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XC3S500E Dataheets PDF



Part Number XC3S500E
Manufacturers Xilinx
Logo Xilinx
Description Spartan-3E FPGA
Datasheet XC3S500E DatasheetXC3S500E Datasheet (PDF)

1 DS312 December 14, 2018 Module 1: Introduction and Ordering Information DS312 (v4.2) December 14, 2018 • Introduction • Features • Architectural Overview • Package Marking • Ordering Information Module 2: Functional Description DS312 (v4.2) December 14, 2018 • Input/Output Blocks (IOBs) • Overview • SelectIO™ Signal Standards • Configurable Logic Block (CLB) • Block RAM • Dedicated Multipliers • Digital Clock Manager (DCM) • Clock Network • Configuration • Powering Spartan®-3E FPGAs • Producti.

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1 DS312 December 14, 2018 Module 1: Introduction and Ordering Information DS312 (v4.2) December 14, 2018 • Introduction • Features • Architectural Overview • Package Marking • Ordering Information Module 2: Functional Description DS312 (v4.2) December 14, 2018 • Input/Output Blocks (IOBs) • Overview • SelectIO™ Signal Standards • Configurable Logic Block (CLB) • Block RAM • Dedicated Multipliers • Digital Clock Manager (DCM) • Clock Network • Configuration • Powering Spartan®-3E FPGAs • Production Stepping Spartan-3E FPGA Family Data Sheet Product Specification Module 3: DC and Switching Characteristics DS312 (v4.2) December 14, 2018 • DC Electrical Characteristics • Absolute Maximum Ratings • Supply Voltage Specifications • Recommended Operating Conditions • DC Characteristics • Switching Characteristics • I/O Timing • SLICE Timing • DCM Timing • Block RAM Timing • Multiplier Timing • Configuration and JTAG Timing Module 4: Pinout Descriptions DS312 (v4.2) December 14, 2018 • Pin Descriptions • Package Overview • Pinout Tables • Footprint Diagrams © Copyright 2005–2018 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, Artix, Kintex, Zynq, Vivado, and other designated brands included herein are trademarks of Xilinx in the United States and other countries. PCI and PCI-X are trademarks of PCI-SIG and used under license. All other trademarks are the property of their respective owners. DS312 December 14, 2018 Product Specification www.xilinx.com Send Feedback 1 8 DS312 (v4.2) December 14, 2018 Spartan-3E FPGA Family: Introduction and Ordering Information Product Specification Introduction The Spartan®-3E family of Field-Programmable Gate Arrays (FPGAs) is specifically designed to meet the needs of high volume, cost-sensitive consumer electronic applications. The five-member family offers densities ranging from 100,000 to 1.6 million system gates, as shown in Table 1. The Spartan-3E family builds on the success of the earlier Spartan-3 family by increasing the amount of logic per I/O, significantly reducing the cost per logic cell. New features improve system performance and reduce the cost of configuration. These Spartan-3E FPGA enhancements, combined with advanced 90 nm process technology, deliver more functionality and bandwidth per dollar than was previously possible, setting new standards in the programmable logic industry. Because of their exceptionally low cost, Spartan-3E FPGAs are ideally suited to a wide range of consumer electronics applications, including broadband access, home networking, display/projection, and digital television equipment. The Spartan-3E family is a superior alternative to mask programmed ASICs. FPGAs avoid the high initial cost, the lengthy development cycles, and the inherent inflexibility of conventional ASICs. Also, FPGA programmability permits design upgrades in the field with no hardware replacement necessary, an impossibility with ASICs. Features • Very low cost, high-performance logic solution for high-volume, consumer-oriented applications • Proven advanced 90-nanometer process technology • Multi-voltage, multi-standard SelectIO™ interface pins • Up to 376 I/O pins or 156 differential signal pairs • LVCMOS, LVTTL, HSTL, and SSTL single-ended signal standards • 3.3V, 2.5V, 1.8V, 1.5V, and 1.2V signaling • 622+ Mb/s data transfer rate per I/O • True LVDS, RSDS, mini-LVDS, differential HSTL/SSTL differential I/O • Enhanced Double Data Rate (DDR) support • DDR SDRAM support up to 333 Mb/s • Abundant, flexible logic resources • Densities up to 33,192 logic cells, including optional shift register or distributed RAM support • Efficient wide multiplexers, wide logic • Fast look-ahead carry logic • Enhanced 18 x 18 multipliers with optional pipeline • IEEE 1149.1/1532 JTAG programming/debug port • Hierarchical SelectRAM™ memory architecture • Up to 648 Kbits of fast block RAM • Up to 231 Kbits of efficient distributed RAM • Up to eight Digital Clock Managers (DCMs) • Clock skew elimination (delay locked loop) • Frequency synthesis, multiplication, division • High-resolution phase shifting • Wide frequency range (5 MHz to over 300 MHz) • Eight global clocks plus eight additional clocks per each half of device, plus abundant low-skew routing • Configuration interface to industry-standard PROMs • Low-cost, space-saving SPI serial Flash PROM • x8 or x8/x16 parallel NOR Flash PROM • Low-cost Xilinx® Platform Flash with JTAG • Complete Xilinx ISE® and WebPACK™ software • MicroBlaze™ and PicoBlaze embedded processor cores • Fully compliant 32-/64-bit 33 MHz PCI support (66 MHz in some devices) • Low-cost QFP and BGA packaging options • Common footprints support easy density migration • Pb-free packaging options • XA Automotive version available Table 1: Summary of Spartan-3E FPGA Attributes Device CLB Array .


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