Operational Amplifier. TLV314 Datasheet

TLV314 Datasheet PDF, Equivalent


Part Number

TLV314

Description

Operational Amplifier

Manufacture

etcTI

Total Page 30 Pages
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TLV314 Datasheet
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TLV314, TLV2314, TLV4314
SBOS754A – MARCH 2016 – REVISED MARCH 2016
TLVx314
3-MHz, Low-Power, Internal EMI Filter, RRIO, Operational Amplifier
1 Features
1 Low Offset Voltage: 0.75 mV (typ)
• Low Input Bias Current: 1 pA (typ)
• Wide Supply Range: 1.8 V to 5.5 V
• Rail-to-Rail Input and Output
• Gain Bandwidth: 3 MHz
• Low IQ: 250 µA/Ch (max)
• Low Noise: 16 nV/Hz at 1 kHz
• Internal RF/EMI Filter
• Extended Temperature Range:
–40°C to +125°C
2 Applications
• White Goods
• Handheld Test Equipment
• Portable Blood Glucose Systems
• Remote Sensing
• Active Filters
• Industrial Automation
• Battery-Powered Electronics
3 Description
The TLV314 family of single-, dual-, and quad-
channel operational amplifiers represents a new
generation of low-power, general-purpose operational
amplifiers. Rail-to-rail input and output swings
(RRIO), low quiescent current (150 μA typically at
5 V) combine with a wide bandwidth of 3 MHz to
make this family very attractive for a variety of
battery-powered applications that require a good
balance between cost and performance. Additionally,
the TLV314 family architecture achieves a low input
bias current of 1 pA, allowing for applications with MΩ
source impedances.
The robust design of the TLV314 devices provides
ease-of-use to the circuit designer: unity-gain stability,
RRIO, capacitive loads of up to 300 pF, an integrated
RF/EMI rejection filter, no phase reversal in overdrive
conditions, and high electrostatic discharge (ESD)
protection (4-kV HBM).
These devices are optimized for low-voltage
operation as low as 1.8 V (±0.9 V) and up to 5.5 V
(±2.75 V), and are specified over the extended
industrial temperature range of –40°C to +125°C.
The TLV314 (single) is available in both 5-pin SC70
and SOT-23 packages. The TLV2314 (dual) is offered
in 8-pin SOIC and VSSOP packages. The quad-
channel TLV4314 is offered in a 14-pin TSSOP
package.
120
110
100
90
80
70
60
50
40
30
20
10
0
10M
EMIRR vs Frequency
100M
1G
Frequency (Hz)
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TLV314
SOT-23 (5)
SC70 (5)
2.90 mm × 1.60 mm
2.00 mm × 1.25 mm
TLV2314
VSSOP (8)
SOIC (8)
3.00 mm × 3.00 mm
4.90 mm × 3.91 mm
TLV4314
TSSOP (14)
5.00 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
10G
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

TLV314 Datasheet
TLV314, TLV2314, TLV4314
SBOS754A – MARCH 2016 – REVISED MARCH 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Device Comparison Table..................................... 3
6 Pin Configuration and Functions ......................... 3
7 Specifications......................................................... 6
7.1 Absolute Maximum Ratings ...................................... 6
7.2 ESD Ratings.............................................................. 6
7.3 Recommended Operating Conditions....................... 6
7.4 Thermal Information: TLV314 ................................... 7
7.5 Thermal Information: TLV2314 ................................. 7
7.6 Thermal Information: TLV4314 ................................. 7
7.7 Electrical Characteristics........................................... 8
7.8 Typical Characteristics .............................................. 9
7.9 Typical Characteristics ............................................ 10
8 Detailed Description ............................................ 13
8.1 Overview ................................................................. 13
8.2 Functional Block Diagram ....................................... 13
8.3 Feature Description................................................. 14
8.4 Device Functional Modes........................................ 15
9 Application and Implementation ........................ 16
9.1 Application Information............................................ 16
9.2 Typical Application ................................................. 16
9.3 System Examples ................................................... 17
10 Power Supply Recommendations ..................... 18
10.1 Input and ESD Protection ..................................... 18
11 Layout................................................................... 19
11.1 Layout Guidelines ................................................. 19
11.2 Layout Example .................................................... 19
12 Device and Documentation Support ................. 20
12.1 Device Support...................................................... 20
12.2 Documentation Support ........................................ 20
12.3 Related Links ........................................................ 20
12.4 Community Resources.......................................... 20
12.5 Trademarks ........................................................... 20
12.6 Electrostatic Discharge Caution ............................ 20
12.7 Glossary ................................................................ 20
13 Mechanical, Packaging, and Orderable
Information ........................................................... 20
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (March 2016) to Revision A
Page
• Released to production .......................................................................................................................................................... 1
2 Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Product Folder Links: TLV314 TLV2314 TLV4314


Features Datasheet pdf Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TLV314, TLV2314, TLV4314 SBO S754A – MARCH 2016 – REVISED MARCH 2016 TLVx314 3-MHz, Low-Power, Internal EMI Filter, RRIO, Operational Amplifie r 1 Features •1 Low Offset Voltage: 0.75 mV (typ) • Low Input Bias Curren t: 1 pA (typ) • Wide Supply Range: 1. 8 V to 5.5 V • Rail-to-Rail Input and Output • Gain Bandwidth: 3 MHz • L ow IQ: 250 µA/Ch (max) • Low Noise: 16 nV/√Hz at 1 kHz • Internal RF/EM I Filter • Extended Temperature Range : –40°C to +125°C 2 Applications White Goods • Handheld Test Equipme nt • Portable Blood Glucose Systems Remote Sensing • Active Filters Industrial Automation • Battery-Pow ered Electronics 3 Description The TLV 314 family of single-, dual-, and quadc hannel operational amplifiers represent s a new generation of low-power, genera l-purpose operational amplifiers. Rail- to-rail input and output swings (RRIO), low quiescent current (150 μA typically at 5 V) combine with a wid.
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