Document
05152
Only One Name Means ProTek’Tion™
200W LOW CAPACITANCE UNBUMPED FLIP CHIP TVS ARRAY
ULC0402FC3.3C - ULC0402FC36C
DESCRIPTION
The ULC0402FCxxC Series Flip Chips employ advanced silicon P/N junction technology for unmatched board-level transient voltage protection against Electrostatic Discharge (ESD) and Electrical Fast Transients (EFT). Developed specifically for high-density circuit protection, this series meets the IEC 61000-4-2 and 61000-4-4 requirements. These devices are ideally suited for handheld devices, PCMCIA and SMART cards. This low capacitance series provides ESD protection greater than 25 kilovolts with a peak pulse power dissipation of 200 Watts per line for an 8/20µs waveform. In addition, the ULC0402FCxxC series features superior clamping performance, low leakage current characteristics and a response time of less than a nanosecond. Their low inductance virtually eliminates overshoot voltage due to package inductance.
FEATURES
• Compatible with IEC 61000-4-2 (ESD): Air 15kV, Contact 8kV • Compatible with IEC 61000-4-4 (EFT): 40A, 5/50ns • ESD Protection > 25 kilovolts • Available in Voltages Ranging from 3.3V to 36V • 200 Watts Peak Pulse Power per Line (tp = 8/20µs) • Bidirectional and Monolithic Structure • Low Clamping Voltage • Low Capacitance • Protection for 1 Line • RoHS Compliant • REACH Compliant
MECHANICAL CHARACTERISTICS
• Standard EIA Chip Size: 0402 • Approximate Weight: 0.73 milligrams • Lead-Free Plating • Flammability Rating UL 94V-0 • 8mm Plastic Tape per EIA Standard 481
APPLICATIONS
• SMART Phones • Portable Electronics • SMART Cards
PIN CONFIGURATION
05152.R11 10/12
Page 1
ISO 9001: 2015 CERTIFIED
05152
Only One Name Means ProTek’Tion™
TYPICAL DEVICE CHARACTERISTICS
ULC0402FC3.3C - ULC0402FC36C
MAXIMUM RATINGS @ 25°C Unless Otherwise Specified
PARAMETER
SYMBOL
Peak Pulse Power (tp = 8/20µs) - See Figure 1 Operating Temperature Storage Temperature
PPP TA TSTG
VALUE 200
-55 to 150 -55 to 150
UNITS Watts
°C °C
ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified
PART NUMBER (Note 1) ULC0402FC3.3C
RATED STAND-OFF VOLTAGE
VVOWLMTS 3.3
MINIMUM BREAKDOWN
VOLTAGE
@ 1mA VVO(LBRT)S
4.0
MAXIMUM CLAMPING VOLTAGE
(Fig. 2) @VIOPVL=CT1SA
7.0
MAXIMUM CLAMPING VOLTAGE
(Fig. 2)
@ 8/20µS VC @ IPP 12.5V @ 16A
MAXIMUM LEAKAGE CURRENT (Note 2)
@µVIDAWM 75*
ULC0402FC05C
5.9
6.0 11.0 13.0V @ 15A 10**
ULC0402FC08C
8.0
8.5
13.2 18.0V @ 11A
1
ULC0402FC12C
12.0
13.3
19.8 26.9V @ 7.4A
1
ULC0402FC15C
15.0
16.7
25.4 34.5V @ 5.8A
1
ULC0402FC24C
24.0
26.7
37.2 50.6V @ 4A
1
ULC0402FC36C
36.0
40.0
70.0 80.0V @ 2.5A
1
NOTES 1. All devices are bidirectional. Electrical characteristics apply in both directions. 2. *Maximum leakage current < 5µA @ 2.8V. **Maximum leakage current < 500nA @ 3.3V.
TYPICAL CAPACITANCE
@0V, 1MHz C pF 70 35 32 30 25 20 18
05152.R11 10/12
Page 2
ISO 9001: 2015 CERTIFIED
05152
Only One Name Means ProTek’Tion™
TYPICAL DEVICE CHARACTERISTICS
ULC0402FC3.3C - ULC0402FC36C
10,000
FIGURE 1 PEAK PULSE POWER VS PULSE TIME
PPP - Peak Pulse Power - Watts
1,000 100
200W, 8/20µs Waveform
10 0.1
1
10 100 td - Pulse Duration - µs
1,000
10,000
120 100
80 60 40 20
0 0
FIGURE 2 PULSE WAVE FORM
tf Peak Value IPP
e-t
TEST WAVEFORM PARAMETERS tf = 8µs td = 20µs
td = t/(IPP/2)
5 10 15 20 25 t - Time - µs
30
% Of Rated Power
FIGURE 3 POWER DERATING CURVE 100
Peak Pulse Power 8/20µs
80
60
40
20
Average Power
0 0 25 50 75 100 125 150 TA - Ambient Temperature - °C
IPP - Peak Pulse Current - % of IPP
05152.R11 10/12
Page 3
ISO 9001: 2015 CERTIFIED
05152
Only One Name Means ProTek’Tion™
TYPICAL DEVICE CHARACTERISTICS
ULC0402FC3.3C - ULC0402FC36C
FIGURE 4 OVERSHOOT & CLAMPING VOLTAGE FOR ULC0402FC05C 35
25
5 Volts per Division
15
5
-5 ESD Test Pulse - 25 kilovolt, 1/30ns (Waveshape)
VC - Clamping Voltage - Volts
FIGURE 5 TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT ULC0402FC05C 12
8
4
0 0 5 10 15
IPP - Peak Pulse Current - Amps
20
05152.R11 10/12
Page 4
ISO 9001: 2015 CERTIFIED
05152
Only One Name Means ProTek’Tion™
SOLDER REFLOW INFORMATION
ULC0402FC3.3C - ULC0402FC36C
PRINTED CIRCUIT BOARD RECOMMENDATIONS PARAMETER
VALUE
Pad Size on PCB
0.275mm
Pad Shape
Round
Pad Definition
Non-Solder Mask Defined Pads
Solder Mask Opening
0.325mm Round
Solder Stencil Thickness
0.150mm
Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)
0.330mm Round
Solder Paste Type
No Clean
Pad Protective Finish
OSP (Entek Cu Plus 106A)
Tolerance - Edge To Corner Ball
±50µm
Solder Ball Side Coplanarity (Only applies to bumped devices)
±20µm
Maximum Dwell Time Above Liquidous (183°C)
60 seconds
Soldering Maximum Temperature
270°C
REQUIREMENTS
Temperature:
Preheat timTeP
for Lead-Free (Sn/Ag/Cu): 260-270°C and temperature depends on solder paste
and
flux
activa-
tion temp.