Analog-to-Digital Converter. DDC264 Datasheet

DDC264 Converter. Datasheet pdf. Equivalent

Part DDC264
Description Current-Input Analog-to-Digital Converter
Feature Product Folder Sample & Buy Technical Documents Tools & Software Support & Community DDC264 SBA.
Manufacture etcTI
Total Page 30 Pages
Datasheet
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DDC264
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
DDC264
SBAS368D – MAY 2006 – REVISED DECEMBER 2016
DDC264 64-Channel, Current-Input Analog-to-Digital Converter
1 Features
1 Single-Chip Solution to Directly Measure 64 Low-
Level Currents
• Proven High-Precision, True Integrating
Architecture With 100% Charge Collection
• Easy Upgrade for Existing DDC Family
Applications
• Very Low Power: 3 mW/channel
• Extremely Linear:
INL = ±0.025% of Reading ±1 ppm of FSR
• Low Noise: 6.3 ppm of FSR
• Adjustable Full-Scale Range
• Adjustable Speed
– Data Rates up to 6 kSPS With 20-bit
Performance
– Integration Times as low as 160 µs
• Daisy-Chainable Serial Interface
• In-Package Bypass Capacitors Simplify PCB
Design
2 Applications
• CT Scanner DAS
• Photodiode Sensors
• X-Ray Detection Systems
SPACER
SPACER
REF3040 OPA350
VREF Buffer
Simplified Schematic
IN1
IN64
AVDD DVDD
VREF
Configuration
and
Control
Serial
Interface
DDC264
CLK
CONV
DIN_CFG
CLK_CFG
RESET
To/From
Controller
DVALID
DCLK
DIN
DOUT
QGND
AGND DGND
Copyright © 2016, Texas Instruments Incorporated
Protected by US Patent #5841310
3 Description
The DDC264 is a 20-bit, 64-channel, current-input
analog-to-digital (A/D) converter. It combines both
current-to-voltage and A/D conversion so that 64
separate low-level current output devices, such as
photodiodes, can be directly connected to its inputs
and digitized.
For each of the 64 inputs, the DDC264 uses the
proven dual switched integrator front-end. This
configuration allows for continuous current
integration: while one integrator is being digitized by
the onboard A/D converter, the other is integrating
the input current. This architecture provides both a
very stable offset and a loss-less collection of the
input current. Adjustable integration times range from
160 µs to 1 s, allowing currents from fAs to µAs to be
continuously measured with outstanding precision.
The DDC264 has a serial interface designed for
daisy-chaining in multi-device systems. Simply
connect the output of one device to the input of the
next to create the chain. Common clocking feeds all
the devices in the chain so that the digital overhead
in a multi-DDC264 system is minimal.
The DDC264 uses a 5-V analog supply and a 2.7-V
to 3.6-V digital supply. Bypass capacitors within the
DDC264 package help minimize the external
component requirements. Operating over the
temperature range of 0°C to 70°C, the DDC264
100-pin NFBGA package is offered in two versions:
the DDC264C for low-power applications, and the
DDC264CK when higher speeds are required.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
DDC264
NFBGA (100)
9.00 mm × 9.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



DDC264
DDC264
SBAS368D – MAY 2006 – REVISED DECEMBER 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Device Comparison Table..................................... 3
6 Pin Configuration and Functions ......................... 4
7 Specifications......................................................... 5
7.1 Absolute Maximum Ratings ...................................... 5
7.2 ESD Ratings.............................................................. 5
7.3 Recommended Operating Conditions....................... 5
7.4 Thermal Information .................................................. 6
7.5 Electrical Characteristics........................................... 6
7.6 Typical Characteristics .............................................. 8
8 Detailed Description ............................................ 11
8.1 Overview ................................................................. 11
8.2 Functional Block Diagram ....................................... 13
8.3 Feature Description................................................. 13
8.4 Device Functional Modes........................................ 20
8.5 Programming........................................................... 21
8.6 Register Maps ......................................................... 23
9 Application and Implementation ........................ 24
9.1 Application Information............................................ 24
9.2 Typical Application .................................................. 25
10 Power Supply Recommendations ..................... 29
10.1 Power-Up Sequencing .......................................... 29
10.2 Power Supplies and Grounding ............................ 29
11 Layout................................................................... 30
11.1 Layout Guidelines ................................................. 30
11.2 Layout Example .................................................... 31
12 Device and Documentation Support ................. 32
12.1 Receiving Notification of Documentation Updates 32
12.2 Community Resources.......................................... 32
12.3 Trademarks ........................................................... 32
12.4 Electrostatic Discharge Caution ............................ 32
12.5 Glossary ................................................................ 32
13 Mechanical, Packaging, and Orderable
Information ........................................................... 32
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision C (July 2011) to Revision D
Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section .................................................................................................. 1
• Moved AVDD and DVDD rows to Recommended Operating Conditions table...................................................................... 6
• Moved Dynamic Characteristics rows to Recommended Operating Conditions table .......................................................... 6
• Deleted Voltage row from Electrical Characteristics table ..................................................................................................... 6
• Changed 1.65 mA to 825 µA in Voltage Reference section................................................................................................. 16
• Changed 680 µA to 340 µA in Voltage Reference section................................................................................................... 16
• Changed 64 to 128 in the formula in Reading the Measurement section ............................................................................ 27
• Changed high-impedance to low-impedance in Shielding Analog Signal Paths section ..................................................... 30
Changes from Revision B (January, 2011) to Revision C
Page
• Updated NOISE vs CSENSOR table; revised values for Range 0 performance in fC and Electrons ........................................ 7
Changes from Revision A (January, 2011) to Revision B
Page
• Changed second paragraph of Basic Integration Cycle section to correct CONV timing description error ......................... 13
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