POWER AMPLIFIER. TPA321 Datasheet

TPA321 Datasheet PDF, Equivalent


Part Number

TPA321

Description

350-mW MONO AUDIO POWER AMPLIFIER

Manufacture

etcTI

Total Page 30 Pages
PDF Download
Download TPA321 Datasheet PDF


TPA321 Datasheet
TPA321
www.ti.com
SLOS312C – JUNE 2000 – REVISED JUNE 2004
350-mW MONO AUDIO POWER AMPLIFIER WITH DIFFERENTIAL INPUTS
Fully Specified for 3.3-V and 5-V Operation
Wide Power Supply Compatibility
2.5 V – 5.5 V
Output Power for RL = 8
– 350 mW at VDD = 5 V
– 250 mW at VDD = 3.3 V
Ultralow Supply Current in Shutdown
Mode . . . 0.15 µA
Thermal and Short-Circuit Protection
Surface-Mount Packaging
– SOIC
– PowerPAD™ MSOP
D OR DGN PACKAGE
(TOP VIEW)
SHUTDOWN 1 8 VO-
BYPASS 2 7 GND
IN+ 3 6 VDD
IN- 4 5 VO+
DESCRIPTION
The TPA321 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications
where internal speakers are required. Operating with a 3.3-V supply, the TPA321 can deliver 250 mW of
continuous power into a BTL 8-load at less than 1% THD+N throughout voice band frequencies. Although this
device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular
communications. The BTL configuration eliminates the need for external coupling capacitors on the output in
most applications, which is particularly important for small battery-powered equipment. This device features a
shutdown mode for power-sensitive applications with a quiescent current of 0.15 µA during shutdown. The
TPA321 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD™ MSOP, which
reduces board space by 50% and height by 40%.
Audio
Input
RI
CI
RF
CB
0.1 µF
From System Control
4 IN -
3 IN+
2 BYPASS
VDD/2
-
+
-
+
1 SHUTDOWN
Bias
Control
VDD 6
VO+ 5
VDD
CS
1 µF
VO- 8
7
GND
350 mW
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2004, Texas Instruments Incorporated

TPA321 Datasheet
TPA321
SLOS312C – JUNE 2000 – REVISED JUNE 2004
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated
circuits be handled with appropriate precautions. Failure to observe proper handling and installation
procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision
integrated circuits may be more susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
TA
–40°C to 85°C
AVAILABLE OPTIONS
PACKAGED DEVICES
SMALL OUTLINE(1) (D)
MSOP(1) (DGN)
TPA321D
TPA321DGN
MSOP
SYMBOLIZATION
AJB
(1) The D and DGN packages are available taped and reeled. To order a taped and reeled part, add the
suffix R to the part number (e.g., TPA321DR).
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)(1)
VDD Supply voltage
VI Input voltage
Continuous total power dissipation
TA Operating free-air temperature range
TJ Operating junction temperature range
Tstg Storage temperature range
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds
UNIT
6V
–0.3 V to VDD +0.3 V
Internally limited (see Dissipation Rating Table)
–40°C to 85°C
–40°C to 150°C
–65°C to 150°C
260°C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
PACKAGE
D
DGN
DISSIPATION RATING TABLE
TA 25°C
725 mW
2.14 W(1)
DERATING FACTOR
5.8 mW/°C
17.1 mW/°C
TA = 70°C
464 mW
1.37 W
TA = 85°C
377 mW
1.11 W
(1) See the Texas Instruments document, PowerPAD Thermally Enhanced Package Application Report
(literature number SLMA002), for more information on the PowerPAD™ package. The thermal data
was measured on a PCB layout based on the information in the section entitled Texas Instruments
Recommended Board for PowerPAD on page 33 of the before mentioned document.
RECOMMENDED OPERATING CONDITIONS
VDD Supply voltage
VIH High-level voltage
SHUTDOWN
VIL Low-level voltage
SHUTDOWN
TA Operating free-air temperature
MIN
2.5
0.9 VDD
–40
MAX
5.5
0.1 VDD
85
UNIT
V
V
V
°C
2


Features Datasheet pdf TPA321 www.ti.com SLOS312C – JUNE 20 00 – REVISED JUNE 2004 350-mW MONO A UDIO POWER AMPLIFIER WITH DIFFERENTIAL INPUTS • Fully Specified for 3.3-V a nd 5-V Operation • Wide Power Supply Compatibility 2.5 V – 5.5 V • Outpu t Power for RL = 8 Ω – 350 mW at VD D = 5 V – 250 mW at VDD = 3.3 V • U ltralow Supply Current in Shutdown Mode . . . 0.15 µA • Thermal and Short-C ircuit Protection • Surface-Mount Pac kaging – SOIC – PowerPAD™ MSOP D OR DGN PACKAGE (TOP VIEW) SHUTDOWN 1 8 VOBYPASS 2 7 GND IN+ 3 6 VDD IN- 4 5 V O+ DESCRIPTION The TPA321 is a bridge- tied load (BTL) audio power amplifier d eveloped especially for low-voltage app lications where internal speakers are r equired. Operating with a 3.3-V supply, the TPA321 can deliver 250 mW of conti nuous power into a BTL 8-Ω load at le ss than 1% THD+N throughout voice band frequencies. Although this device is ch aracterized out to 20 kHz, its operatio n was optimized for narrower band applications such as cellular communications. The BTL configur.
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