Document
IS31FL3737
12×12 DOTS MATRIX LED DRIVER WITH INDIVIDUAL AUTO BREATH FUNCTION
July 2016
GENERAL DESCRIPTION
FEATURES
The IS31FL3737 is a general purpose 12×12 LEDs matrix driver with 1/12 cycle rate. The device can be programmed via an I2C compatible interface. Each LED can be dimmed individually with 8-bit PWM data which allowing 256 steps of linear dimming.
IS31FL3737 features 3 Auto Breathing Modes which are noted as ABM-1, ABM-2 and ABM-3. For each Auto Breathing Mode, there are 4 timing characters which include current rising / holding / falling / off time and 3 loop characters which include Loop-Beginning / Loop-Ending / Loop-Times. Every LED can be configured to be any Auto Breathing Mode or NoBreathing Mode individually.
Additionally each LED open and short state can be detected, IS31FL3737 store the open or short information in Open-Short Registers. The Open-Short Registers allowing MCU to read out via I2C compatible interface. Inform MCU whether there are LEDs open or short and the locations of open or short LEDs.
The IS31FL3737 operates from 2.7V to 5.5V and features a very low shutdown and operational current.
IS31FL3737 is available in QFN-40 (5mm×5mm) package. It operates from 2.7V to 5.5V over the temperature range of -40°C to +125°C.
Supply voltage range: 2.7V to 5.5V 12 current source outputs for row control 12 switch current inputs for column scan control Up to 144 LEDs (12×12) in dot matrix Programmable 12×12 (48 RGBs) matrix size with
de-ghost function 1MHz I2C-compatible interface Selectable 3 Auto Breath Modes for each dot Auto Breath Loop Features interrupt pin inform
MCU Auto Breath Loop completed Auto Breath offers 128 steps gamma current,
interrupt and state look up registers 256 steps Global Current Setting Individual on/off control Individual 256 PWM control steps Individual Auto Breath Mode select Individual open and short error detect function Cascade for synchronization of chips QFN-40 (5mm×5mm) package
APPLICATIONS
Mobile phones and other hand-held devices for LED display
Gaming device (Keyboard, Mouse etc.) LED in white goods application
TYPICAL APPLICATION CIRCUIT
VCC_5V
*Note2
19 PVCC
VIO/MCU 32 VIO
22μF/10V
0.47μF 0.1μF 0.47μF 0.1μF 0.47μF 0.1μF
26 PVCC
31 VCC
0.47μF
28 CS12
27 CS11
SW12 SW11
VIO/MCU
100kΩ 4.7kΩ 4.7kΩ
Micro Controller
100kΩ 100kΩ
16
CS2
34 15
SDA
CS1
35
37 SCL IS31FL3737
INTB
38 14
SDB
SW12
39 13
IICRST
SW11
SW10 SW9 SW8 SW7 SW6 SW5
SW4
REXT 20kΩ
33 SYNC
30 RSET
36 ADDR
40 GND
2 SW2
1 SW1
4,11 PGND
29 AGND
SW3 SW2 SW1
CS1 CS2 CS3 CS4 CS5 CS6 CS7 CS8 CS9 CS10 CS11 CS12
L K J I H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12
Figure 1 Typical Application Circuit (12×12)
Note 1: For the mobile applications the IC should be placed far away from the mobile antenna in order to prevent the EMI.
Note 2: Electrolytic/Tantalum Capacitor may considerable for high current application to avoid audible noise interference.
Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/19/2016
1
IS31FL3737
TYPICAL APPLICATION CIRCUIT (CONTINUED)
*Note4
VCC_5V
19 PVCC
VIO/MCU 32 VIO
22μF/10V
0.47μF 0.1μF 0.47μF 0.1μF 0.47μF 0.1μF
26 PVCC
31 VCC
0.47μF
28 CS12
27 CS11
SW12 SW11
VIO/MCU
SW10
100kΩ 4.7kΩ 4.7kΩ
Micro Controller
100kΩ 100kΩ
16
CS2
34 15
SDA
CS1
35
37 SCL IS31FL3737
INTB
38 14
SDB SW12
39 13
IICRST
SW11
SW9 SW8 SW7 SW6 SW5
SW4
REXT 20kΩ
33 SYNC
30 RSET
36 ADDR
40 GND
2 SW2
1 SW1
4,11 PGND
29 AGND
SW3 SW2 SW1
CS1 CS2 CS3 CS4 CS5 CS6 CS7 CS8 CS9 CS10 CS11 CS12
L K J I H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12
Figure 2 Typical Application Circuit (RGB) Note 3: For the mobile applications the IC should be placed far away from the mobile antenna in order to prevent the EMI. Note 4: Electrolytic/Tantalum Capacitor may considerable for high current application to avoid audible noise interference.
Micro Controller
ADDR VIO
100kΩ 1kΩ 1kΩ
SDA SCL INTB SDB
SDA
SCL
INTB
SDB
IICRST
100kΩ 100kΩ
IICRST
SDA SCL
SDB IICRST
SYNC Master
VBattery
ADDR
SDA
ADDR
SCL ADDR
SDA SCL INTB SDB IICRST
SDA SCL
SDB IICRST
SYNC Slave 1
SDA SCL INTB SDB IICRST
SDA SCL
SDB IICRST
SYNC
Slave 2
SDA SCL INTB SDB IICRST
SYNC
Slave 3
Figure 3 Typical Application Circuit (Four Parts Synchronization-Work)
Note 5: One part is configured as master mode, all the other 3 parts configured as slave mode. Work as master mode or slave mode specified by Configuration Register (Function register, address 00h). Master part output master clock, and all the other parts which work as slave input this master clock.
Integrated Silicon Solution, Inc. – www.issi.com Rev. A, 07/19/2016
2
IS31FL3737
PIN CONFIGURATION
Package
Pin Configuration (Top View)
QFN-40
SW1 1 SW2 2 SW3 3 PGND 4 SW4 5 SW5 6 SW6 7 SW7 8 SW8 9 SW9 10
40 GND 39 IICRST 38 SDB 37 INTB 36 ADDR 35 SCL 34 SDA 33 SYNC 32 VIO 31 V.