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DRV8821
SLVS912J – JANUARY 2009 – REVISED JANUARY 2016
DRV8821 Dual Stepper Motor Controller and Driver
1 Features
•1 Dual PWM Microstepping Motor Driver – Built-In Microstepping Indexers – Up to 1.5-A Current Per Winding – Three-Bit Winding Current Control Allows up to Eight Current Levels – Low MOSFET On-Resistance – Selectable Slow or Mixed Decay Modes
• 8-V to 32-V Operating Supply Voltage Range • Internal Charge Pump for Gate Drive • Built-in 3.3-V Reference • Simple Step/Direction Interface • Fully Protected Against Undervoltage,
Overtemperature, and Overcurrent • Thermally-Enhanced Surface Mount Package
2 Applications
• Printers • Scanners • Office Automation Machines • Gaming Machines • Factory Automation • Robotics
3 Description
The DRV8821 provides a dual microstepping-capable stepper motor controller/driver solution for printers, scanners, and other office automation equipment applications.
Two independent stepper motor driver circuits include four H-bridge drivers and microstepping-capable indexer logic. Each of the motor driver blocks employ N-channel power MOSFETs configured as an Hbridge to drive the motor windings.
A simple step/direction interface allows easy interfacing to controller circuits. Pins allow configuration of the motor in full-step, half-step, quarter-step, or eighth step modes, and the selection of slow or mixed decay modes.
Internal shutdown functions are provided for over current protection, short-circuit protection, undervoltage lockout, and overtemperature.
The DRV8821 is packaged in a 48-pin HTSSOP package (Eco-friendly : RoHS & no Sb/Br).
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
DRV8821
HTSSOP (48)
6.10 mm x 12.50 mm
(1) For all available packages, see the orderable addendum at the end of the datasheet.
Simplified Schematic
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA.
DRV8821
SLVS912J – JANUARY 2009 – REVISED JANUARY 2016
www.ti.com
Table of Contents
1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Pin Configuration and Functions ......................... 3 6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ..................................... 4 6.2 ESD Ratings.............................................................. 4 6.3 Recommended Operating Conditions....................... 5 6.4 Thermal Information .................................................. 5 6.5 Electrical Characteristics........................................... 5 6.6 Timing Requirements ................................................ 6 6.7 Dissipation Ratings ................................................... 6 6.8 Typical Characteristics .............................................. 7 7 Detailed Description .............................................. 9 7.1 Overview ................................................................... 9 7.2 Functional Block Diagram ....................................... 10 7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 14 8 Application and Implementation ........................ 16
8.1 Application Information............................................ 16 8.2 Typical Application ................................................. 16 9 Power Supply Recommendations...................... 19 9.1 Bulk Capacitance .................................................... 19 10 Layout................................................................... 20 10.1 Layout Guidelines ................................................. 20 10.2 Layout Example .................................................... 21 10.3 Thermal Considerations ........................................ 22 11 Device and Documentation Support ................. 24 11.1 Documentation Support ....................................... 24 11.2 Community Resources.......................................... 24 11.3 Trademarks ........................................................... 24 11.4 Electrostatic Discharge Caution ............................ 24 11.5 Glossary ................................................................ 24 12 Mechanical, Packaging, and Orderable Information ........................................................... 24
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision .