MSP430FR2111 Microcontrollers Datasheet

MSP430FR2111 Datasheet PDF, Equivalent


Part Number

MSP430FR2111

Description

Mixed-Signal Microcontrollers

Manufacture

etcTI

Total Page 30 Pages
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MSP430FR2111
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MSP430FR2111, MSP430FR2110, MSP430FR2100, MSP430FR2000
SLASE78C – AUGUST 2016 – REVISED AUGUST 2018
MSP430FR21xx, MSP430FR2000 Mixed-Signal Microcontrollers
1 Device Overview
1.1 Features
1
• Embedded Microcontroller
– 16-Bit RISC Architecture up to 16 MHz
– Wide Supply Voltage Range From 3.6 V Down
to 1.8 V (Minimum Supply Voltage is Restricted
by SVS Levels, See the SVS Specifications)
• Optimized Low-Power Modes (at 3 V)
– Active Mode: 120 µA/MHz
– Standby
– LPM3.5 With VLO: 1 µA
– Real-Time Clock (RTC) Counter (LPM3.5
With 32768-Hz Crystal): 1 µA
– Shutdown (LPM4.5): 34 nA Without SVS
• High-Performance Analog
– 8-Channel 10-Bit Analog-to-Digital Converter
(ADC)
– Integrated Temperature Sensor
– Internal 1.5-V Reference
– Sample-and-Hold 200 ksps
– Enhanced Comparator (eCOMP)
– Integrated 6-Bit DAC as Reference Voltage
– Programmable Hysteresis
– Configurable High-Power and Low-Power
Modes
• Low-Power Ferroelectric RAM (FRAM)
– Up to 3.75KB of Nonvolatile Memory
– Built-In Error Correction Code (ECC)
– Configurable Write Protection
– Unified Memory of Program, Constants, and
Storage
– 1015 Write Cycle Endurance
– Radiation Resistant and Nonmagnetic
• Intelligent Digital Peripherals
– One 16-Bit Timer With Three Capture/Compare
Registers (Timer_B3)
– One 16-Bit Counter-Only RTC Counter
– 16-Bit Cyclic Redundancy Checker (CRC)
• Enhanced Serial Communications
– Enhanced USCI A (eUSCI_A) Supports UART,
IrDA, and SPI
• Clock System (CS)
– On-Chip 32-kHz RC Oscillator (REFO)
– On-Chip 16-MHz Digitally Controlled Oscillator
(DCO) With Frequency-Locked Loop (FLL)
– ±1% Accuracy With On-Chip Reference at
Room Temperature
– On-Chip Very-Low-Frequency 10-kHz Oscillator
(VLO)
– On-Chip High-Frequency Modulation Oscillator
(MODOSC)
– External 32-kHz Crystal Oscillator (LFXT)
– Programmable MCLK Prescalar of 1 to 128
– SMCLK Derived From MCLK With
Programmable Prescalar of 1, 2, 4, or 8
• General Input/Output and Pin Functionality
– 12 I/Os on 16-Pin Package
– 8 Interrupt Pins (4 Pins of P1 and 4 Pins of P2)
Can Wake MCU From LPMs
– All I/Os are Capacitive Touch I/Os
• Development Tools and Software (Also See Tools
and Software)
– Free Professional Development Environments
– Development Kits (MSP-TS430PW20,
MSPFET430U20, MSPEXP430FR2311, and
MSPEXP430FR4133)
• Family Members (Also See Device Comparison)
– MSP430FR2111: 3.75KB of Program FRAM +
1KB of RAM
– MSP430FR2110: 2KB of Program FRAM +
1KB of RAM
– MSP430FR2100: 1KB of Program FRAM +
512 Bytes of RAM
– MSP430FR2000: 0.5KB of Program FRAM +
512 Bytes of RAM
• Package Options
– 16-Pin: TSSOP (PW16)
– 24-Pin: VQFN (RLL)
• For Complete Module Descriptions, See the
MSP430FR4xx and MSP430FR2xx Family User's
Guide
1.2 Applications
• Appliance Battery Packs
• Smoke and Heat Detectors
• Door and Window Sensors
• Lighting Sensors
1
• Power Monitoring
• Personal Care Electronics Portable
• Health and Fitness Devices
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

MSP430FR2111
MSP430FR2111, MSP430FR2110, MSP430FR2100, MSP430FR2000
SLASE78C – AUGUST 2016 – REVISED AUGUST 2018
www.ti.com
1.3 Description
MSP430FR2000 and MSP430FR21xx devices are part of the MSP430™ microcontroller (MCU) value line
sensing portfolio. This ultra-low-power, low-cost MCU family offers memory sizes from 0.5KB to 4KB of
FRAM unified memory with several package options including a small 3-mm×3-mm VQFN package. The
architecture, FRAM, and integrated peripherals, combined with extensive low-power modes, are optimized
to achieve extended battery life in portable, battery-powered sensing applications. MSP430FR2000 and
MSP430FR21xx devices offer a migration path for 8-bit designs to gain additional features and
functionality from peripheral integration and the data-logging and low-power benefits of FRAM.
Additionally, existing designs using MSP430G2x MCUs can migrate to the MSP430FR2000 and
MSP430F21xx family to increase performance and get the benefits of FRAM.
The MSP430FR2000 and MSP430FR21xx MCUs feature a powerful 16-bit RISC CPU, 16-bit registers,
and a constant generator that contribute to maximum code efficiency. The digitally controlled oscillator
(DCO) also allows the device to wake up from low-power modes to active mode typically in less than
10 μs. The feature set of this MCU meets the needs of applications ranging from appliance battery packs
and battery monitoring to smoke detectors and fitness accessories.
The MSP ultra-low-power (ULP) FRAM microcontroller platform combines uniquely embedded FRAM and
a holistic ultra-low-power system architecture, allowing system designers to increase performance while
lowering energy consumption. FRAM technology combines the low-energy fast writes, flexibility, and
endurance of RAM with the nonvolatile behavior of flash.
MSP430FR2000 and MSP430FR21x MCUs are supported by an extensive hardware and software
ecosystem with reference designs and code examples to get your design started quickly. Development
kits include the MSP-EXP430FR2311 and MSP430FR4133 LaunchPad™ development kit and the
MSPTS430PW20 20-pin target development board. TI also provides free MSP430Ware™ software,
which is available as a component of Code Composer Studio™ IDE desktop and cloud versions within TI
Resource Explorer. The MSP430 MCUs are also supported by extensive online collateral, training, and
online support through the E2E™ Community Forum.
PART NUMBER
Device Information(1)
PACKAGE
BODY SIZE(2)
MSP430FR2111IPW16
MSP430FR2110IPW16
MSP430FR2100IPW16
TSSOP (16)
5 mm × 4.4 mm
MSP430FR2000IPW16
MSP430FR2111IRLL
MSP430FR2110IRLL
MSP430FR2100IRLL
VQFN (24)
3 mm × 3 mm
MSP430FR2000IRLL
(1) For the most current part, package, and ordering information, see the Package Option Addendum in
Section 9, or see the TI website at www.ti.com.
(2) The sizes shown here are approximations. For the package dimensions with tolerances, see the
Mechanical Data in Section 9.
CAUTION
System-level ESD protection must be applied in compliance with the device-
level ESD specification to prevent electrical overstress or disturbing of data or
code memory. See MSP430™ System-Level ESD Considerations for more
information.
2 Device Overview
Copyright © 2016–2018, Texas Instruments Incorporated
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Product Folder Links: MSP430FR2111 MSP430FR2110 MSP430FR2100 MSP430FR2000


Features Product Folder Order Now Technical Doc uments Tools & Software Support & Com munity Reference Design MSP430FR2111, MSP430FR2110, MSP430FR2100, MSP430FR20 00 SLASE78C – AUGUST 2016 – REVISED AUGUST 2018 MSP430FR21xx, MSP430FR2000 Mixed-Signal Microcontrollers 1 Devic e Overview 1.1 Features 1 • Embedded Microcontroller – 16-Bit RISC Archit ecture up to 16 MHz – Wide Supply Vol tage Range From 3.6 V Down to 1.8 V (Mi nimum Supply Voltage is Restricted by S VS Levels, See the SVS Specifications) • Optimized Low-Power Modes (at 3 V) – Active Mode: 120 µA/MHz – Standb y – LPM3.5 With VLO: 1 µA – Real-T ime Clock (RTC) Counter (LPM3.5 With 32 768-Hz Crystal): 1 µA – Shutdown (LP M4.5): 34 nA Without SVS • High-Perfo rmance Analog – 8-Channel 10-Bit Anal og-to-Digital Converter (ADC) – Integ rated Temperature Sensor – Internal 1 .5-V Reference – Sample-and-Hold 200 ksps – Enhanced Comparator (eCOMP) Integrated 6-Bit DAC as Reference Voltage – Programmable Hysteresis – Configurable High-Power and Lo.
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