LDC1312 Converter Datasheet

LDC1312 Datasheet PDF, Equivalent


Part Number

LDC1312

Description

Multi-Channel 12-Bit Inductance to Digital Converter

Manufacture

etcTI

Total Page 30 Pages
Datasheet
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LDC1312
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LDC1312, LDC1314
SNOSCZ0A – DECEMBER 2014 – REVISED MARCH 2018
LDC1312, LDC1314 Multi-Channel 12-Bit Inductance to Digital Converter (LDC) for
Inductive Sensing
1 Features
1 Easy-to-Use – Minimal Configuration Required
• Up to 4 Channels With Matched Sensor Drive
• Multiple Channels Support Environmental and
Aging Compensation
• Remote Sensor Position of >20 cm Supports
Operation In Harsh Environments
• Pin-Compatible Medium and High-Resolution
Options:
– LDC1312/4: 2/4-ch 12-Bit LDC
– LDC1612/4: 2/4-ch 28-Bit LDC
• Supports Wide Sensor Frequency Range of 1 kHz
to 10 MHz
• Power Consumption:
– 35 µA Low Power Sleep Mode
– 200 nA Shutdown Mode
• 2.7 V to 3.6 V Operation
• Multiple Reference Clocking Options:
– Included Internal Clock For Lower System
Cost
– Support for 40 MHz External Clock For Higher
System performance
• Immunity to DC Magnetic Fields and Magnets
2 Applications
• Knobs in Consumer, Appliances, and Automotive
• Linear and Rotational Encoders
• Buttons in Home Electronics, Wearables,
Manufacturing, and Automotive
• Keypads in Manufacturing and Appliances
• Slider Buttons in Consumer Products
• Metal Detection in Industrial and Automotive
• POS and EPOS
• Flow Meters in Consumer and Appliances
Simplified Schematic
40 MHz
CLKIN
Target
Sensor 0
IN0A
IN0B
Target
Sensor 1
IN1A
IN1B
GND
LDC1312
3.3 V
VDD
SD
INTB
3.3 V
GPIO
GPIO
MCU
VDD
Core
SDA
I2C SCL
ADDR
3.3 V
I2C
Peripheral
GND
Copyright © 2016, Texas Instruments Incorporated
1
3 Description
The LDC1312 and LDC1314 are 2- and 4-channel,
12-bit inductance to digital converters (LDCs) for
inductive sensing solutions. With multiple channels
and support for remote sensing, the LDC1312 and
LDC1314 enable the performance and reliability
benefits of inductive sensing to be realized at minimal
cost and power. The products are easy to use, only
requiring that the sensor frequency be within 1 kHz
and 10 MHz to begin sensing. The wide 1 kHz to 10
MHz sensor frequency range also enables use of
very small PCB coils, further reducing sensing
solution cost and size.
The LDC1312 and LDC1314 offer well-matched
channels, which allow for differential and ratiometric
measurements. This enables designers to use one
channel to compensate their sensing for
environmental and aging conditions such as
temperature, humidity, and mechanical drift. Given
their ease of use, low power, and low system cost
these products enable designers to greatly improve
on existing sensing solutions and to introduce brand
new sensing capabilities to products in all markets,
especially consumer and industrial applications.
Inductive sensing offers better performance,
reliability, and flexibility than competitive sensing
technologies at lower system cost and power.
The LDC1312 and LDC1314 are easily configured via
an I2C interface. The two-channel LDC1312 is
available in a WSON-12 package and the four-
channel LDC1314 is available in a WQFN-16
package.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LDC1312
WSON-12
4 mm × 4 mm
LDC1314
WQFN-16
4 mm × 4 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Measurement Precision vs. Target Distance
2.5
2.25
2
1.75
1.5
1.25
1
0.75
0.5
0.25
0
0
10% 20% 30% 40% 50% 60%
Sensing Range (Target Distance / SENSOR)
70%
D001
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

LDC1312
LDC1312, LDC1314
SNOSCZ0A – DECEMBER 2014 – REVISED MARCH 2018
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings ............................................................ 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information ................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Switching Characteristics - I2C ................................. 6
6.7 Typical Characteristics .............................................. 7
7 Detailed Description .............................................. 9
7.1 Overview ................................................................... 9
7.2 Functional Block Diagram ......................................... 9
7.3 Feature Description................................................... 9
7.4 Device Functional Modes........................................ 11
7.5 Programming........................................................... 12
7.6 Register Maps ......................................................... 14
8 Application and Implementation ........................ 31
8.1 Application Information............................................ 31
8.2 Typical Application ................................................. 47
9 Power Supply Recommendations...................... 51
10 Layout................................................................... 52
10.1 Layout Guidelines ................................................. 52
10.2 Layout Example .................................................... 52
11 Device and Documentation Support ................. 53
11.1 Device Support...................................................... 53
11.2 Documentation Support ........................................ 53
11.3 Related Links ........................................................ 53
11.4 Receiving Notification of Documentation Updates 53
11.5 Community Resources.......................................... 53
11.6 Trademarks ........................................................... 54
11.7 Electrostatic Discharge Caution ............................ 54
11.8 Glossary ................................................................ 54
12 Mechanical, Packaging, and Orderable
Information ........................................................... 54
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (December 2014) to Revision A
Page
• Changed ESD values from 1000 to 2000 and from 250 to 750 on both packages................................................................ 4
• Added logic levels for ADDR, INTB, and SD pins. ................................................................................................................. 5
• Changed description of clocking architecture for improved clarity. ..................................................................................... 10
• Changed register names and field names from CHx_NAME and NAME_CHx to NAMEx. ................................................ 14
• Added instructions on setting registers with both R and R/W fields..................................................................................... 14
• Changed register names from DATA_CHx to DATAx; and CHx_ERR_YY field names to ERR_YYx. ............................... 15
• Changed ERR_AE field description on DATA0, DATA1, DATA2 and DATA3 tables. ......................................................... 15
• Changed register names from RCOUNT_CHx to RCOUNTx; and CHx_RCOUNT field names to RCOUNTx .................. 17
• Changed register names from OFFSET_CHx to OFFSETx; and CHx_OFFSET field names to OFFSETx ...................... 18
• Changed register names from SETTLECOUNT_CHx to SETTLECOUNTx; and CHx_SETTLECOUNT field names to
SETTLECOUNTx ................................................................................................................................................................. 19
• Changed Address of SETTLECOUNT0 and SETTLECOUNT1 were not correct on table. ................................................ 20
• Changed register names from CLOCK_DIVIDERS_CHx to CLOCK_DIVIDERSx; CHx_FIN_DIVIDER field names to
FIN_DIVIDERx, and CHx_FREF_DIVIDER field names to FREF_DIVIDERx. ................................................................... 21
• Changed CHx_UNREADCONV field names to UNREADCONVx ...................................................................................... 23
• Changed register names from DRIVE_CURRENT_CHx to DRIVE_CURRENTx; CHx_IDRIVE field names to
IDRIVEx, and CHx_INIT_IDRIVE to INIT_IDRIVEx ............................................................................................................ 28
• Changed Application Information section for clarity, and provided additional information on device configuration and
operation. ............................................................................................................................................................................. 31
• Added instructions for using an oscilloscope to configure sensor drive current .................................................................. 42
• Changed description of clocking usage for clarity. .............................................................................................................. 43
• Changed reference frequency limits from < to .................................................................................................................. 44
• Changed to a symbol in the Clock Configuration Requirements table. ............................................................................ 44
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Features Product Folder Order Now Technical Doc uments Tools & Software Support & Com munity LDC1312, LDC1314 SNOSCZ0A – D ECEMBER 2014 – REVISED MARCH 2018 LDC 1312, LDC1314 Multi-Channel 12-Bit Indu ctance to Digital Converter (LDC) for I nductive Sensing 1 Features •1 Easy- to-Use – Minimal Configuration Requir ed • Up to 4 Channels With Matched Se nsor Drive • Multiple Channels Suppor t Environmental and Aging Compensation • Remote Sensor Position of >20 cm Su pports Operation In Harsh Environments • Pin-Compatible Medium and High-Reso lution Options: – LDC1312/4: 2/4-ch 1 2-Bit LDC – LDC1612/4: 2/4-ch 28-Bit LDC • Supports Wide Sensor Frequency Range of 1 kHz to 10 MHz • Power Cons umption: – 35 µA Low Power Sleep Mod e – 200 nA Shutdown Mode • 2.7 V to 3.6 V Operation • Multiple Reference Clocking Options: – Included Interna l Clock For Lower System Cost – Suppo rt for 40 MHz External Clock For Higher System performance • Immunity to DC Magnetic Fields and Magnets 2 Applications • Knobs in Consume.
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