interface  Selectable 3 Auto Breath Modes for each dot  Auto Breath Loop Features interrupt pin inform MCU Auto Breath Loop completed  Auto Breath offers 128 steps gamma current, interrupt and state look up registers  256 steps Global Current Setting  Individual on/off control  Individual 256 PWM control steps  Individual Auto Breath Mode select  Individual open and short error detect function  Cascade for synchronization of chips  QFN-40 (5mm×5mm) package APPLICATIONS  Mobile phones and other hand-held devices for LED display  Gaming device (Keyboard, Mouse etc.)  LED in white goods application TYPICAL APPLICATION CIRCUIT VCC_5V *Note2 19 PVCC VIO/MCU 32 VIO 22μF/10V 0.47μF 0.1μF 0.47μF 0.1μF 0.47μF 0.1μF 26 PVCC 31 VCC 0.47μF 28 CS12 27 CS11 SW12 SW11 VIO/MCU 100kΩ 4.7kΩ 4.7kΩ Micro Controller 100kΩ 100kΩ 16 CS2 34 15 SDA CS1 35 37 SCL IS31FL3737 INTB 38 14 SDB SW12 39 13 IICRST SW11 SW10 SW9 SW8 SW7 SW6 SW5 SW4 REXT 20kΩ 33 SYNC 30 RSET 36 ADDR 40 GND 2 SW2 1 SW1 4,11 PGND 29 AGND SW3 SW2 SW1 CS1 CS2 CS3 CS4 CS5 CS6 CS7 CS8 CS9 CS10 CS11 CS12 L K J I H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 Figure 1 Typical Application Circuit (12×12) Note 1: For the mobile applications the IC should be placed far away from the mobile antenna in order to prevent the EMI. Note 2: Electrolytic/Tantalum Capacitor may considerable for high current application to avoid audible noise interference. Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/19/2016 1 IS31FL3737 TYPICAL APPLICATION CIRCUIT (CONTINUED) *Note4 VCC_5V 19 PVCC VIO/MCU 32 VIO 22μF/10V 0.47μF 0.1μF 0.47μF 0.1μF 0.47μF 0.1μF 26 PVCC 31 VCC 0.47μF 28 CS12 27 CS11 SW12 SW11 VIO/MCU SW10 100kΩ 4.7kΩ 4.7kΩ Micro Controller 100kΩ 100kΩ 16 CS2 34 15 SDA CS1 35 37 SCL IS31FL3737 INTB 38 14 SDB SW12 39 13 IICRST SW11 SW9 SW8 SW7 SW6 SW5 SW4 REXT 20kΩ 33 SYNC 30 RSET 36 ADDR 40 GND 2 SW2 1 SW1 4,11 PGND 29 AGND SW3 SW2 SW1 CS1 CS2 CS3 CS4 CS5 CS6 CS7 CS8 CS9 CS10 CS11 CS12 L K J I H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 Figure 2 Typical Application Circuit (RGB) Note 3: For the mobile applications the IC should be placed far away from the mobile antenna in order to prevent the EMI. Note 4: Electrolytic/Tantalum Capacitor may considerable for high current application to avoid audible noise interference. Micro Controller ADDR VIO 100kΩ 1kΩ 1kΩ SDA SCL INTB SDB SDA SCL INTB SDB IICRST 100kΩ 100kΩ IICRST SDA SCL SDB IICRST SYNC Master VBattery ADDR SDA ADDR SCL ADDR SDA SCL INTB SDB IICRST SDA SCL SDB IICRST SYNC Slave 1 SDA SCL INTB SDB IICRST SDA SCL SDB IICRST SYNC Slave 2 SDA SCL INTB SDB IICRST SYNC Slave 3 Figure 3 Typical Application Circuit (Four Parts Synchronization-Work) Note 5: One part is configured as master mode, all the other 3 parts configured as slave mode. Work as master mode or slave mode specified by Configuration Register (Function register, address 00h). Master part output master clock, and all the other parts which work as slave input this master clock. Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/19/2016 2 IS31FL3737 PIN CONFIGURATION Package Pin Configuration (Top View) QFN-40 SW1 1 SW2 2 SW3 3 PGND 4 SW4 5 SW5 6 SW6 7 SW7 8 SW8 9 SW9 10 40 GND 39 IICRST 38 SDB 37 INTB 36 ADDR 35 SCL 34 SDA 33 SYNC 32 VIO 31 V.


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