LSF0108 Translator Datasheet

LSF0108 Datasheet PDF, Equivalent


Part Number

LSF0108

Description

1/2/8 Channel Auto-Bidirectional Multi-Voltage Level Translator

Manufacture

etcTI

Total Page 30 Pages
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Download LSF0108 Datasheet PDF


LSF0108
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LSF0101, LSF0102, LSF0108
SDLS966I – DECEMBER 2013 – REVISED JULY 2019
LSF010x 1/2/8 Channel Auto-Bidirectional Multi-Voltage Level Translator for Open-Drain
and Push-Pull Applications
1 Features
1 Provides bidirectional voltage translation with no
direction pin
• Supports up to 100-MHz up translation and
greater than 100-MHz down translation at
30pF cap load and up To 40-MHz up/down
translation at 50pF cap load
• Allows bidirectional voltage-level translation
between
– 0.95 V 1.8/2.5/3.3/5 V
– 1.2 V 1.8/2.5/3.3/5 V
– 1.8 V 2.5/3.3/5 V
– 2.5 V 3.3/5 V
– 3.3 V 5 V
• Low standby current
• 5-V tolerance I/O port to support TTL
• Low RON provides less signal distortion
• High-impedance I/O pins for EN = Low
• Flow-through pinout for easy PCB trace routing
• Latch-up performance >100 mA per JESD 17
• –40°C to 125°C Operating temperature range
2 Applications
• GPIO, MDIO, PMBus, SMBus, SDIO, UART, I2C,
and other interfaces in telecom infrastructure
• Enterprise Systems
• Communications Equipment
• Personal Electronics
• Industrial Applications
3 Description
The LSF family of devices supports bidirectional
voltage translation without the need for DIR pin which
minimizes system effort (for PMBus, I2C, SMBus,
etc.). The LSF family of devices supports up to 100-
MHz up translation and greater than 100-MHz down
translation at 30pF cap load and up to 40-MHz
up/down translation at 50pF cap load which allows
the LSF family to support more consumer or telecom
interfaces (MDIO or SDIO).
LSF family supports 5-V tolerance on I/O port which
makes it compatible with TTL levels in industrial and
telecom applications. The LSF family is able to set up
different voltage translation levels on each channel
which makes it very flexible.
Device Information(1)
PART NUMBER PACKAGE(PINS) BODY SIZE (NOM)
LSF0101DRY
SON (6)
1.45 mm × 1.00 mm
LSF0101DTQ
X2SON (6)
1.00 mm x 0.80 mm
LSF0102DQE
X2SON (8)
1.40 mm × 1.00 mm
LSF0102YZT
DSBGA (8)
1.90 mm × 1.00 mm
LSF0102DCT
SM8 (8)
2.80 mm × 2.95 mm
LSF0102DCU
VSSOP (8)
2.30 mm × 2.00 mm
LSF0108RKS
VQFN (20)
4.50 mm × 2.50 mm
LSF0108PW
TSSOP (20)
4.40 mm × 6.50 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
LSF0101
DTQ Package
6-Pin X2SON
Transparent Top View
DRY Package
6-Pin SON
Transparent Top View
GND EN
16
Vref_A 2 5 Vref_B
34
A1 B1
GND 1
Vref_A 2
A1 3
4 EN
5 Vref_B
6 B1
LSF0102
LSF0108
YZT Package
8-Pin DSBGA
Bottom View
A2 D1 D2 B2
A1 C1 C2 B1
Vref_A B1 B2 Vref_B
GND A1 A2 EN
DQE Package
8-Pin X2SON
Transparent Top View
GND 1
Vref_A 2
A1 3
A2 4
8 EN
7 Vref_B
6 B1
5 B2
RKS Package
20-Pin VQFN
Transparent Top View
GND EN
Vref_A 2
A1 3
A2 4
19 Vref_B
18 B1
17 B2
A3 5
A4 6
Thermal
Pad
16 B3
15 B4
A5 7
14 B5
A6 8
13 B6
A7 9
12 B7
A8 B8
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

LSF0108
LSF0101, LSF0102, LSF0108
SDLS966I – DECEMBER 2013 – REVISED JULY 2019
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 4
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings ............................................................ 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information: LSF0101, LSF0108................. 6
6.5 Thermal Information: LSF0102 ................................. 6
6.6 Electrical Characteristics........................................... 6
6.7 LSF0101/02 AC Performance (Translating Down)
Switching Characteristics , VGATE = 3.3 V ................. 7
6.8 LSF0108 AC Performance (Translating Down)
Switching Characteristics, VGATE = 3.3 V .................. 7
6.9 LSF0101/02 AC Performance (Translating Down)
Switching Characteristics, VGATE = 2.5 V .................. 7
6.10 LSF0108 AC Performance (Translating Down)
Switching Characteristics, VGATE = 2.5 V .................. 7
6.11 LSF0101/02 AC Performance (Translating Up)
Switching Characteristics, VGATE = 3.3 V .................. 7
6.12 LSF0108 AC Performance (Translating Up)
Switching Characteristics, VGATE = 3.3 V .................. 7
6.13 LSF0101/02 AC Performance (Translating Up)
Switching Characteristics, VGATE = 2.5 V .................. 8
6.14 LSF0108 AC Performance (Translating Up)
Switching Characteristics, VGATE = 2.5 V .................. 8
6.15 Typical Characteristics ............................................ 8
7 Parameter Measurement Information .................. 9
8 Detailed Description ............................................ 10
8.1 Overview ................................................................. 10
8.2 Functional Block Diagrams ..................................... 10
8.3 Feature Description................................................. 11
8.4 Device Functional Modes........................................ 12
9 Application and Implementation ........................ 12
9.1 Application Information............................................ 12
9.2 Typical Applications ................................................ 13
10 Power Supply Recommendations ..................... 16
11 Layout................................................................... 16
11.1 Layout Guidelines ................................................. 16
11.2 Layout Example .................................................... 16
12 Device and Documentation Support ................. 17
12.1 Related Links ........................................................ 17
12.2 Community Resources.......................................... 17
12.3 Trademarks ........................................................... 17
12.4 Electrostatic Discharge Caution ............................ 17
12.5 Glossary ................................................................ 17
13 Mechanical, Packaging, and Orderable
Information ........................................................... 17
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision H (June 2019) to Revision I
Page
• Changed product status from Advance Information mix to Production Data ........................................................................ 1
• Deleted Advance Information note from the DTQ package in the Device Information table. ............................................... 1
• Deleted Advance Information note from DTQ package in the Pin Configuration and Functions section. ............................. 4
• Deleted Advance Information note for the DTQ package in the Thermal Information table. ................................................ 6
Changes from Revision G (February 2016) to Revision H
Page
• Added Advance Information note to Device Information table for DTQ package ................................................................. 1
• Added DTQ6 pinout drawing to Pin Configurations and Functions section (Advance Information)....................................... 4
• Added Advance Information note to LSF0101 Thermal Information table. ........................................................................... 6
• General improvements to Application and Implementation section for clarity. .................................................................... 12
Changes from Revision F (October 2015) to Revision G
Page
• Added all available package dimensions in Device Information and changed the pin diagram description. ......................... 1
Changes from Revision E (July 2015) to Revision F
Page
• Changed Features from "Supports High Speed Translation, Greater Than 100 MHz" to "Supports Up to 100 MHz
Up Translation and Greater Than 100 MHz Down Translation at 30pF Cap Load and Up To 40 MHz Up/Down
Translation at 50 pF Cap Load." ........................................................................................................................................... 1
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Copyright © 2013–2019, Texas Instruments Incorporated
Product Folder Links: LSF0101 LSF0102 LSF0108


Features Product Folder Order Now Technical Doc uments Tools & Software Support & Com munity LSF0101, LSF0102, LSF0108 SDLS9 66I – DECEMBER 2013 – REVISED JULY 2019 LSF010x 1/2/8 Channel Auto-Bidirec tional Multi-Voltage Level Translator f or Open-Drain and Push-Pull Application s 1 Features •1 Provides bidirection al voltage translation with no directio n pin • Supports up to 100-MHz up tra nslation and greater than 100-MHz down translation at ≤ 30pF cap load and up To 40-MHz up/down translation at 50pF cap load • Allows bidirectional volta ge-level translation between – 0.95 V ↔ 1.8/2.5/3.3/5 V – 1.2 V ↔ 1.8/ 2.5/3.3/5 V – 1.8 V ↔ 2.5/3.3/5 V 2.5 V ↔ 3.3/5 V – 3.3 V ↔ 5 V • Low standby current • 5-V toleran ce I/O port to support TTL • Low RON provides less signal distortion • Hig h-impedance I/O pins for EN = Low • F low-through pinout for easy PCB trace r outing • Latch-up performance >100 mA per JESD 17 • –40°C to 125°C Operating temperature range 2 Applications • GPIO, MDIO, PMBus, SMBus, SDIO, .
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