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TPS63030, TPS63031
SLVS696C – OCTOBER 2008 – REVISED OCTOBER 2015
TPS6303x High Efficiency Single Inductor Buck-Boost Converter With 1-A Switches
1 Features
•1 Input Voltage Range: 1.8 V to 5.5 V • Fixed and Adjustable Output Voltage Options from
1.2 V to 5.5 V • Up to 96% Efficiency • 800-mA Output Current at 3.3 V in Step-Down
Mode (VIN = 3.6 V to 5.5 V) • Up to 500-mA Output Current at 3.3 V in Boost
Mode (VIN > 2.4 V) • Automatic Transition Between Step-Down and
Boost Mode • Device Quiescent Current less than 50 μA • Power-Save Mode for Improved Efficiency at Low
Output Power • Forced Fixed Frequency Operation and
Synchronization Possible • Load Disconnect During Shutdown • Overtemperature Protection • Available in a Small 2.5-mm × 2.5-mm 10-Pin
VSON Package (QFN)
2 Applications
• All Two-Cell and Three-Cell Alkaline, NiCd or NiMH or Single-Cell Li Battery Powered Products
• Portable Audio Players • Mobile Phones • Personal Medical Products • White LEDs
3 Description
The TPS6303x devices provide a power supply solution for products powered by either a two-cell or three-cell alkaline, NiCd or NiMH battery, or a onecell Li-ion or Li-polymer battery. Output currents can go as high as 600 mA while using a single-cell Li-ion or Li-polymer battery, and discharge it down to 2.5 V or lower. The buck-boost converter is based on a fixed frequency, pulse width modulation (PWM) controller using synchronous rectification to obtain maximum efficiency. At low load currents, the converter enters power-save mode to maintain high efficiency over a wide load current range. The powersave mode can be disabled, forcing the converter to operate at a fixed switching frequency. The maximum average current in the switches is limited to a typical value of 1000 mA. The output voltage is programmable using an external resistor divider, or is fixed internally on the chip. The converter can be disabled to minimize battery drain. During shutdown, the load is disconnected from the battery.
The TPS6303x devices operate over a free air temperature range of –40°C to 85°C. The devices are packaged in a 10-pin VSON package measuring 2.5 mm × 2.5 mm (DSK).
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPS63030 TPS63031
VSON (10)
2.50 mm x 2.50 mm
(1) For all available packages, see the orderable addendum at the end of the data sheet.
VIN 1.8 V to
5.5 V
Typical Application Schematic
L1 1.5 µH
C1 10 µF
C3 0.1µF
L1 L2
VIN VINA
VOUT
EN PS/SYNC
FB
GND PGND
TPS63031
C2 2X10 µF
VOUT 3.3 V up to
800 mA
Efficiency - %
Efficiency vs Output Current
100 VI = 3.6 V, VO = 3.3 V
90
80
70 VI = 2.4 V, VO = 3.3 V 60
50
40
30
20
10
0 0.1
TPS63031 Power Save Enabled
1 10 100 IO - Output Current - mA
1000
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
TPS63030, TPS63031
SLVS696C – OCTOBER 2008 – REVISED OCTOBER 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Output Voltage Options ........................................ 3 6 Pin Configuration and Functions ......................... 3 7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4 7.2 ESD Ratings.............................................................. 4 7.3 Recommended Operating Conditions....................... 4 7.4 Thermal Information .................................................. 4 7.5 Electrical Characteristics........................................... 5 7.6 Typical Characteristics .............................................. 6 8 Detailed Description .............................................. 7 8.1 Overview ................................................................... 7 8.2 Functional Block Diagrams ....................................... 7 8.3 Feature Description................................................... 8 8.4 Device Functional Modes.......................................... 9
9 Application and Implementation ........................ 10 9.1 Application Information............................................ 10 9.2 Typical Application .................................................. 10
10 Power Supply Recommendations ..................... 15 11 Layout................................................................... 15
11.1 Layout Guidelines ................................................. 15 11.2 Layout Example ..................