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TL75LP10Y Dataheets PDF



Part Number TL75LP10Y
Manufacturers Texas Instruments
Logo Texas Instruments
Description Low-Dropout Voltage Regulator
Datasheet TL75LP10Y DatasheetTL75LP10Y Datasheet (PDF)

ą • Very Low-Dropout Voltage . . . Less Than 400 mV at 300 mA • Standby Mode Reduces Current to a Maximum of 150 µA • Output Regulated to Within ± 2% Over Full Temperature Range • Packaged in Thin Shrink Small-Outline Package • Only 10-µF Load Capacitor Required to Maintain Regulation at IO = 300 mA description The TL75LPxxQ devices are low-dropout voltage regulators specifically targeted for use in portable applications. These devices generate fixed output voltages at loads of up to 300 mA with.

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ą • Very Low-Dropout Voltage . . . Less Than 400 mV at 300 mA • Standby Mode Reduces Current to a Maximum of 150 µA • Output Regulated to Within ± 2% Over Full Temperature Range • Packaged in Thin Shrink Small-Outline Package • Only 10-µF Load Capacitor Required to Maintain Regulation at IO = 300 mA description The TL75LPxxQ devices are low-dropout voltage regulators specifically targeted for use in portable applications. These devices generate fixed output voltages at loads of up to 300 mA with only 400-mV dropout over the full temperature range. TL75LPxxQ SERIES TL75LPxxY SERIES LOWĆDROPOUT VOLTAGE REGULATORS SLVS073A − SEPTEMBER 1992 − REVISED AUGUST 1995 PW PACKAGE (TOP VIEW) GND/HEAT SINK GND/HEAT SINK GND/HEAT SINK NC NC ENABLE NC INPUT INPUT INPUT 1 2 3 4 5 6 7 8 9 10 20 NC 19 NC 18 NC 17 NC 16 NC 15 OUTPUT 14 OUTPUT 13 NC 12 NC 11 NC GND/HEAT SINK − These terminals have an internal connection to ground and must be grounded. NC − No internal connection † The PW package is only available in left-end taped and reeled (order device TL75LPxxQPWLE). Low-dropout voltage regulators are commonly used in battery-powered systems such as analog typical application schematic and digital cellular phones. The TL75LPxx family of regulators feature a TTL/CMOS-compatible enable terminal, which can be used to switch the device into standby mode. This feature reduces power consumption when the instrument is not VBAT 0.1 µF INPUT OUTPUT TL75LPxxQ GND/ ENABLE HEAT SINK VO ± 2% at 300 mA CO = 10 µF active. Less that 150 µA is required when the unit is disabled. A concern in many new designs is conservation of board space and overall reduction in equipment 2V DISABLE ENABLE size. The thin shrink small-outline package (TSSOP) minimizes board area and reduces component height. This package has a maximum height of less than 1.1 mm (compared to the 1.75 mm of a standard 8-pin SO package) and dimensions of only 6.5 mm by 4.4 mm. All low-dropout regulators require an external capacitor at the output to maintain regulation and stability. To further reduce board area and cost, the TL75LPxx devices are designed to require a minimum capacitor of only 10 µF. This is 1/10 the typical value used by many other low-dropout regulators. To simplify the task of choosing a suitable capacitor, TI has included in this datasheet a list of recommended capacitors for use with these devices. The TL75LPxxQ devices are characterized for operation over TJ = −40°C to 125°C. AVAILABLE OPTIONS VO PACKAGED DEVICES CHIP FORM TJ TSSOP MIN TYP MAX (PW) (Y) 4.75 4.85 4.95 TL75LP48QPWLE TL75LP48Y 4.9 5 5.1 TL75LP05QPWLE TL75LP05Y −40°C to 125°C 7.84 8 8.16 TL75LP08QPWLE TL75LP08Y 9.8 10 10.2 TL75LP10QPWLE TL75LP10Y 11.76 12 12.24 TL75LP12QPWLE TL75LP12Y The PW package is available only in tape and reel. Chip forms are tested at 25°C. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright  1995, Texas Instruments Incorporated •POST OFFICE BOX 655303 DALLAS, TEXAS 75265 •POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 3−1 TL75LPxxQ SERIES TL75LPxxY SERIES LOWĆDROPOUT VOLTAGE REGULATORS SLVS073A − SEPTEMBER 1992 − REVISED AUGUST 1995 functional block diagram INPUT ENABLE Enable 28 V Bandgap Current Limiting − + Overvoltage/ Thermal Shutdown OUTPUT ą GND/HEAT SINK TL75LPxxY chip information This chip, when properly assembled, displays characteristics similar to the TL75LPxx. Thermal compression or ultrasonic bonding can be used on the doped aluminum bonding pads. The chip can be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS (5) (6) (4) 92 (3) (1) (2) 123 (1) INPUT TL75LPxxY (5)OUTPUT (4)OUTPUT SENSE (3) (6) (2) ENABLE POWER SIGNAL GND GND CHIP THICKNESS: 11 MILS TYPICAL BONDING PADS: 7 X 7 MILS MINIMUM TJ max = 150°C TOLERANCES ARE ± 10%. ALL DIMENSIONS ARE IN MILS. NOTE A. NOTE: SIGNAL GND and POWER GND must be tied together as close to device as possible. OUTPUT and OUTPUT SENSE should be tied together. 3−2 •POST OFFICE BOX 655303 DALLAS, TEXAS 75265 •POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443 ą TL75LPxxQ SERIES TL75LPxxY SERIES LOWĆDROPOUT VOLTAGE REGULATORS SLVS073A − SEPTEMBER 1992 − REVISED AUGUST 1995 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage, VCC, (See Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 V Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400 mA Operating virtual junction temperature range, TJ . . . . . . . . . . . . . . . . . . .


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