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DAC7562-Q1, DAC7563-Q1 DAC8162-Q1, DAC8163-Q1 DAC8562-Q1, DAC8563-Q1
SLAS950A – MAY 2013 – REVISED JUNE 2015
DACxx6x-Q1 Automotive Dual 16-, 14-, 12-Bit, Low-Power, Buffered,
Voltage-Output DACs With 2.5-V, 4-PPM/°C Internal Reference
1 Features
•1 Qualified for Automotive Applications • AEC-Q100 Qualified with the Following Results:
– Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range
– Device HBM ESD Classification Level 2 – Device CDM ESD Classification Level C4B • Relative Accuracy: – DAC756x (12-Bit): 0.3 LSB INL – DAC816x (14-Bit): 1 LSB INL – DAC856x (16-Bit): 4 LSB INL • Glitch Impulse: 0.1 nV-s • Bidirectional Reference: Input or 2.5-V Output – Output Disabled by Default – ±5-mV Initial Accuracy (Max) – 4-ppm/°C Temperature Drift (Typ) – 10-ppm/°C Temperature Drift (Max) – 20-mA Sink and Source Capability • Power-On Reset to Zero Scale or Mid-Scale • Low-Power: 4 mW (Typ, 5-V AVDD, Including Internal Reference Current) • Wide Power-Supply Range: 2.7 V to 5.5 V • 50-MHz SPI With Schmitt-Triggered Inputs • LDAC and CLR Functions • Output Buffer With Rail-to-Rail Operation • Package: VSSOP-10
2 Applications
• Portable Instrumentation • PLC Analog Output Module • Closed-Loop Servo Control • Voltage Controlled Oscillator Tuning • Data Acquisition Systems • Programmable Gain and Offset Adjustment
3 Description
The DAC756x-Q1, DAC816x-Q1, and DAC856x-Q1 (DACxx6x-Q1) devices are low-power, voltage-output, dual-channel, 12-, 14-, and 16-bit digital-to-analog converters (DACs), respectively. These devices include a 2.5-V, 4-ppm/°C internal reference, giving a full-scale output voltage range of 2.5 V or 5 V. The internal reference has an initial accuracy of ±5 mV and can source or sink up to 20 mA at the VREFIN/VREFOUT pin.
These devices are monotonic, providing excellent linearity and minimizing undesired code-to-code transient voltages (glitch). They use a versatile threewire serial interface that operates at clock rates up to 50 MHz. The interface is compatible with standard SPI™, QSPI™, Microwire, and digital signal processor (DSP) interfaces. The DACxx62-Q1 devices incorporate a power-on-reset circuit that ensures the DAC output powers up and remains at zero scale until a valid code is written to the device, whereas the DACxx63-Q1 devices similarly power up at mid-scale. These devices contain a power-down feature that reduces current consumption to typically 550 nA at 5 V. The low power consumption, internal reference, and small footprint make these devices ideal for portable, battery-operated equipment.
The DACxx62-Q1 devices are drop-in and functioncompatible with each device in this family, as are the DACxx63-Q1 devices. The entire family is available in a 10-pin VSSOP-10 (DGS) package.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
DAC7562-Q1
DAC7563-Q1
DAC8162-Q1 DAC8163-Q1
VSSOP (10)
3.00 mm × 3.00 mm
DAC8562-Q1
DAC8563-Q1
(1) For all available packages, see the orderable addendum at the end of the datasheet.
DIN SCLK SYNC
Simplified Block Diagram
GND
AVDD
LDAC
CLR
VREFIN/VREFOUT
Input Control Logic
Buffer Control
Register Control
Control Logic
2.5-V Reference
PowerDown Control Logic
DAC756x-Q1 (12-Bit) DAC816x-Q1 (14-Bit) DAC856x-Q1 (16-Bit)
Data Buffer B Data Buffer A
DAC Register B DAC Register A
DAC DAC
VOUTB VOUTA
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
DAC7562-Q1, DAC7563-Q1 DAC8162-Q1, DAC8163-Q1 DAC8562-Q1, DAC8563-Q1
SLAS950A – MAY 2013 – REVISED JUNE 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Device Comparison Table..................................... 3 6 Pin Configuration and Functions ......................... 3 7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4 7.2 ESD Ratings.............................................................. 4 7.3 Recommended Operating Conditions....................... 4 7.4 Thermal Information .................................................. 4 7.5 Electrical Characteristics........................................... 5 7.6 Timing Requirements ................................................ 7 7.7 Typical Characteristics .............................................. 8 8 Detailed Description ............................................ 26 8.1 Overvie.