HIGH-PERFORMANCE IMPACT-X PAL CIRCUITS
TIBPAL20L8-5C, TIBPAL20R4-5C, TIBPAL20R6-5C, TIBPAL20R8-5C TIBPAL20L8-7M, TIBPAL20R4-7M, TIBPAL20R6-7M, TIBPAL20R8-7M
HI...
Description
TIBPAL20L8-5C, TIBPAL20R4-5C, TIBPAL20R6-5C, TIBPAL20R8-5C TIBPAL20L8-7M, TIBPAL20R4-7M, TIBPAL20R6-7M, TIBPAL20R8-7M
HIGH-PERFORMANCE IMPACT-X ™ PAL® CIRCUITS SRPS010F – D3353, OCTOBER 1989 – REVISED SEPTEMBER 1992
High-Performance Operation:
fmax (no feedback) TIBPAL20R’ -5C Series . . . 125 MHz Min TIBPAL20R’ -7M Series . . . 100 MHz Min
fmax (internal feedback) TIBPAL20R’ -5C Series . . . 125 MHz Min TIBPAL20R’ -7M Series . . . 100 MHz Min
fmax (external feedback) TIBPAL20R’ -5C Series . . . 117 MHz Min TIBPAL20R’ -7M Series . . . 74 MHz Min
Propagation Delay TIBPAL20L8-5C Series . . . 5 ns Max TIBPAL20L8-7M Series . . . 7 ns Max TIBPAL20R’ -5C Series (CLK-to-Q) . . . 4 ns Max TIBPAL20R’ -7M Series (CLK-to-Q) . . . 6.5 ns Max
Functionally Equivalent, but Faster Than,
Existing 24-Pin PLDs
Preload Capability on Output Registers
Simplifies Testing
Power-Up Clear on Registered Devices (All
Register Outputs are Set Low, but Voltage Levels at the Output Pins Go High)
Package Options Include Both Plastic and
Ceramic Chip Carriers in Addition to Plastic and Ceramic DIPs
Security Fuse Prevents Duplication
DEVICE
I 3-STATE INPUTS O OUTPUTS
PAL20L8 PAL20R4 PAL20R6 PAL20R8
14 12 12 12
2 0 0 0
REGISTERED Q OUTPUTS
0 4 (3-state buffers) 6 (3-state buffers) 8 (3-state buffers)
I/O PORT
S
6
4
2
0
description
TIBPAL20L8’ C SUFFIX . . . JT OR NT PACKAGE
M SUFFIX . . . JT PACKAGE
(TOP VIEW)
I I I I I I I I I I I GND
1 2 3 4 5 6 7 8 9 10 11 12
24 VCC 23 I 22 O 21 I/O...
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