Transceiver. TFDS6500E Datasheet

TFDS6500E Transceiver. Datasheet pdf. Equivalent

TFDS6500E Datasheet
Recommendation TFDS6500E Datasheet
Part TFDS6500E
Description Transceiver
Feature TFDS6500E; TELEFUNKEN Semiconductors TFDU6100E/TFDS6500E/TFDT6500E 2.7–5.5V Fast Infrared Transceiver Module .
Manufacture TELEFUNKEN
Datasheet
Download TFDS6500E Datasheet





TELEFUNKEN TFDS6500E
TELEFUNKEN
Semiconductors
TFDU6100E/TFDS6500E/TFDT6500E
2.7–5.5V Fast Infrared Transceiver Module Family
(FIR, 4 Mbit/s)
Features
Applications
D Compliant to IrDA 1.2 (Up to
4 Mbit/s), HP–SIR, Sharp ASK
and TV Remote
D Wide Operating Voltage Range
(2.7 to 5.5 V )
D Low-Power Consumption (3 mA
Supply Current)
D Power Shutdown Mode (1 mA
Shutdown Current)
D Long Range (Up to 2.0 m at
4 Mbit/s in Nominal Design)
D High Efficiency Emitter
(120 mW/sr min "15_)
D Three Surface Mount Package
Options
Universal (9.7 x 4.7 x 4.0 mm)
Side View (13.0x5.95x5.3mm)
Top View (13.0x7.6x5.95mm)
D BabyFace (Universal) Package
Capable of Surface Mount
Solderability to Side and Top
View Orientation
D Directly Interfaces With Various
Super I/O and Controller Devices
D Built–In EMI Protection – No
External Shielding Necessary
D Few External Components
Required
D Backward Compatible to All
TEMIC SIR and FIR Infrared
Transceivers
D Notebook Computers, Desktop
PCs, Palmtop Computers (Win
CE, Palm PC), PDAs
D Digital Still and Video Cameras
D Printers, Fax Machines,
Photocopiers, Screen Projectors
D Telecommunication Products
(Cellular Phones, Pagers)
D Internet TV Boxes, Video
Conferencing Systems
D External Infrared Adapters
(Dongles)
D Medical and Industrial Data
Collection Devices
Description
The TFDU6100E, TFDS6500E, and TFDT6500E are a
family of low-power infrared transceiver modules
compliant to the IrDA 1.2 standard for fast infrared (FIR)
data communication, supporting IrDA speeds up to 4.0
Mbit/s, HP–SIR, Sharp ASK and carrier based remote
control modes up to 2 MHz. Integrated within the
transceiver modules are a photo PIN diode, infrared
emitter (IRED), and a low-power CMOS control IC to
provide a total front–end solution in a single package.
TEMIC’s FIR transceivers are available in three package
options, including our BabyFace package (TFDU6100E),
the smallest FIR transceiver available on the market. This
wide selection provides flexibility for a variety of
applications and space constraints.
The transceivers are capable of directly interfacing with
a wide variety of I/O chips which perform the pulse-width
modulation/demodulation function, including National
Semiconductor’s PC87338, PC87108 and PC87109,
SMSC’s FDC37C669, FDC37N769 and CAM35C44,
and Hitachi’s SH3. At a minimum, a current-limiting
resistor in series with the infrared emitter and a VCC
bypass capacitor are the only external components
required to implement a complete solution.
Package Options
TFDU6100E
Baby Face (Universal)
TFDS6500E
Side View
TFDT6500E
Top View
This product is currently in devleopment. Inquiries regarding the status of this product should be directed to TEMIC Marketing.
Pending—Rev. A, 03-Apr-98
Pre-Release Information
1



TELEFUNKEN TFDS6500E
TFDU6100E/TFDS6500E/TFDT6500E
Functional Block Diagram
VCC
TELEFUNKEN
Semiconductors
SD/Mode
Txd
Amplifier
Comparator
Driver
AGC
Logic
Open Collector Driver
GND
Rxd
IRED Anode
IRED Cathode
Pin Assignment and Description
Pin Number
“ U ”, “ T ” “ S ”
Option Option Function
Description
I/O Active
1 8 IRED Anode IRED anode, should be externally connected to VCC through a current
control resistor
2 1 IRED Cathode IRED cathode, internally connected to driver transistor
3 7 Txd Transmit Data Input
I HIGH
4 2 Rxd Received Data Output, push–pull CMOS driver output capable of driving a O LOW
standard CMOS or TTL load. No external pull–up or pull–down resistor is
required (pin is floating when device is in shutdown mode).
5 6 SD/Mode Shutdown/Mode
I HIGH
6 3 VCC Supply Voltage
7 5 NC Do not connect.
8
4
GND
Ground
IRED
Detector
8 76 5
IRED
Detector
1 2 3 4 5 678
”U” Option
BabyFace (Universal)
12
IRED
34
Detector
”S” Option
Side View
1 2 3 4 5 678
”T” Option
Top View
2 Pending—Rev. A, 03-Apr-98
Pre-Release Information



TELEFUNKEN TFDS6500E
TELEFUNKEN
Semiconductors
TFDU6100E/TFDS6500E/TFDT6500E
Ordering Information
Part Number
TFDU6100E–TR3
TFDU6100E–TT3
TFDS6500E–TR3
TFDT6500E–TR3
Qty/ Reel
1000 pcs
1000 pcs
750 pcs
750 pcs
Description
Oriented in carrier tape for side view surface mounting
Oriented in carrier tape for top view surface mounting
Absolute Maximum Ratings
Parameter
Symbol
Test Conditionsa
Minb Typc
Supply Voltage Range
Supply Voltage Range (Anode)
Input Currentsd
Output Sinking Current
Power Dissipatione
Junction Temperature
Ambient Temperature Range (Operating)
Storage Temperature Range
Soldering Temperature
Average Output Current
Repetitive Pulsed Output Current
IRED Anode Voltage at Current Output
Transmitter Data Input Voltage
Receiver Data Output Voltage
Virtual Source Sizef
VCC
Vanode
– 0.5
0
PD
TJ
Tamb
Tstg
IIRED (DC)
IIRED (RP)
VIREDA
VTxd
VRxd
d
See Recommended Solder Profile
–25
–25
<90 µs, ton <20%
– 0.5
– 0.5
– 0.5
2.5
2.8
Maximum Intensity for Class 1 Operation
of IEC 825 or EN60825g
EN60825, 1997
Notes
a. Reference point GND pin unless otherwise noted.
b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum.
c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
d. Maximum input current for all pins (except IRED Anode pin).
e. See Derating Curve.
f. Method: (1-1/e) encircled energy.
g. Worst case IrDA SIR pulse pattern.
Maxb
6
VCC+1.5
10
25
350
125
85
85
240
130
600
6
VCC+0.5
VCC+0.5
320
Unit
V
mA
mW
°C
mA
V
mm
mW/sr
Pending—Rev. A, 03-Apr-98
Pre-Release Information
3





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