LDC1614 Converter Datasheet

LDC1614 Datasheet PDF, Equivalent


Part Number

LDC1614

Description

Multi-Channel 28-Bit Inductance to Digital Converter

Manufacture

etcTI

Total Page 30 Pages
Datasheet
Download LDC1614 Datasheet


LDC1614
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LDC1612, LDC1614
SNOSCY9A – DECEMBER 2014 – REVISED MARCH 2018
LDC1612, LDC1614 Multi-Channel 28-Bit Inductance to Digital Converter (LDC) for
Inductive Sensing
1 Features
1 Easy-to-Use – Minimal Configuration Required
• Up to 4 Channels With Matched Sensor Drive
• Multiple Channels Support Environmental and
Aging Compensation
• Remote Sensor Position of >20 cm Supports
Operation In Harsh Environments
• Pin-Compatible Medium and High-Resolution
Options:
– LDC1312/4: 2/4-ch 12-Bit LDC
– LDC1612/4: 2/4-ch 28-Bit LDC
• Sensing Range Beyond Two Coil Diameters
• Supports Wide Sensor Frequency Range of 1 kHz
to 10 MHz
• Power Consumption:
– 35 µA Low Power Sleep Mode
– 200 nA Shutdown Mode
• 2.7 V to 3.6 V Operation
• Multiple Reference Clocking Options:
– Included Internal Clock For Lower System
Cost
– Support for 40 MHz External Clock For Higher
System performance
• Immunity to DC Magnetic Fields and Magnets
2 Applications
• Knobs in Consumer, Appliances, and Automotive
• Buttons in Home Electronics, Wearables,
Manufacturing, and Automotive
• Keypads in Manufacturing and Appliances
• Slider Buttons in Consumer Products
• Metal Detection in Industrial and Automotive
• POS and EPOS
Simplified Schematic
40 MHz
CLKIN
Target
Sensor 0
IN0A
IN0B
Target
Sensor 1
IN1A
IN1B
GND
LDC1612
3.3 V
VDD
SD
INTB
3.3 V
GPIO
GPIO
MCU
VDD
Core
SDA
I2C SCL
ADDR
3.3 V
I2C
Peripheral
GND
Copyright © 2016, Texas Instruments Incorporated
3 Description
The LDC1612 and LDC1614 are 2- and 4-channel,
28-bit inductance to digital converters (LDCs) for
inductive sensing solutions. With multiple channels
and support for remote sensing, the LDC1612 and
LDC1614 enable the performance and reliability
benefits of inductive sensing to be realized at minimal
cost and power. The products are easy to use, only
requiring that the sensor frequency be within 1 kHz
and 10 MHz to begin sensing. The wide 1 kHz to 10
MHz sensor frequency range also enables use of
very small PCB coils, further reducing sensing
solution cost and size.
The high resolution channels allow for a much larger
sensing range, maintaining good performance
beyond two coil diameters. Well-matched channels
allow for differential and ratiometric measurements,
which enable designers to use one channel to
compensate their sensing for environmental and
aging conditions such as temperature, humidity, and
mechanical drift.
Given their ease of use, low power, and low system
cost these products enable designers to greatly
improve performance, reliability, and flexibility over
existing sensing solutions and to introduce brand new
sensing capabilities to products in all markets,
especially consumer and industrial applications.
These devices are easily configured via an I2C
interface. The two-channel LDC1612 is available in a
WSON-12 package and the four-channel LDC1614 is
available in a WQFN-16 package.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LDC1612
WSON-12
4 mm × 4 mm
LDC1614
WQFN-16
4 mm × 4 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Measurement Precision vs. Target Distance
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
0
20%
40%
60%
80%
Sensing Range (Target Distance / SENSOR)
100%
D002
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

LDC1614
LDC1612, LDC1614
SNOSCY9A – DECEMBER 2014 – REVISED MARCH 2018
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 4
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings ............................................................ 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information ................................................. 5
6.5 Electrical Characteristics........................................... 6
6.6 Switching Characteristics - I2C ................................. 7
6.7 Typical Characteristics .............................................. 8
7 Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 12
7.5 Programming........................................................... 13
7.6 Register Maps ......................................................... 15
8 Application and Implementation ........................ 34
8.1 Application Information............................................ 34
8.2 Typical Application ................................................. 49
9 Power Supply Recommendations...................... 53
10 Layout................................................................... 54
10.1 Layout Guidelines ................................................. 54
10.2 Layout Example .................................................... 54
11 Device and Documentation Support ................. 55
11.1 Device Support...................................................... 55
11.2 Documentation Support ........................................ 55
11.3 Related Links ........................................................ 55
11.4 Receiving Notification of Documentation Updates 55
11.5 Community Resources.......................................... 55
11.6 Trademarks ........................................................... 56
11.7 Electrostatic Discharge Caution ............................ 56
11.8 Glossary ................................................................ 56
12 Mechanical, Packaging, and Orderable
Information ........................................................... 56
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (December 2014) to Revision A
Page
• Changed ESD values from 1000 to 2000 and from 250 to 750 on both packages................................................................ 5
• Added logic levels for ADDR, INTB, and SD pins. ................................................................................................................. 6
• Changed description of clocking architecture for improved clarity. ..................................................................................... 11
• Changed register names and field names from CHx_NAME and NAME_CHx to NAMEx. ................................................ 15
• Added instructions on setting registers with both R and R/W fields..................................................................................... 15
• Changed register names from DATA_MSB_CHx to DATAx_MSB; DATA_LSB_CHx register names to DATAx_LSB,
and CHx_ERR_YY field names to ERR_YYx. ..................................................................................................................... 16
• Changed ERR_AE field description on DATA_MSB_CH0, DATA_MSB_CH1, DATA_MSB_CH2 and
DATA_MSB_CH3 tables....................................................................................................................................................... 16
• Changed register names from RCOUNT_CHx to RCOUNTx; and CHx_RCOUNT field names to RCOUNTx .................. 20
• Changed register names from OFFSET_CHx to OFFSETx; and CHx_OFFSET field names to OFFSETx ...................... 21
• Changed register names from SETTLECOUNT_CHx to SETTLECOUNTx; and CHx_SETTLECOUNT field names to
SETTLECOUNTx ................................................................................................................................................................. 22
• Changed Address of SETTLECOUNT0 and SETTLECOUNT1 were not correct on table. ................................................ 23
• Changed register names from CLOCK_DIVIDERS_CHx to CLOCK_DIVIDERSx; CHx_FIN_DIVIDER field names to
FIN_DIVIDERx, and CHx_FREF_DIVIDER field names to FREF_DIVIDERx. ................................................................... 24
• Changed CHx_UNREADCONV field names to UNREADCONVx ...................................................................................... 26
• Changed register names from DRIVE_CURRENT_CHx to DRIVE_CURRENTx; CHx_IDRIVE field names to
IDRIVEx, and CHx_INIT_IDRIVE to INIT_IDRIVEx ............................................................................................................ 31
• Changed Application Information section for clarity, and provided additional information on device configuration and
operation. ............................................................................................................................................................................. 34
• Changed Equations in the L-C Resonators section. ............................................................................................................ 35
• Changed RP to RS in Equation ............................................................................................................................................ 35
• Changed IDRIVEx values ..................................................................................................................................................... 42
• Added instructions for using an oscilloscope to configure sensor drive current .................................................................. 44
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Product Folder Links: LDC1612 LDC1614


Features Product Folder Order Now Technical Doc uments Tools & Software Support & Com munity LDC1612, LDC1614 SNOSCY9A – D ECEMBER 2014 – REVISED MARCH 2018 LDC 1612, LDC1614 Multi-Channel 28-Bit Indu ctance to Digital Converter (LDC) for I nductive Sensing 1 Features •1 Easy- to-Use – Minimal Configuration Requir ed • Up to 4 Channels With Matched Se nsor Drive • Multiple Channels Suppor t Environmental and Aging Compensation • Remote Sensor Position of >20 cm Su pports Operation In Harsh Environments • Pin-Compatible Medium and High-Reso lution Options: – LDC1312/4: 2/4-ch 1 2-Bit LDC – LDC1612/4: 2/4-ch 28-Bit LDC • Sensing Range Beyond Two Coil D iameters • Supports Wide Sensor Frequ ency Range of 1 kHz to 10 MHz • Power Consumption: – 35 µA Low Power Slee p Mode – 200 nA Shutdown Mode • 2.7 V to 3.6 V Operation • Multiple Refe rence Clocking Options: – Included In ternal Clock For Lower System Cost – Support for 40 MHz External Clock For Higher System performance • Immunity to DC Magnetic Fields and M.
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