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TLV314, TLV2314, TLV4314
SBOS754A – MARCH 2016 – REVISED MARCH 2016
TLVx314 3-MHz, Low-Power, Internal EMI Filter, RRIO, Operational Amplifier
1 Features
•1 Low Offset Voltage: 0.75 mV (typ) • Low Input Bias Current: 1 pA (typ) • Wide Supply Range: 1.8 V to 5.5 V • Rail-to-Rail Input and Output • Gain Bandwidth: 3 MHz • Low IQ: 250 µA/Ch (max) • Low Noise: 16 nV/√Hz at 1 kHz • Internal RF/EMI Filter • Extended Temperature Range:
–40°C to +125°C
2 Applications
• White Goods • Handheld Test Equipment • Portable Blood Glucose Systems • Remote Sensing • Active Filters • Industrial Automation • Battery-Powered Electronics
3 Description
The TLV314 family of single-, dual-, and quadchannel operational amplifiers represents a new generation of low-power, general-purpose operational amplifiers. Rail-to-rail input and output swings (RRIO), low quiescent current (150 μA typically at 5 V) combine with a wide bandwidth of 3 MHz to make this family very attractive for a variety of battery-powered applications that require a good balance between cost and performance. Additionally, the TLV314 family architecture achieves a low input bias current of 1 pA, allowing for applications with MΩ source impedances.
The robust design of the TLV314 devices provides ease-of-use to the circuit designer: unity-gain stability, RRIO, capacitive loads of up to 300 pF, an integrated RF/EMI rejection filter, no phase reversal in overdrive conditions, and high electrostatic discharge (ESD) protection (4-kV HBM).
These devices are optimized for low-voltage operation as low as 1.8 V (±0.9 V) and up to 5.5 V (±2.75 V), and are specified over the extended industrial temperature range of –40°C to +125°C.
The TLV314 (single) is available in both 5-pin SC70 and SOT-23 packages. The TLV2314 (dual) is offered in 8-pin SOIC and VSSOP packages. The quadchannel TLV4314 is offered in a 14-pin TSSOP package.
EMIRR IN+ (dB)
120 110 100
90 80 70 60 50 40 30 20 10
0 10M
EMIRR vs Frequency
100M
1G
Frequency (Hz)
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TLV314
SOT-23 (5) SC70 (5)
2.90 mm × 1.60 mm 2.00 mm × 1.25 mm
TLV2314
VSSOP (8) SOIC (8)
3.00 mm × 3.00 mm 4.90 mm × 3.91 mm
TLV4314
TSSOP (14)
5.00 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
10G
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
TLV314, TLV2314, TLV4314
SBOS754A – MARCH 2016 – REVISED MARCH 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Device Comparison Table..................................... 3 6 Pin Configuration and Functions ......................... 3 7 Specifications......................................................... 6
7.1 Absolute Maximum Ratings ...................................... 6 7.2 ESD Ratings.............................................................. 6 7.3 Recommended Operating Conditions....................... 6 7.4 Thermal Information: TLV314 ................................... 7 7.5 Thermal Information: TLV2314 ................................. 7 7.6 Thermal Information: TLV4314 ................................. 7 7.7 Electrical Characteristics........................................... 8 7.8 Typical Characteristics .............................................. 9 7.9 Typical Characteristics ............................................ 10 8 Detailed Description ............................................ 13 8.1 Overview ................................................................. 13 8.2 Functional Block Diagram ....................................... 13 8.3 Feature Description................................................. 14
8.4 Device Functional Modes........................................ 15 9 Application and Implementation ........................ 16
9.1 Application Information............................................ 16 9.2 Typical Application ................................................. 16 9.3 System Examples ................................................... 17 10 Power Supply Recommendations ..................... 18 10.1 Input and ESD Protection ..................................... 18 11 Layout................................................................... 19 11.1 Layout Guidelines ................................................. 19 11.2 Layout Example .................................................... 19 12 Device and Documenta.