Transceivers. THVD1410 Datasheet

THVD1410 Datasheet PDF


Part

THVD1410

Description

3.3-V to 5-V RS-485 Transceivers

Manufacture

etcTI

Page 30 Pages
Datasheet
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THVD1410 Datasheet
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THVD1410
THVD1450, THVD1451, THVD1452
SLLSEY3E – MAY 2018 – REVISED MAY 2019
THVD14xx 3.3-V to 5-V RS-485 Transceivers with ±18-kV IEC ESD Protection
1 Features
1 Meets or Exceeds the Requirements of the
TIA/EIA-485A Standard
• 3 V to 5.5 V Supply Voltage
• Differential Output Exceeds 2.1 V for PROFIBUS
Compatibility with 5-V Supply
• Bus I/O ESD Protection
– ±30 kV HBM
– ±18 kV IEC 61000-4-2 Contact Discharge
– ±25 kV IEC 61000-4-2 Air-Gap Discharge
– ±4 kV IEC 61000-4-4 Fast Transient Burst
• Extended Operational Common-mode
Range: ±15 V
• Low EMI 500 kbps and 50 Mbps Data Rates
• Large Receiver Hysteresis for Noise Rejection
• Low Power Consumption
– Standby Supply Current: < 1 µA
– Current During Operation: < 3 mA
• Extended Ambient Temperature
Range: –40°C to 125°C
• Glitch-Free Power-Up/Down for Hot Plug-in
Capability
• Open, Short, and Idle Bus Failsafe
• 1/8 Unit Load (Up to 256 Bus Nodes)
• Small-Size VSON and VSSOP Packages Save
Board Space or SOIC for Drop-in Compatibility
2 Applications
• Motor Drives
• Factory Automation & Control
• Grid Infrastructure
• Building Automation
• HVAC Systems
• Video Surveillance
• Process Analytics
• Wireless Infrastructure
3 Description
THVD14xx is a family of noise-immune RS-485/RS-
422 transceivers designed to operate in rugged
industrial environments. The bus pins of these
devices are robust to high levels of IEC electrical fast
transients (EFT) and IEC electrostatic discharge
(ESD) events, eliminating the need for additional
system level protection components.
Each of these devices operates from a single supply
between 3 V and 5.5 V. The devices in this family
feature an extended common-mode voltage range
which makes them suitable for multi-point
applications over long cable runs.
THVD14xx family of devices is available in small
VSON and VSSOP packages for space constrained
applications. These devices are characterized over
ambient free-air temperatures from –40°C to 125°C.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
THVD1410
VSSOP (8)
SOIC (8)
3.00 mm × 3.00 mm
4.90 mm × 3.91 mm
VSON (8)
3.00 mm × 3.00 mm
THVD1450
VSSOP (8)
3.00 mm × 3.00 mm
SOIC (8)
4.90 mm × 3.91 mm
THVD1451
VSON (8)
SOIC (8)
3.00 mm × 3.00 mm
4.90 mm × 3.91 mm
THVD1452
VSSOP (10)
SOIC (14)
3.00 mm × 3.00 mm
8.65 mm × 3.91 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
THVD1410 and THVD1450 Simplified Schematic
R1
RE 2
DE 3
D4
7B
6A
THVD1451 Simplified Schematic
R2
8A
7B
D3
6Z
5Y
THVD1452 Simplified Schematic
R 2 (1)
RE 3 (2)
DE 4 (3)
D 5 (4)
(9 ) 12 A
(8 ) 11 B
(7 ) 10 Z
(6)9 Y
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

THVD1410 Datasheet
THVD1410
THVD1450, THVD1451, THVD1452
SLLSEY3E – MAY 2018 – REVISED MAY 2019
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Device Comparison Table..................................... 4
6 Pin Configuration and Functions ......................... 5
7 Specifications......................................................... 8
7.1 Absolute Maximum Ratings ...................................... 8
7.2 ESD Ratings.............................................................. 8
7.3 ESD Ratings [IEC] .................................................... 8
7.4 Recommended Operating Conditions....................... 9
7.5 Thermal Information .................................................. 9
7.6 Power Dissipation ..................................................... 9
7.7 Electrical Characteristics......................................... 10
7.8 Switching Characteristics ........................................ 11
7.9 Typical Characteristics: All Devices ........................ 12
7.10 Typical Characteristics: THD1450, THVD1451 and
THVD1452 ............................................................... 14
7.11 Typical Characteristics: THVD1410 ...................... 15
8 Parameter Measurement Information ................ 16
9 Detailed Description ............................................ 18
9.1 Overview ................................................................. 18
9.2 Functional Block Diagrams ..................................... 18
9.3 Feature Description................................................. 19
9.4 Device Functional Modes........................................ 19
10 Application and Implementation........................ 22
10.1 Application Information...................................... 22
10.2 Typical Application ............................................... 22
11 Power Supply Recommendations ..................... 28
12 Layout................................................................... 29
12.1 Layout Guidelines ................................................. 29
12.2 Layout Example .................................................... 29
13 Device and Documentation Support ................. 30
13.1 Device Support...................................................... 30
13.2 Third-Party Products Disclaimer ........................... 30
13.3 Related Links ........................................................ 30
13.4 Receiving Notification of Documentation Updates 30
13.5 Community Resources.......................................... 30
13.6 Trademarks ........................................................... 30
13.7 Electrostatic Discharge Caution ............................ 30
13.8 Glossary ................................................................ 30
14 Mechanical, Packaging, and Orderable
Information ........................................................... 31
4 Revision History
Changes from Revision D (March 2019) to Revision E
Page
• Changed THVD1451 From: Product Preview To: Production data ....................................................................................... 1
Changes from Revision C (February 2019) to Revision D
Page
• Changed THVD1410 From: Product Preview To: Production data ....................................................................................... 1
Changes from Revision B (December 2018) to Revision C
Page
• Changed THVD1452 From: Product Preview To: Production data ....................................................................................... 1
Changes from Revision A (May 2018) to Revision B
Page
• Added Feature: "Differential Output Exceeds 2.1 V..."........................................................................................................... 1
• Changed Feature: ±18 kV IEC 61000-4-2 Air-Gap Discharge To: ±25 kV IEC 61000-4-2 Air-Gap Discharge ..................... 1
• Added SOIC (8) package to THVD1451 ............................................................................................................................... 1
• Added Thermal Pad to the THVD1450 DRB package ........................................................................................................... 5
• Added Thermal Pad to the THVD1451 DRB package ........................................................................................................... 6
• Changed all pins HBM ESD rating from 4 kV to 8 kV ............................................................................................................ 8
• Changed IEC ESD air-gap discharge rating from 18 kV to 25 kV.......................................................................................... 8
• Changed THVD1410 power dissipation numbers .................................................................................................................. 9
• Changed THVD1410 driver tr, tf TYP from 400 ns to 460 ns and MAX from 600 ns to 680 ns ........................................... 11
• Changed THVD1410 receiver tr, tf TYP from 13 ns to 10 ns................................................................................................ 11
• Changed THVD1410 receiver tPHL, tPLH TYP from 60 ns to 35 ns ....................................................................................... 11
• Added Typical Characteristics, THD1450D .......................................................................................................................... 14
2 Submit Documentation Feedback
Copyright © 2018–2019, Texas Instruments Incorporated
Product Folder Links: THVD1410 THVD1450 THVD1451 THVD1452


Features Datasheet pdf Product Folder Order Now Technical Doc uments Tools & Software Support & Com munity THVD1410 THVD1450, THVD1451, TH VD1452 SLLSEY3E – MAY 2018 – REVISE D MAY 2019 THVD14xx 3.3-V to 5-V RS-485 Transceivers with ±18-kV IEC ESD Prot ection 1 Features •1 Meets or Exceed s the Requirements of the TIA/EIA-485A Standard • 3 V to 5.5 V Supply Voltag e • Differential Output Exceeds 2.1 V for PROFIBUS Compatibility with 5-V Su pply • Bus I/O ESD Protection – ±3 0 kV HBM – ±18 kV IEC 61000-4-2 Cont act Discharge – ±25 kV IEC 61000-4-2 Air-Gap Discharge – ±4 kV IEC 61000 -4-4 Fast Transient Burst • Extended Operational Common-mode Range: ±15 V Low EMI 500 kbps and 50 Mbps Data Ra tes • Large Receiver Hysteresis for N oise Rejection • Low Power Consumptio n – Standby Supply Current: < 1 µA Current During Operation: < 3 mA • Extended Ambient Temperature Range: 40°C to 125°C • Glitch-Free Power- Up/Down for Hot Plug-in Capability • Open, Short, and Idle Bus Failsafe • 1/8 Unit Load (Up to 256 Bus Nodes) .
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