MAAM-011275-DIE Datasheet: Wideband Distributed Amplifier





MAAM-011275-DIE Wideband Distributed Amplifier Datasheet

Part Number MAAM-011275-DIE
Description Wideband Distributed Amplifier
Manufacture MA-COM
Total Page 10 Pages
PDF Download Download MAAM-011275-DIE Datasheet PDF

Features: MAAM-011275-DIE Wideband Distributed Amp lifier 30 kHz - 40 GHz Features  Wid e Frequency Range: 30 kHz - 40 GHz  15 dB Gain  3 - 8 V DC, 200 mA  2 2 dBm P1dB @ 22 GHz  Integrated Powe r Detector with a Detector Reference Vo ltage Generator  50 Ω Input and Out put Match  RoHS* Compliant  Die S ize: 2.3 x 1.0 x 0.05 mm Description MA AM-011275-DIE is an easy-to-use, wideba nd amplifier that operates from 30 kHz to 40 GHz. The amplifier provides 15 dB gain, 22 dBm output power and 5.3 dB n oise figure. It is matched to 50 Ω wit h typical return loss better than 13 dB . MAAM-011275-DIE is suitable for a wid e range of applications in instrumentat ion and communication systems. Orderin g Information MAAM-011275-DIE Die in Gel Pack Functional Schematic1 12 11 10 9 14 13 Rev. V2 8 7 6 5 15 1 2 B ackside Die 3 GND 1. Image not to scale . 4 16 Pad Configuration2 Pad # 1,3, 5,7,14, 15,16 2 4 6 8 9 10 11 12 13 Pa d Name GND RFIN VG1 RFOUT/VDD DETOUT DETREF DETBIAS VDD VDAUX VG2 Description Gr.

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MAAM-011275-DIE
Wideband Distributed Amplifier
30 kHz - 40 GHz
Features
Wide Frequency Range: 30 kHz - 40 GHz
15 dB Gain
3 - 8 V DC, 200 mA
22 dBm P1dB @ 22 GHz
Integrated Power Detector with a Detector
Reference Voltage Generator
50 Ω Input and Output Match
RoHS* Compliant
Die Size: 2.3 x 1.0 x 0.05 mm
Description
MAAM-011275-DIE is an easy-to-use, wideband
amplifier that operates from 30 kHz to 40 GHz. The
amplifier provides 15 dB gain, 22 dBm output power
and 5.3 dB noise figure. It is matched to 50 Ω with
typical return loss better than 13 dB.
MAAM-011275-DIE is suitable for a wide range of
applications in instrumentation and communication
systems.
Ordering Information
MAAM-011275-DIE
Die in Gel Pack
Functional Schematic1
12 11
10 9
14
13
Rev. V2
8
7
6
5
15
1
2 Backside Die
3 GND
1. Image not to scale.
4 16
Pad Configuration2
Pad #
1,3,5,7,14,
15,16
2
4
6
8
9
10
11
12
13
Pad Name
GND
RFIN
VG1
RFOUT/VDD
DETOUT
DETREF
DETBIAS
VDD
VDAUX
VG2
Description
Ground
RF Input
Gate Voltage 1
RF Output
Output Detector
Reference Detector
Detector Bias
Drain Voltage
Auxiliary Drain Voltage
Gate Voltage 2
2. Backside of die must be connected to RF, DC and thermal
ground.
* Restrictions on Hazardous Substances, compliant to current RoHS EU directive.
1
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
DC-0018857

                    
        






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