DOOR BELL. M3E-H Datasheet

M3E-H BELL. Datasheet pdf. Equivalent

Part M3E-H
Description 3-STATE DUAL TONES WIRELESS DOOR BELL
Feature MOSDESIGN SEMICONDUCTOR CORP. 3 STATE DUAL TONES WIRELESS DOOR BELL FEATURES • Direct Data Transm.
Manufacture MOSDESIGN
Total Page 2 Pages
Datasheet
Download M3E-H Datasheet



M3E-H
一華半導體股份有限公司
MOSDESIGN SEMICONDUCTOR CORP.
3 STATE DUAL TONES
WIRELESS DOOR BELL
FEATURES 功能敘述
Direct Data Transmit ( Switch to VDD ).
38 =6561 security codes.
3 door chime sound and 1 melody.
VT : valid transmission active high.
3 態雙音
遙控門鈴 IC
BIT FORMAT
"0"
"1"
"X"
TAIPEI : TEL : 886-2- 22783733
FAX : 886-2- 22783633
H.K. : TEL : 852- 27569109
FAX : 852- 27566961
DOOR CHIME
M3E.-H/M3D-95
KEY SOUND
D0 Ding Dong - Ding Dong
D1 Ding Ding - Ding Ding
D2 WEST MINISTER
D3 For Alice
APPLICATION 產品應用
Door bell system. 門鈴系統.
ELECTRICAL CHARACTERISTICS 電氣規格
Characteristics
工作電壓 Operating Voltage
Sym.
VDD
Min.
2.4
2.4
Typ.
4.5
工作電流 Operating Current
0.3
IOP — —
靜態電流 Quiescent Current
ISB 1
推動電流 Driving Current
IOL 1
振盪頻率 Oscillator Frequency FOSC 80
工作溫度 Operating Temperature
Temp.
0
25
APPLICATION DIAGRAM 參考電路圖
Max.
13
5
1
10
10
60
( @VDD=4.5V unless otherwise specified )
Unit REMARKS
M3E.-H
V
M3D-95
No load M3E.-H
mA
No load M3D-95
μA
mA @ VDS=1.2V
KHz External± 30%, Rosc=240KΩ
VDD
1
0
A0
A1
A2
A3
A4
A5
A6
A7
VSS
M3E.-H
VDD
1 18
DO
IR / RF
X
Rosc
Y
BZ
VDD
D3
D2
9 10
D1
D0
VDD
1
A0 0
A1
A2
A3
A4
A5
A6
A7
M3D-95
VDD
1 16
IR / RF
TEST3
Y
Rosc
X
DIN
VDD
OUT 1K
TEST
VSS
89
* Rosc ~ M3E.-H : 240 KΩ; M3D-95 : 240 KΩ
* All specs and applications shown above subject to change without prior notice.
( 以㆖電路及規格僅供參考,本公司得逕行修正 )
1/2
2002-02-26



M3E-H
一華半導體股份有限公司
MOSDESIGN SEMICONDUCTOR CORP.
TAIPEI : TEL : 886-2- 22783733
FAX : 886-2- 22783633
H.K. : TEL : 852- 27569109
FAX : 852- 27566961
DOOR CHIME
3 STATE DUAL TONES
WIRELESS DOOR BELL
ASSIGNMENT & POSITION
15 14
16
(M3D-95)
Y
X
1 ( 0,0 )
2
3
45
6
7
3 態雙音
遙控門鈴 IC
13
12
11
10
89
No. NAME
1 TEST3
2 VDD
3 A0
4 A1
5 A2
6 A3
7 A4
8 A5
9 A6
10 A7
11 VSS
12 TEST
13 BZ
14 DIN
15 OSC1
16 OSC2
M3E.-H/M3D-95
UNIT : um
XY
-626.75 -130
-626.75 -290
-626.75 -450
-626.75 -610
-442.75 -610
-227.75 -610
252 -610
467 -610
627 -610
627 -395
627 -235
627 -75
627 604
-108 604
-323.75 604
-626.75 434.5
* CHIP SIZE ~ 1.5 x 1.46 mm2
* IC substrate should be connected to VDD in PCB (PCB IC 必須接 VDD)
2/2 2002-02-26





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