LDC1101 Converter Datasheet

LDC1101 Datasheet PDF, Equivalent


Part Number

LDC1101

Description

High-Speed Inductance-to-Digital Converter

Manufacture

etcTI

Total Page 30 Pages
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LDC1101
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LDC1101
SNOSD01D – MAY 2015 – REVISED OCTOBER 2016
LDC1101 1.8-V High-Resolution, High-Speed Inductance-to-Digital Converter
1 Features
1 Wide Operating Voltage Range: 1.8 V to 3.3 V
• Sensor Frequency Range: 500 kHz to 10 MHz
• RP Resolution: 16-Bit
• L Resolution: 16- or 24-Bit
• 180-kSPS Conversion Rate
• Threshold Detection Functionality
• 1% Part-to-Part Variation in RP Measurement
• Supply Current:
– 1.4-µA Shutdown mode
– 135-µA Sleep mode
– 1.9-mA Active Mode (no sensor connected)
• Sub-Micron Distance Resolution Achievable
• Remote Sensor Placement Isolating the LDC from
Harsh Environments
• Robust Against Environmental Interferences such
as Oil, Water, Dirt, or Dust
• Minimal External Components
• Magnet-Free Operation
• Operating Temperature: –40°C to +125°C
2 Applications
• High-Speed Gear Counting
• High-Speed Event Counting
• Motor Speed Sensing
• Knobs and Dials for Appliances, Automotive, and
Consumer Applications
• HMI for Appliances, Automotive, and Consumer
Applications
• Buttons and Keypads
• Motor Control
• Metal Detection
3 Description
The LDC1101 is a 1.8-V to 3.3-V, high-resolution
inductance-to-digital converter for short-range, high-
speed, contactless sensing of position, rotation, or
motion, enabling reliable, accurate measurements
even in the presence of dust or dirt, making it ideal
for open or harsh environments.
The LDC1101 features dual inductive measurement
cores, allowing for > 150 ksps 16-bit RP and L
measurements simultaneous with a high-resolution L
measurement which can sample at > 180 ksps with a
resolution of up to 24 bits. The LDC1101 includes a
threshold-compare function which can be dynamically
updated while the device is running.
Inductive sensing technology enables precise
measurement of linear/angular position,
displacement, motion, compression, vibration, metal
composition, and many other applications in markets
including automotive, consumer, computer, industrial,
medical, and communications. Inductive sensing
offers better performance and reliability at lower cost
than other, competing solutions.
The LDC1101 offers these benefits of inductive
sensing in a small 3-mm × 3-mm 10-pin VSON
package. The LDC1101 can be easily configured by a
microcontroller using the 4-pin SPI™.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LDC1101
VSON (10)
3.00 mm × 3.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
4 Simplified Schematic
1.8V
1.8V
Sensor
VDD
INA
Sensor
INB Driver
GND
LDC1101
High Res
L Meas
RP + L
Meas
Threshold
Compare
CLKIN
CLDO
Registers
+ Logic
CSB
SCLK
SPI SDI
SDO
CLKOUT
MCU
VDD
CSB
SCLK
MOSI
MISO
SPI
Peripheral
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

LDC1101
LDC1101
SNOSD01D – MAY 2015 – REVISED OCTOBER 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Simplified Schematic............................................. 1
5 Revision History..................................................... 2
6 Pin Configuration and Functions ......................... 4
7 Specifications......................................................... 5
7.1 Absolute Maximum Ratings ...................................... 5
7.2 ESD Ratings ............................................................ 5
7.3 Recommended Operating Conditions....................... 5
7.4 Thermal Information .................................................. 5
7.5 Electrical Characteristics........................................... 6
7.6 Digital Interface ......................................................... 6
7.7 Timing Requirements ................................................ 7
7.8 Typical Characteristics .............................................. 8
8 Detailed Description ............................................ 10
8.1 Overview ................................................................. 10
8.2 Functional Block Diagram ....................................... 10
8.3 Feature Description................................................. 10
8.4 Device Functional Modes........................................ 11
8.5 Programming.......................................................... 13
8.6 Register Maps ........................................................ 15
9 Application and Implementation ........................ 31
9.1 Application Information............................................ 31
9.2 Typical Application ................................................. 42
10 Power Supply Recommendations ..................... 47
11 Layout................................................................... 47
11.1 Layout Guidelines ................................................. 47
11.2 Layout Example .................................................... 48
12 Device and Documentation Support ................. 49
12.1 Device Support .................................................... 49
12.2 Documentation Support ........................................ 49
12.3 Community Resources.......................................... 49
12.4 Trademarks ........................................................... 49
12.5 Electrostatic Discharge Caution ............................ 49
12.6 Glossary ................................................................ 50
13 Mechanical, Packaging, and Orderable
Information ........................................................... 50
5 Revision History
Changes from Revision C (February 2016) to Revision D
Page
• Added link to Application Note SNOA944 ............................................................................................................................ 12
• Changed RPMAX_DIS field name to HIGH_Q_SENSOR, as this is clearer for when to use this mode. .......................... 16
• Changed location of notes detailing register read sequence from inside field entry in table to paragraph under
register title. .......................................................................................................................................................................... 25
• Changed Field R/W value to R/W. ...................................................................................................................................... 26
• Added links to LDC1101 Reference Designs ...................................................................................................................... 31
• Added clarification on L-only mode or RP+L mode in example configuration .................................................................... 44
• Changed incorrect value in table ......................................................................................................................................... 44
Changes from Revision B (July 2015) to Revision C
Page
• Added top navigator icon for TI Designs ............................................................................................................................... 1
• Changed "8.6 µs" to "5.44 µs" .............................................................................................................................................. 12
• Changed "87.38 ms" to "65.54 ms" ...................................................................................................................................... 12
• Changed "Valid range: 2 RCOUNT[15:8]..." to "Valid range: 2 RCOUNT[15:0]..." ........................................................ 26
• Added "When LHR_OFFSET =0x0000, ƒSENSOR can be determined by:"............................................................................ 28
Changes from Revision A (June 2015) to Revision B
Page
• Changed Register type and reset values for some fields which where incomplete. ............................................................ 16
• Changed NAME to INTB_MODE.......................................................................................................................................... 21
• Changed DRDY to INTB in INTB2SDO field descriiption..................................................................................................... 21
• Changed RP Threshold and L Threshold field names in RP_HI_LON and L_HI_LON fields ............................................. 24
• Changed Incorrect resistance value ..................................................................................................................................... 43
• Changed Calculations of reference count setting................................................................................................................. 44
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Product Folder Links: LDC1101
Copyright © 2015–2016, Texas Instruments Incorporated


Features Product Folder Sample & Buy Technical Documents Tools & Software Support & Community Reference Design LDC1101 SN OSD01D – MAY 2015 – REVISED OCTOBER 2016 LDC1101 1.8-V High-Resolution, Hi gh-Speed Inductance-to-Digital Converte r 1 Features •1 Wide Operating Volta ge Range: 1.8 V to 3.3 V • Sensor Fre quency Range: 500 kHz to 10 MHz • RP Resolution: 16-Bit • L Resolution: 16 - or 24-Bit • 180-kSPS Conversion Rat e • Threshold Detection Functionality • 1% Part-to-Part Variation in RP Me asurement • Supply Current: – 1.4- A Shutdown mode – 135-µA Sleep mode – 1.9-mA Active Mode (no sensor conn ected) • Sub-Micron Distance Resoluti on Achievable • Remote Sensor Placeme nt Isolating the LDC from Harsh Environ ments • Robust Against Environmental Interferences such as Oil, Water, Dirt, or Dust • Minimal External Component s • Magnet-Free Operation • Operati ng Temperature: –40°C to +125°C 2 A pplications • High-Speed Gear Counting • High-Speed Event Counting • Motor Speed Sensing • Knobs and Dials .
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