PFS35 Resistors Datasheet

PFS35 Datasheet PDF, Equivalent


Part Number

PFS35

Description

Power SMD Film Resistors

Manufacture

Riedon

Total Page 2 Pages
PDF Download
Download PFS35 Datasheet PDF


PFS35
PFS35
Power SMD Film Resistors
Type
Terminals
Terminal Finish
Power Rating (with heatsink)
Thermal Resistance Rthj-c
Resistance Range
Tolerances (others upon request)
Temperature Coefficient
Operating Temperature
Max Operating Voltage
Inductance
Voltage Proof
Insulation Resistance
Resistor Material
Load Life
Humidity
Temperature Cycle
Solder Heat
Vibration
Flammability
Reflow soldering
Moisture Sensitivity Level
Mass
• TO-263 Housing (D-Pak)
• Resistances from 0.01Ohm to 51kOhms
• Power Rating to 35Watt
• Resistance Tolerances to ±1%
• TCR to ±50ppm/°C
• Load Stability to 1%
• Low Ohm Values for Current Sense Applications
• Exceptional Pulse Performance
Solder Reflow Secure at 260°C / 20s
• Isolated Back Plate
SPECIFICATIONS
PFS35
2
Tin Plated Copper
35 W ( 2W on Simple Solder Pad )
3.3 K/W
0.01 to 0.099Ohms
0.1 to 9.9Ohms
10 to 51KOhms
5% 1% / 5%
1%
±250 ppm/°C
±100 ppm/°C
±50 ppm/°C
-55°C to 175°C
500V
8.4 nH
2.0kV DC
Over 1,000 Megohm
Thin Film
±1%
90 min ON, 30 min OFF, 1000 hrs @ 25C
±1%
90-95% RH, 0.1W, 1000 hrs @ 40C
±0.25%
-55C for 30 min, +155C for 30 min, 5 cycles
±0.1%
350C ±5C for 3 seconds
±0.25%
IEC60068-2-6
UL94V-0
lead-free soldering 260°C / 20s (2 reflow cycles maximum)
MSL-1
1.5g
Ordering Information
Part Description: Part Type - Resistance - Tolerance
PFS35 10 Ohms 1%
Riedon Inc.
© Riedon, Inc.
300 Cypress Avenue Alhambra CA 91801
(626) 284-9901
www.riedon.com sales@riedon.com
(626) 284-1704
Revised: 201908_004

PFS35
PFS35
Power SMD Film Resistors
Power Derating
% Power
100
80
60
40
20
0
-50
+25 °C
+175 °C
0 50 100 150
Flange Temperature (C)
200
Power Rating Notes -
The PFS35 Series Resistors must be attached to a suitable
heatsink. The maximum internal resistor temperature is 175°C.
To specify an appropriate heatsink use the following formula :
RHH
=
TMAX - (P * RHR) - TA
P
Where: RqH = Thermal Resistance of Heatsink ( K/W )
RqR = Thermal Resistance of Resistor ( K/W )
TMAX = Maximum Temperature of Resistor
TA = Ambient Temperature of Heatsink ( °C )
P = Power Through Resistor ( W )
DIMENSIONS
Back plate is isolated from both pins.
Dimension
A
B
C
D
E
F
G
H
J
K
L
mm
10.3
10.1
15.3
5.08
1.5
0.75
2.2
4.5
0.5
2.5
5.0
tol.
(±mm)
0.2
0.2
1.2
0.1
0.05
0.05
0.2
0.2
0.05
0.5
1.0
inches
0.405
0.400
0.602
0.200
0.060
0.030
0.087
0.177
0.020
0.10
0.20
tol.
(±inches)
0.008
0.008
0.047
0.004
0.002
0.002
0.008
0.008
0.002
0.02
0.04
Pulse peak power (W)
100k
10k
1k
100 400W
35W
10
10n 100n 1u 10u 100u 1m 10m 100m 1 10 100
Pulse width (seconds)
Tenative continuous-pulse allowance at duty 0.01. Load life test will be necessary
in actual equipment, because curve may be changed by resistance, repetition, duty
and perating temperature.
Riedon Inc.
© Riedon, Inc.
300 Cypress Avenue Alhambra CA 91801
(626) 284-9901
www.riedon.com sales@riedon.com
(626) 284-1704
Revised: 201908_004


Features PFS35 Power SMD Film Resistors Type Ter minals Terminal Finish Power Rating (wi th heatsink) Thermal Resistance Rthj-c Resistance Range Tolerances (others upo n request) Temperature Coefficient Oper ating Temperature Max Operating Voltage Inductance Voltage Proof Insulation Re sistance Resistor Material Load Life Hu midity Temperature Cycle Solder Heat Vi bration Flammability Reflow soldering M oisture Sensitivity Level Mass • TO -263 Housing (D-Pak) • Resistances f rom 0.01Ohm to 51kOhms • Power Ratin g to 35Watt • Resistance Tolerances to ±1% • TCR to ±50ppm/°C • Lo ad Stability to 1% • Low Ohm Values for Current Sense Applications • Exc eptional Pulse Performance • Solder Reflow Secure at 260°C / 20s • Isol ated Back Plate SPECIFICATIONS PFS35 2 Tin Plated Copper 35 W ( 2W on Sim ple Solder Pad ) 3.3 K/W 0.01 to 0.09 9Ohms 0.1 to 9.9Ohms 10 to 51KOhms 5 % 1% / 5% 1% ±250 ppm/°C ±100 ppm /°C ±50 ppm/°C -55°C to 175°C 500V 8.4 nH 2.0kV DC Over 1,000 Megohm Thin Film ±1%.
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