TMS320VC5504 Datasheet: DIGITAL SIGNAL PROCESSOR





TMS320VC5504 Datasheet PDF Download

Part Number TMS320VC5504
Description DIGITAL SIGNAL PROCESSOR
Manufacture etcTI
Total Page 30 Pages
PDF Download Download TMS320VC5504 Datasheet PDF

Features: TMS320VC5504 www.ti.com SPRS609B – J UNE 2009 – REVISED JANUARY 2010 TMS32 0VC5504 Fixed-Point Digital Signal Proc essor Check for Samples: TMS320VC5504 1 Fixed-Point Digital Signal Processor 1.1 TMS320VC5504 Features 1 • High-Pe rformance, Low-Power, TMS320C55x™ Fix ed-Point Digital Signal Processor – 1 6.67-, 10-ns Instruction Cycle Time – 60-, 100-MHz Clock Rate – One/Two In struction(s) Executed per Cycle – Dua l Multipliers [Up to 200 Million Multip ly-Accumulates per Second (MMACS)] – Two Arithmetic/Logic Units (ALUs) – T hree Internal Data/Operand Read Buses a nd Two Internal Data/Operand Write Buse s – Fully Software-Compatible With C5 5x Devices – Industrial Temperature D evices Available • 256 K Bytes Zero-W ait State On-Chip RAM, Composed of: – 64K Bytes of Dual-Access RAM (DARAM), 8 Blocks of 4K x 16-Bit – 192K Bytes of Single-Access RAM (SARAM), 24 Blocks of 4K x 16-Bit • 128K Bytes of Zero Wait-State On-Chip ROM (4 Blocks of 16K x 16-Bit) • 16-/8-Bit External Memory Interface (EMIF) .

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TMS320VC5504
www.ti.com
SPRS609B – JUNE 2009 – REVISED JANUARY 2010
TMS320VC5504
Fixed-Point Digital Signal Processor
Check for Samples: TMS320VC5504
1 Fixed-Point Digital Signal Processor
1.1 TMS320VC5504 Features
1
• High-Performance, Low-Power, TMS320C55x™
Fixed-Point Digital Signal Processor
– 16.67-, 10-ns Instruction Cycle Time
– 60-, 100-MHz Clock Rate
– One/Two Instruction(s) Executed per Cycle
– Dual Multipliers [Up to 200 Million
Multiply-Accumulates per Second (MMACS)]
– Two Arithmetic/Logic Units (ALUs)
– Three Internal Data/Operand Read Buses
and Two Internal Data/Operand Write Buses
– Fully Software-Compatible With C55x
Devices
– Industrial Temperature Devices Available
• 256 K Bytes Zero-Wait State On-Chip RAM,
Composed of:
– 64K Bytes of Dual-Access RAM (DARAM),
8 Blocks of 4K x 16-Bit
– 192K Bytes of Single-Access RAM (SARAM),
24 Blocks of 4K x 16-Bit
• 128K Bytes of Zero Wait-State On-Chip ROM
(4 Blocks of 16K x 16-Bit)
• 16-/8-Bit External Memory Interface (EMIF) with
Glueless Interface to:
– 8-/16-Bit NAND Flash, 1- and 4-Bit ECC
– 8-/16-Bit NOR Flash
– Asynchronous Static RAM (SRAM)
• Direct Memory Access (DMA) Controller
– Four DMA With 4 Channels Each
(16-Channels Total)
• Three 32-Bit General-Purpose Timers
– One Selectable as a Watchdog and/or GP
• Two MultiMedia Card/Secure Digital (MMC/SD)
Interface s
• Universal Asynchronous Receiver/Transmitter
(UART)
• Serial-Port Interface (SPI) With Four
Chip-Selects
• Master/Slave Inter-Integrated Circuit (I2C Bus™)
• Four Inter-IC Sound (I2S Bus™) for Data
Transport
• Device USB Port With Integrated 2.0
High-Speed PHY that Supports:
– USB 2.0 Full- and High-Speed Device
• Real-Time Clock (RTC) With Crystal Input, With
Separate Clock Domain, Separate Power
Supply
• Four Core Isolated Power Supply Domains:
Analog, RTC, CPU and Peripherals, and USB
• Four I/O Isolated Power Supply Domains: RTC
I/O, EMIF I/O, USB PHY, and DVDDIO
• Low-Power S/W Programmable Phase-Locked
Loop (PLL) Clock Generator
• On-Chip ROM Bootloader (RBL) to Boot From
NAND Flash, NOR Flash, SPI EEPROM, or I2C
EEPROM
• IEEE-1149.1 (JTAG™)
Boundary-Scan-Compatible
• Up to 26 General-Purpose I/O (GPIO) Pins
(Multiplexed With Other Device Functions)
• 196-Terminal Pb-Free Plastic BGA (Ball Grid
Array) (ZCH Suffix)
• 1.05-V Core (60 MHz), 1.8-V, 2.5-V, 2.8-V, or
3.3-V I/Os
• 1.3-V Core (100 MHz), 1.8-V, 2.5-V, 2.8-V, or
3.3-V I/Os
• Applications:
– Wireless Audio Devices (e.g., Headsets,
Microphones, Speakerphones, etc.)
– Echo Cancellation Headphones
– Portable Medical Devices
– Voice Applications
– Industrial Controls
– Fingerprint Biometrics
– Software Defined Radio
• Community Resources
TI E2E Community
TI Embedded Processors Wiki
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2009–2010, Texas Instruments Incorporated

                    
                    






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