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ULC0402FC15C Dataheets PDF



Part Number ULC0402FC15C
Manufacturers Protek Devices
Logo Protek Devices
Description 200W LOW CAPACITANCE UNBUMPED FLIP CHIP TVS ARRAY
Datasheet ULC0402FC15C DatasheetULC0402FC15C Datasheet (PDF)

05152 Only One Name Means ProTek’Tion™ 200W LOW CAPACITANCE UNBUMPED FLIP CHIP TVS ARRAY ULC0402FC3.3C - ULC0402FC36C DESCRIPTION The ULC0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally sui.

  ULC0402FC15C   ULC0402FC15C


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05152 Only One Name Means ProTek’Tion™ 200W LOW CAPACITANCE UNBUMPED FLIP CHIP TVS ARRAY ULC0402FC3.3C - ULC0402FC36C DESCRIPTION The ULC0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards. This low capacitance series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 200 Watts per line for an 8/20µs waveform. In addition, the ULC0402FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance. FEATURES • Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV • Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns • ESD Protection > 25 kilovolts • Available in Voltages Ranging from 3.3V to 36V • 200 Watts Peak Pulse Power per Line (tp = 8/20µs) • Bidirectional and Monolithic Structure • Low Clamping Voltage • Low Capacitance • Protection for 1 Line • RoHS Compliant • REACH Compliant MECHANICAL CHARACTERISTICS • Standard EIA Chip Size: 0402 • Approximate Weight: 0.73 milligrams • Lead-Free Plating • Flammability Rating UL 94V-0 • 8mm Plastic Tape per EIA Standard 481 APPLICATIONS • SMART Phones • Portable Electronics • SMART Cards PIN CONFIGURATION 05152.R11 10/12 Page 1 ISO 9001: 2015 CERTIFIED 05152 Only One Name Means ProTek’Tion™ TYPICAL DEVICE CHARACTERISTICS ULC0402FC3.3C - ULC0402FC36C MAXIMUM RATINGS @ 25°C Unless Otherwise Specified PARAMETER SYMBOL Peak Pulse Power (tp = 8/20µs) - See Figure 1 Operating Temperature Storage Temperature PPP TA TSTG VALUE 200 -55 to 150 -55 to 150 UNITS Watts °C °C ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified PART NUMBER (Note 1) ULC0402FC3.3C RATED STAND-OFF VOLTAGE VVOWLMTS 3.3 MINIMUM BREAKDOWN VOLTAGE @ 1mA VVO(LBRT)S 4.0 MAXIMUM CLAMPING VOLTAGE (Fig. 2) @VIOPVL=CT1SA 7.0 MAXIMUM CLAMPING VOLTAGE (Fig. 2) @ 8/20µS VC @ IPP 12.5V @ 16A MAXIMUM LEAKAGE CURRENT (Note 2) @µVIDAWM 75* ULC0402FC05C 5.9 6.0 11.0 13.0V @ 15A 10** ULC0402FC08C 8.0 8.5 13.2 18.0V @ 11A 1 ULC0402FC12C 12.0 13.3 19.8 26.9V @ 7.4A 1 ULC0402FC15C 15.0 16.7 25.4 34.5V @ 5.8A 1 ULC0402FC24C 24.0 26.7 37.2 50.6V @ 4A 1 ULC0402FC36C 36.0 40.0 70.0 80.0V @ 2.5A 1 NOTES 1. All devices are bidirectional. Electrical characteristics apply in both directions. 2. *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current < 500nA @ 3.3V. TYPICAL CAPACITANCE @0V, 1MHz C pF 70 35 32 30 25 20 18 05152.R11 10/12 Page 2 ISO 9001: 2015 CERTIFIED 05152 Only One Name Means ProTek’Tion™ TYPICAL DEVICE CHARACTERISTICS ULC0402FC3.3C - ULC0402FC36C 10,000 FIGURE 1 PEAK PULSE POWER VS PULSE TIME PPP - Peak Pulse Power - Watts 1,000 100 200W, 8/20µs Waveform 10 0.1 1 10 100 td - Pulse Duration - µs 1,000 10,000 120 100 80 60 40 20 0 0 FIGURE 2 PULSE WAVE FORM tf Peak Value IPP e-t TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs td = t/(IPP/2) 5 10 15 20 25 t - Time - µs 30 % Of Rated Power FIGURE 3 POWER DERATING CURVE 100 Peak Pulse Power 8/20µs 80 60 40 20 Average Power 0 0 25 50 75 100 125 150 TA - Ambient Temperature - °C IPP - Peak Pulse Current - % of IPP 05152.R11 10/12 Page 3 ISO 9001: 2015 CERTIFIED 05152 Only One Name Means ProTek’Tion™ TYPICAL DEVICE CHARACTERISTICS ULC0402FC3.3C - ULC0402FC36C FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR ULC0402FC05C 35 25 5 Volts per Division 15 5 -5 ESD Test Pulse - 25 kilovolt, 1/30ns (Waveshape) VC - Clamping Voltage - Volts FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT ULC0402FC05C 12 8 4 0 0 5 10 15 IPP - Peak Pulse Current - Amps 20 05152.R11 10/12 Page 4 ISO 9001: 2015 CERTIFIED 05152 Only One Name Means ProTek’Tion™ SOLDER REFLOW INFORMATION ULC0402FC3.3C - ULC0402FC36C PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER VALUE Pad Size on PCB 0.275mm Pad Shape Round Pad Definition Non-Solder Mask Defined Pads Solder Mask Opening 0.325mm Round Solder Stencil Thickness 0.150mm Solder Stencil Aperture Opening (Laser cut, 5% tapered walls) 0.330mm Round Solder Paste Type No Clean Pad Protective Finish OSP (Entek Cu Plus 106A) Tolerance - Edge To Corner Ball ±50µm Solder Ball Side Coplanarity (Only applies to bumped devices) ±20µm Maximum Dwell Time Above Liquidous (183°C) 60 seconds Soldering Maximum Temperature 270°C REQUIREMENTS Temperature: Preheat timTeP for Lead-Free (Sn/Ag/Cu): 260-270°C and temperature depends on solder paste and flux activa- tion temp.


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