SAMS70Q19 MCUs Datasheet

SAMS70Q19 Datasheet PDF, Equivalent


Part Number

SAMS70Q19

Description

32-bit ARM Cortex-M7 MCUs

Manufacture

Microchip

Total Page 30 Pages
PDF Download
Download SAMS70Q19 Datasheet PDF


SAMS70Q19
SAM E70/S70/V70/V71 Family
32-bit ARM Cortex-M7 MCUs with FPU, Audio and
Graphics Interfaces, High-Speed USB, Ethernet, and
Advanced Analog
Features
Core
• ARM® Cortex®-M7 running at up to 300 MHz
• 16 Kbytes of I-Cache and 16 Kbytes of D-Cache with Error Code Correction (ECC)
• Single-precision and double-precision HW Floating Point Unit (FPU)
• Memory Protection Unit (MPU) with 16 zones
• DSP Instructions, Thumb®-2 Instruction Set
• Embedded Trace Module (ETM) with instruction trace stream, including Trace Port Interface Unit (TPIU)
Memories
• Up to 2048 Kbytes embedded Flash with unique identifier and user signature for user-defined data
• Up to 384 Kbytes embedded Multi-port SRAM
• Tightly Coupled Memory (TCM)
• 16 Kbytes ROM with embedded Bootloader routines (UART0, USB) and IAP routines
• 16-bit Static Memory Controller (SMC) with support for SRAM, PSRAM, LCD module, NOR and NAND Flash
with on-the-fly scrambling
• 16-bit SDRAM Controller (SDRAMC) interfacing up to 256 MB and with on-the-fly scrambling
System
• Embedded voltage regulator for single-supply operation
• Power-on-Reset (POR), Brown-out Detector (BOD) and Dual Watchdog for safe operation
• Quartz or ceramic resonator oscillators: 3 MHz to 20 MHz main oscillator with failure detection, 12 MHz or 16
MHz needed for USB operations. Optional low-power 32.768 kHz for RTC or device clock
• RTC with Gregorian calendar mode, waveform generation in low-power modes
• RTC counter calibration circuitry compensates for 32.768 kHz crystal frequency variations
• 32-bit low-power Real-time Timer (RTT)
• High-precision Main RC oscillator with 12 MHz default frequency.
• 32.768 kHz crystal oscillator or Slow RC oscillator as source of low-power mode device clock (SLCK)
• One 500 MHz PLL for system clock, one 480 MHz PLL for USB high-speed operations
• Temperature Sensor
• One dual-port 24-channel central DMA Controller (XDMAC)
Low-Power Features
• Low-power sleep, wait and backup modes, with typical power consumption down to 1.1 μA in Backup mode with
RTC, RTT and wakeup logic enabled
• Ultra low-power RTC and RTT
• 1 Kbyte of backup RAM (BRAM) with dedicated regulator
Peripherals
© 2019 Microchip Technology Inc.
Datasheet
DS60001527D-page 1

SAMS70Q19
SAM E70/S70/V70/V71 Family
• One Ethernet MAC (GMAC) 10/100 Mbps in MII mode and RMII with dedicated DMA. IEEE1588 PTP frames
and 802.3az Energy-efficiency support. Ethernet AVB support with IEEE802.1AS Timestamping and
IEEE802.1Qav credit-based traffic-shaping hardware support.
• USB 2.0 Device/Mini Host High-speed (USBHS) at 480 Mbps, 4-Kbyte FIFO, up to 10 bidirectional endpoints,
dedicated DMA
• 12-bit ITU-R BT. 601/656 Image Sensor Interface (ISI)
• Two master Controller Area Networks (MCAN) with Flexible Data Rate (CAN-FD) with SRAM-based mailboxes,
time-triggered and event-triggered transmission
• MediaLB® device with 3-wire mode, up to 1024 x Fs speed, supporting MOST25 and MOST50 networks
• Three USARTs, USART0, USART1, USART2, support LIN mode, ISO7816, IrDA®, RS-485, SPI, Manchester
and Modem modes; USART1 supports LON mode.
• Five 2-wire UARTs with SleepWalkingsupport
• Three Two-Wire Interfaces (TWIHS) (I2C-compatible) with SleepWalking support
• Quad I/O Serial Peripheral Interface (QSPI) interfacing up to 256 MB Flash and with eXecute-In-Place and on-
the-fly scrambling
• Two Serial Peripheral Interfaces (SPI)
• One Serial Synchronous Controller (SSC) with I2S and TDM support
• Two Inter-IC Sound Controllers (I2SC)
• One High-speed Multimedia Card Interface (HSMCI) (SDIO/SD Card/e.MMC)
• Four Three-Channel 16-bit Timer/Counters (TC) with Capture, Waveform, Compare and PWM modes, constant
on time. Quadrature decoder logic and 2-bit Gray Up/Down Counter for stepper motor
• Two 4-channel 16-bit PWMs with complementary outputs, Dead Time Generator and eight fault inputs per PWM
for motor control, two external triggers to manage power factor correction (PFC), DC-DC and lighting control.
• Two Analog Front-End Controllers (AFEC), each supporting up to 12 channels with differential input mode and
programmable gain stage, allowing dual sample-and-hold (S&H) at up to 1.7 Msps. Offset and gain error
correction feature.
• One 2-channel, 12-bit, 1 Msps-per-channel Digital-to-Analog Controller (DAC) with Differential and Over
Sampling modes
• One Analog Comparator Controller (ACC) with flexible input selection, selectable input hysteresis
Cryptography
• True Random Number Generator (TRNG)
• AES: 256-bit, 192-bit, 128-bit Key Algorithm, Compliant with FIPS PUB-197 Specifications
• Integrity Check Monitor (ICM). Supports Secure Hash Algorithm SHA1, SHA224 and SHA256.
I/O
• Up to 114 I/O lines with external interrupt capability (edge- or level-sensitivity), debouncing, glitch filtering and
On-die Series Resistor Termination
• Five Parallel Input/Output Controllers (PIO)
Voltage
• Single supply voltage from 3.0V to 3.6V for Qualification AEC - Q100 Grade 2 Devices
• Single Supply voltage from 1.7V to 3.6V for Industrial Temperature Devices
Packages
• LQFP144, 144-lead LQFP, 20x20 mm, pitch 0.5 mm
• LFBGA144, 144-ball LFBGA, 10x10 mm, pitch 0.8 mm
• TFBGA144, 144-ball TFBGA, 10x10 mm, pitch 0.8 mm
• UFBGA144, 144-ball UFBGA, 6x6 mm, pitch 0.4 mm
• LQFP100, 100-lead LQFP, 14x14 mm, pitch 0.5 mm
• TFBGA100, 100-ball TFBGA, 9x9 mm, pitch 0.8 mm
• VFBGA100, 100-ball VFBGA, 7x7 mm, pitch 0.65 mm
• LQFP64, 64-lead LQFP, 10x10 mm, pitch 0.5 mm
• QFN64, 64-pad QFN 9x9 mm, pitch 0.5 mm with wettable flanks
© 2019 Microchip Technology Inc.
Datasheet
DS60001527D-page 2


Features SAM E70/S70/V70/V71 Family 32-bit ARM Co rtex-M7 MCUs with FPU, Audio and Graphi cs Interfaces, High-Speed USB, Ethernet , and Advanced Analog Features Core ARM® Cortex®-M7 running at up to 30 0 MHz • 16 Kbytes of I-Cache and 16 K bytes of D-Cache with Error Code Correc tion (ECC) • Single-precision and dou ble-precision HW Floating Point Unit (F PU) • Memory Protection Unit (MPU) wi th 16 zones • DSP Instructions, Thumb ®-2 Instruction Set • Embedded Trace Module (ETM) with instruction trace st ream, including Trace Port Interface Un it (TPIU) Memories • Up to 2048 Kbyte s embedded Flash with unique identifier and user signature for user-defined da ta • Up to 384 Kbytes embedded Multi- port SRAM • Tightly Coupled Memory (T CM) • 16 Kbytes ROM with embedded Boo tloader routines (UART0, USB) and IAP r outines • 16-bit Static Memory Contro ller (SMC) with support for SRAM, PSRAM , LCD module, NOR and NAND Flash with o n-the-fly scrambling • 16-bit SDRAM Controller (SDRAMC) interfacing up to 256 MB and wit.
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