W25Q512JV

W25Q512JV 3V 512M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI Publication Release Date: June 25, 2019 -Revision B W25Q512JV Table of Contents 1. GENERAL DESCRIPTIONS............................................................................................................. 5 2. FEATURES....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 6 3.1 Pad Configuration 8x6-mm................................................................................................... 6 3.2 Pad Description 8x6-mm ...................................................................................................... 6 3.3 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.4 Pin Description SOIC 300-mil............................................................................................... 7 3.5 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.6 Ball Description TFBGA 8x6-mm ......................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) ....................................