TM4SK64KPN Datasheet: SYNCHRONOUS DYNAMIC RAM MODULES





TM4SK64KPN Datasheet PDF

Part Number TM4SK64KPN
Description SYNCHRONOUS DYNAMIC RAM MODULES
Manufacture etcTI
Total Page 15 Pages
PDF Download Download TM4SK64KPN Datasheet PDF

Features: TM4SK64KPN 4ā194ā304 BY 64ĆBIT TM8SK6 4KPN 8ā388ā608 BY 64ĆBIT SYNCHRONOUS DYNAMIC RAM MODULES Ċ SODIMM SMMS709 − APRIL 1998 D Organization: − TM4 SK64KPN . . . 4 194 304 x 64 Bits − T M8SK64KPN . . . 8 388 608 x 64 Bits D S ingle 3.3-V Power Supply (±10% Toleran ce) D Designed for 66-MHz 4-Clock Syste ms D JEDEC 144-Pin Small-Outline Dual-I n-Line Memory Module (SODIMM) Without B uffer for Use With Socket D TM4SK64KPN — Uses Four 64M-Bit Synchronous Dynam ic RAMs (SDRAMs) (4M × 16-Bit) in Plas tic Thin Small-Outline Packages (TSOPs) D TM8SK64KPN — Uses Eight 64M-Bit SD RAMs (4M × 16-Bit) in Plastic TSOPs D Byte-Read/Write Capability D Performanc e Ranges: D High-Speed, Low-Noise, Low -Voltage TTL (LVTTL) Interface D Read L atencies 2 and 3 Supported D Support Bu rst-Interleave and Burst-Interrupt Oper ations D Burst Length Programmable to 1 , 2, 4, and 8 D Four Banks for On-Chip Interleaving (Gapless Access) D Ambient Temperature Range 0°C to 70°C D Gold-Plated Contacts D Pipeline Architecture D Ser.

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TM4SK64KPN datasheet
TM4SK64KPN 4ā194ā304 BY 64ĆBIT
TM8SK64KPN 8ā388ā608 BY 64ĆBIT
SYNCHRONOUS DYNAMIC RAM MODULES Ċ SODIMM
SMMS709 − APRIL 1998
D Organization:
− TM4SK64KPN . . . 4 194 304 x 64 Bits
− TM8SK64KPN . . . 8 388 608 x 64 Bits
D Single 3.3-V Power Supply
(±10% Tolerance)
D Designed for 66-MHz 4-Clock Systems
D JEDEC 144-Pin Small-Outline Dual-In-Line
Memory Module (SODIMM) Without Buffer
for Use With Socket
D TM4SK64KPN — Uses Four 64M-Bit
Synchronous Dynamic RAMs (SDRAMs)
(4M × 16-Bit) in Plastic Thin Small-Outline
Packages (TSOPs)
D TM8SK64KPN — Uses Eight 64M-Bit
SDRAMs (4M × 16-Bit) in Plastic TSOPs
D Byte-Read/Write Capability
D Performance Ranges:
D High-Speed, Low-Noise, Low-Voltage TTL
(LVTTL) Interface
D Read Latencies 2 and 3 Supported
D Support Burst-Interleave and
Burst-Interrupt Operations
D Burst Length Programmable to 1, 2, 4, and 8
D Four Banks for On-Chip Interleaving
(Gapless Access)
D Ambient Temperature Range
0°C to 70°C
D Gold-Plated Contacts
D Pipeline Architecture
D Serial Presence Detect (SPD) Using
EEPROM
’xSK64KPN − 10
SYNCHRONOUS
CLOCK CYCLE
TIME
tCK3
tCK2
10 ns
15 ns
ACCESS TIME
CLOCK TO
OUTPUT
tAC3
tAC2
7 ns 7 ns
REFRESH
INTERVAL
tREF
64 ms
description
The TM4SK64KPN is a 32M-byte, 144-pin small-outline dual-in-line memory module (SODIMM). The SODIMM
is composed of four TMS664164DGE, 4 194 304 x 16-bit SDRAMs, each in a 400-mil, 54-pin plastic thin
small-outline package (TSOP) mounted on a substrate with decoupling capacitors. See the TMS664164 data
sheet (literature number SMOS695).
The TM8SK64KPN is a 64M-byte, 144-pin SODIMM. The SODIMM is composed of eight TMS664164DGE,
4 194 304 x 16-bit SDRAMs, each in a 400-mil, 54-pin plastic TSOP mounted on a substrate with decoupling
capacitors. See the TMS664164 data sheet (literature number SMOS695).
operation
The TM4SK64KPN operates as four TMS664164DGE devices that are connected as shown in the
TM4SK64KPN functional block diagram. The TM8SK64KPN operates as eight TMS664164DGE devices
connected as shown in the TM8SK64KPN functional block diagram.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
Copyright 1998, Texas Instruments Incorporated
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
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