Document
TIBPAL20L8-5C, TIBPAL20R4-5C, TIBPAL20R6-5C, TIBPAL20R8-5C TIBPAL20L8-7M, TIBPAL20R4-7M, TIBPAL20R6-7M, TIBPAL20R8-7M
HIGH-PERFORMANCE IMPACT-X ™ PAL® CIRCUITS SRPS010F – D3353, OCTOBER 1989 – REVISED SEPTEMBER 1992
• High-Performance Operation:
fmax (no feedback) TIBPAL20R’ -5C Series . . . 125 MHz Min TIBPAL20R’ -7M Series . . . 100 MHz Min
fmax (internal feedback) TIBPAL20R’ -5C Series . . . 125 MHz Min TIBPAL20R’ -7M Series . . . 100 MHz Min
fmax (external feedback) TIBPAL20R’ -5C Series . . . 117 MHz Min TIBPAL20R’ -7M Series . . . 74 MHz Min
Propagation Delay TIBPAL20L8-5C Series . . . 5 ns Max TIBPAL20L8-7M Series . . . 7 ns Max TIBPAL20R’ -5C Series (CLK-to-Q) . . . 4 ns Max TIBPAL20R’ -7M Series (CLK-to-Q) . . . 6.5 ns Max
• Functionally Equivalent, but Faster Than,
Existing 24-Pin PLDs
• Preload Capability on Output Registers
Simplifies Testing
• Power-Up Clear on Registered Devices (All
Register Outputs are Set Low, but Voltage Levels at the Output Pins Go High)
• Package Options Include Both Plastic and
Ceramic Chip Carriers in Addition to Plastic and Ceramic DIPs
• Security Fuse Prevents Duplication
DEVICE
I 3-STATE INPUTS O OUTPUTS
PAL20L8 PAL20R4 PAL20R6 PAL20R8
14 12 12 12
2 0 0 0
REGISTERED Q OUTPUTS
0 4 (3-state buffers) 6 (3-state buffers) 8 (3-state buffers)
I/O PORT
S
6
4
2
0
description
TIBPAL20L8’ C SUFFIX . . . JT OR NT PACKAGE
M SUFFIX . . . JT PACKAGE
(TOP VIEW)
I I I I I I I I I I I GND
1 2 3 4 5 6 7 8 9 10 11 12
24 VCC 23 I 22 O 21 I/O 20 I/O 19 I/O 18 I/O 17 I/O 16 I/O 15 O 14 I 13 I
TIBPAL20L8’ C SUFFIX . . . FN PACKAGE M SUFFIX . . . FK PACKAGE
(TOP VIEW)
II II GND I NC NC I VCC II OO
4 3 2 1 28 27 26
I5
25 I/O
I6
24 I/O
I7
23 I/O
NC 8
22 NC
I9
21 I/O
I 10
20 I/O
I 11
19 I/O
12 13 14 15 16 17 18
NC – No internal connection
Pin assignments in operating mode
These programmable array logic devices feature high speed and functional equivalency when compared with currently available devices. These IMPACT-X™ circuits combine the latest Advanced Low-Power Schottky technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically results in a more compact circuit board.
The TIBPAL20’ C series is characterized from 0°C to 75°C. The TIBPAL20’ M series is characterized for operation over the full military temperature range of –55°C to 125°C.
These devices are covered by U.S. Patent 4,410,987. IMPACT-X is a trademark of Texas Instruments Incorporated. PAL is a registered trademark of Advanced Micro Devices Inc.
This document contains information on products in more than one phase of development. The status of each device is indicated on the page(s) specifying its electrical characteristics.
Copyright © 1992, Texas Instruments Incorporated
•POST OFFICE BOX 655303 DALLAS, TEXAS 75265
1
TIBPAL20R4-5C, TIBPAL20R6-5C, TIBPAL20R8-5C TIBPAL20R4-7M, TIBPAL20R6-7M, TIBPAL20R8-7M HIGH-PERFORMANCE IMPACT-X ™ PAL® CIRCUITS
SRPS010F – D3353, OCTOBER 1989 – REVISED SEPTEMBER 1992
TIBPAL20R4’ C SUFFIX . . . JT OR NT PACKAGE
M SUFFIX . . . JT PACKAGE
(TOP VIEW)
TIBPAL20R4’ C SUFFIX . . . FN PACKAGE M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I I CLK NC VCC I I/O
CLK I I I I I I I I I I
GND
1 2 3 4 5 6 7 8 9 10 11 12
24 VCC 23 I 22 I/O 21 I/O 20 Q 19 Q 18 Q 17 Q 16 I/O 15 I/O 14 I 13 OE
4 3 2 1 28 27 26
I5
25 I/O
I6
24 Q
I7
23 Q
NC 8
22 NC
I9
21 Q
I 10
20 Q
I 11
19 I/O
12 13 14 15 16 17 18
I I GND NC OE I I/O
TIBPAL20R6’ C SUFFIX . . . JT OR NT PACKAGE
M SUFFIX . . . JT PACKAGE
(TOP VIEW)
CLK I I I I I I I I I I
GND
1 2 3 4 5 6 7 8 9 10 11 12
24 VCC 23 I 22 I/O 21 Q 20 Q 19 Q 18 Q 17 Q 16 Q 15 I/O 14 I 13 OE
TIBPAL20R6’ C SUFFIX . . . FN PACKAGE M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I I CLK NC VCC I I/O
4 3 2 1 28 27 26
I5
25 Q
I6
24 Q
I7
23 Q
NC 8
22 NC
I9
21 Q
I 10
20 Q
I 11
19 Q
12 13 14 15 16 17 18
I I GND NC OE I I/O
TIBPAL20R8’ C SUFFIX . . . JT OR NT PACKAGE
M SUFFIX . . . JT PACKAGE
(TOP VIEW)
CLK I I I I I I I I I I
GND
1 2 3 4 5 6 7 8 9 10 11 12
24 VCC 23 I 22 Q 21 Q 20 Q 19 Q 18 Q 17 Q 16 Q 15 Q 14 I 13 OE
Pin assignments in operating mode
TIBPAL20R8’ C SUFFIX . . . FN PACKAGE M SUFFIX . . . FK PACKAGE
(TOP VIEW)
I I CLK NC VCC I Q
4 3 2 1 28 27 26
I5
25 Q
I6
24 Q
I7
23 Q
NC 8
22 NC
I9
21 Q
I 10
20 Q
I 11
19 Q
12 13 14 15 16 17 18
I I GND NC OE I Q
NC – No internal connection
•2 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
TIBPAL20L8-5C, TIBPAL20R4-5C TIBPAL20L8-7M, TIBPAL20R4-7M HIGH-PERFORMANCE IMPACT-X ™ PAL® CIRCUITS
SRPS010F – D3353, OCTOBER 1989 – REVISED SEPTEMBER 1992
functional block diagrams (positive logic)
TIBPAL20L8’
& 40 X 64 7
EN ≥ 1
O
14 I
20 x 20
6 20
7 7 7 7 7 7 7
O I/O I/O I/O I/O I/O I/O
6
OE CLK
TIBPAL20R4’
&8 40 X 64
8
≥1
EN .