LED. XBDAWT-00-0000-00000LCE4 Datasheet

XBDAWT-00-0000-00000LCE4 Datasheet PDF


Part

XBDAWT-00-0000-00000LCE4

Description

LED

Manufacture

CREE

Page 20 Pages
Datasheet
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XBDAWT-00-0000-00000LCE4 Datasheet
Cree® XLamp® XB-D LEDs
PRODUCT FAMILY DATA SHEET
PRODUCT DESCRIPTION
The XLamp® XB-D LED brings
next‑generation performance, price and
size to all LED lighting applications. The
XB-D’s footprint enables smaller designs
with densely packed arrays for better
light mixing and concentration.
The XB-D shares common footprint and
uniform package design across all white
and color configurations, simplifying
board and optical designs for many
LED systems. The XB-D is optimized to
dramatically lower system cost in any
illumination application, from indoor
and outdoor lighting to architectural and
transportation lighting.
FEATURES
XB-D white binned @ 85 °C; XB-D
color binned @ 25 °C
Up to 136 lm/W in cool white
(@ 85 °C, 350 mA)
Available in white, 80-minimum CRI
white, and 70-minimum CRI cool
white, royal blue, blue, green, PC
amber, amber, red-orange & red
1 A maximum drive current
Wide viewing angle: from 110° (PC
amber) to 140° (red)
Reflow solderable - JEDEC
J-STD‑020C compatible
Unlimited floor life at
≤ 30 °C/85% RH
• Electrically neutral thermal path
RoHS and REACh compliant
• UL® recognized component
(E349212)
TABLE OF CONTENTS
Characteristics........................................ 2
Flux Characteristics - White.................... 3
Flux Characteristics - Color.................... 4
Relative Spectral Power Distribution..... 6
Relative Flux vs. Junction
Temperature............................................ 7
Electrical Characteristics........................ 8
Electrical Characteristics........................ 8
Relative Flux vs. Current......................... 9
Relative Flux vs. Current......................... 9
Relative Chromaticity vs. Current......... 10
Relative Chromaticity vs.
Temperature.......................................... 11
Typical Spatial Distribution................... 11
Thermal Design..................................... 12
Reflow Soldering Characteristics......... 14
Notes..................................................... 15
Mechanical Dimensions....................... 17
Tape and Reel........................................ 19
Packaging.............................................. 20
Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and
XLamp® are registered trademarks of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC.
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300

XBDAWT-00-0000-00000LCE4 Datasheet
CHARACTERISTICS
Characteristics
Thermal resistance, junction to solder point - white, royal blue, blue
Thermal resistance, junction to solder point - green
Thermal resistance, junction to solder point - PC amber
Thermal resistance, junction to solder point - amber
Thermal resistance, junction to solder point - red-orange, red
Viewing angle (FWHM) - white
Viewing angle (FWHM) - royal blue
Viewing angle (FWHM) - blue, green
Viewing angle (FWHM) - PC amber,
Viewing angle (FWHM) - amber, red-orange, red
Temperature coefficient of voltage - white
Temperature coefficient of voltage - royal blue
Temperature coefficient of voltage - blue, green
Temperature coefficient of voltage - PC amber
Temperature coefficient of voltage - amber, red-orange, red
ESD withstand voltage (HBM per Mil-Std-883D) - white, royal blue, blue, green
ESD classification (HBM per Mil-Std-883D) - PC amber
ESD classification (HBM per Mil-Std-883D) - amber, red-orange, red
DC forward current
Reverse voltage
Forward voltage (@ 350 mA, 85 °C) - white
Forward voltage (@ 350 mA, 25 °C) - royal blue
Forward voltage (@ 350 mA, 25 °C) - blue
Forward voltage (@ 350 mA, 25 °C) - green
Forward voltage (@ 350 mA, 25 °C) - PC amber
Forward voltage (@ 350 mA, 25 °C) - amber, red-orange, red
LED junction temperature
XLAMP® XB-D LED
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
degrees
degrees
degrees
degrees
degrees
mV/°C
mV/°C
mV/°C
mV/°C
mV/°C
V
mA
V
V
V
V
V
V
V
°C
Minimum
Typical
6.5
11
8.5
7
5
115
120
135
110
140
-2.5
-2.0
-3.3
-2.4
-2
Class 3A
Class 2
2.9
2.95
3.1
3.3
3.1
2.25
Maximum
8000
1000
-5
3.5
3.5
3.7
3.9
3.4
2.6
150
Copyright © 2011-2019 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo and XLamp® are registered trademarks of Cree, Inc. UL® and
the UR logo are registered trademarks of UL LLC.
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Features Datasheet pdf CLD-DS45 REV 12 Cree® XLamp® XB-D LED s PRODUCT FAMILY DATA SHEET PRODUCT D ESCRIPTION The XLamp® XB-D LED brings next‑generation performance, price an d size to all LED lighting applications . The XB-D’s footprint enables smalle r designs with densely packed arrays fo r better light mixing and concentration . The XB-D shares common footprint and uniform package design across all white and color configurations, simplifying board and optical designs for many LED systems. The XB-D is optimized to drama tically lower system cost in any illumi nation application, from indoor and out door lighting to architectural and tran sportation lighting. FEATURES • XB- D white binned @ 85 °C; XB-D color bi nned @ 25 °C • Up to 136 lm/W in cool white (@ 85 °C, 350 mA) • A vailable in white, 80-minimum CRI white , and 70-minimum CRI cool white, royal blue, blue, green, PC amber, amber, red -orange & red • 1 A maximum drive c urrent • Wide viewing angle: from 110° (PC amber) to 140° (red) • Reflow solderable - .
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