DatasheetsPDF.com

UC3573 Dataheets PDF



Part Number UC3573
Manufacturers Unitrode
Logo Unitrode
Description Buck Pulse Width Modulator Stepdown Voltage Regulator
Datasheet UC3573 DatasheetUC3573 Datasheet (PDF)

PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 PACKAGING INFORMATION Orderable Device UC2573D UC2573DG4 UC2573DTR UC3573D UC3573DTR Status Package Type Package Pins Package Eco Plan (1) Drawing Qty (2) ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) Lead/Ball Finish (6) CU NIPDAU CU NIPDAU CU NIPDAU CU NIPD.

  UC3573   UC3573


Document
PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 PACKAGING INFORMATION Orderable Device UC2573D UC2573DG4 UC2573DTR UC3573D UC3573DTR Status Package Type Package Pins Package Eco Plan (1) Drawing Qty (2) ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) Lead/Ball Finish (6) CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU CU NIPDAU MSL Peak Temp Op Temp (°C) (3) Level-1-260C-UNLIM -40 to 85 Level-1-260C-UNLIM -40 to 85 Level-1-260C-UNLIM -40 to 85 Level-1-260C-UNLIM 0 to 70 Level-1-260C-UNLIM 0 to 70 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. Device Marking (4/5) UC2573D UC2573D UC2573D UC3573D UC3573D (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Samples Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 www.ti.com TAPE AND REEL INFORMATION PACKAGE MATERIALS INFORMATION 15-Jul-2010 *All dimensions are nominal Device Package Package Pins Type Drawing UC2573DTR UC3573DTR SOIC D 8 SOIC D 8 SPQ 2500 2500 Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 330.0 12.4 6.4 330.0 12.4 6.4 B0 (mm) 5.2 5.2 K0 (mm) 2.1 2.1 P1 (mm) 8.0 8.0 W Pin1 (mm) Quadrant 12.0 Q1 12.0 Q1 Pack Materials-Page 1 www.ti.com PACKAGE MATERIALS INFORMATION 15-Jul-2010 *All dimensions are nominal Device UC2573DTR UC3573DTR Package Type SOIC SOIC Package Drawing Pins D8 D8 SPQ 2500 2500 Length (mm) 533.4 340.5 Width (mm) 338.1 338.1 Height (mm) 36.0 20.6 Pack Materials-Page 2 D0008A A 1 .189-.197 [4.81-5.00] NOTE 3 4 B PACKAGE OUTLINE SOIC - 1.75 mm max height SCALE 2.800 SMALL OUTLINE INTEGRATED CIRCUIT .228-.244 TYP [5.80-6.19] PIN 1 ID AREA 6X .050 [1.27] 8 C SEATING PLANE .004 [0.1] C .150-.157 [3.81-3.98] NOTE 4 2X .150 [3.81] 4X (0 -15 ) 5 8X .012-.020 [0.31-0.51] .010 [0.25] C A B .069 MAX [1.75] 4X (0 -15 ) SEE DETAIL A .005-.010 TY.


UC2573 UC3573 UC1610


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site.
(Privacy Policy & Contact)