Document
MAX44211
EVALUATION KIT AVAILABLE
High-Current Differential Line Driver for Powerline Communications
General Description
The MAX44211 is a low-distortion line driver customized for powerline communication (PLC) applications where high output current is needed to drive the isolation and coupling transformer under varying load conditions. The MAX44211 can be switched to implement all world standards, trading off improved linearity for increased quiescent current. The MAX44211 delivers a high 1.5A linear output current and provides peak-to-peak differential voltage swing of up to 36V. The MAX44211 features very low intermodulation and harmonic distortion ensuring they meet worldwide PLC standards.
The MAX44211 features advanced diagnostics for temperature and output current monitoring. There are high temperature warning and overtemperature shutdown functions. There is also a programmable current limit. The status of these diagnostics are indicated via two opendrain status outputs.
The MAX44211 is designed to interface to powerlines that have wide ranging and variable loads and drive signals within the 9kHz to 500kHz frequency band. This device operates from a single supply and is available in a 4mm x 4mm, 20-pin TQFN package.
The MAX44211 device is specified for operation from -40°C to +85°C.
Applications
●● Powerline Communications ●● Smart Meters ●● Lighting ●● Solar
Ordering Information appears at end of data sheet.
Benefits and Features
●● Meets Stringent ARIB, FCC, and CENELEC Linearity Specifications for Out-of-Band Emissions • Output Drives Current Linearly Up to 1.5A Peak Into a Reactive Load for PLC Applications
●● Output Voltage Swings to Within 0.5V of AVDD or AGND (36VP-P Differential) for Widest Dynamic Range
●● Wide Power-Supply Range Addresses Multiple Standards: • +8V to +20V for Analog Supply • +2.7V to +5.5V for Digital Supply
●● Programmable Output Current Limit via External Resistor Provides Flexibility
●● Programmable Gain (6x, 12x, 15x, or 18x) via Gain Inputs Provides Multistandard Usage
●● Status Logic Outputs Provide Improved Diagnostics • Overtemperature Shutdown Active • High-Temperature Warning Active • Overcurrent Active • Normal Operation
Functional Diagram
MAX44211
IN+ IN-
DVDD
G0 G1 DGND
10kΩ 10kΩ
GAIN CONTROL
VGA
60kΩ
10kΩ 10kΩ
PA
60kΩ PA : POWER AMPLIFIER
THERMAL AND
OVERCURRENT MONITOR
AVDD MODE OUT+ OUTTXEN ILSET AGND
STATUS0 STATUS1
19-7667; Rev 1; 9/17
MAX44211
High-Current Differential Line Driver for Powerline Communications
Absolute Maximum Ratings
AVDD to AGND......................................................-0.3V to +22V DVDD to DGND........................................................-0.3V to +6V DGND to AGND.....................................................-0.3V to +0.3V OUT+, OUT- to AGND........................... -0.3V to (VAVDD + 0.3V) IN+, IN- to AGND (Gain = 6V/V)........................... AVDD/2 ±4.0V
(Gain = 12V/V)......................... AVDD/2 ±2.0V (Gain = 15V/V)......................... AVDD/2 ±1.6V (Gain = 18V/V)....................... AVDD/2 ±1.33V STATUS1, STATUS0, G1, G0, TXEN, MODE, ILSET to DGND........-0.3V to (VDVDD + 0.3V) Continuous Current into STATUS1, STATUS0, G1, G0 ....................................................................................... ±20mA
Continuous Power Dissipation (TA = +70°C) TQFN (Four-Layer Board)
(derate 33.3mW/°C above +70°C).......................2666.7mW TQFN (Single Layer)
(derate 20.8mW/°C above +70°C) ......................1666.7mW Operating Temperature Range............................ -40°C to +85°C Junction Temperature.......................................................+150°C Storage Temperature Range..............................-65ºC to +150°C Lead Temperature (soldering, 10s).................................. +300°C Soldering Temperature (reflow)........................................+260°C
Package Thermal Characteristics (Note 1)
TQFN Multilayer Board Junction-to-Ambient Thermal Resistance (θJA)...........33°C/W Junction-to-Case Thermal Resistance (θJC)..................2°C/W
TQFN Single-Layer Board Junction-to-Ambient Thermal Resistance (θJA)...........48°C/W Junction-to-Case Thermal Resistance (θJC)..................2°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.