Humidity Sensor. HDC1008 Datasheet

HDC1008 Sensor. Datasheet pdf. Equivalent

Part HDC1008
Description High Accuracy Digital Humidity Sensor
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HDC1008
Product
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Support &
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HDC1008
SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015
HDC1008 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor
1 Features
1 Relative Humidity (RH) Operating Range 0% to
100%
• 14 Bit Measurement Resolution
• Relative Humidity Accuracy ±4%
• Temperature Accuracy ±0.2 °C
• 200 nA Sleep Mode Current
• Average Supply Current:
– 820 nA @ 1sps, 11 bit RH Measurement
– 1.2 µA @ 1sps, 11 bit RH and Temperature
Measurement
• Supply Voltage 3 V to 5 V
• Tiny 2 mm x 1.6 mm Device Footprint
• I2C Interface
2 Applications
• HVAC
• Smart Thermostats and Room Monitors
• White Goods
• Printers
• Handheld Meters
• Medical Devices
• Cargo Shipping
• Automotive Windshield Defog
• Wearable Devices
• Mobile Devices
3 Description
The HDC1008 is a digital humidity sensor with
integrated temperature sensor that provides excellent
measurement accuracy at very low power. The
device measures humidity based on a novel
capacitive sensor. The humidity and temperature
sensors are factory calibrated. The innovative
WLCSP (Wafer Level Chip Scale Package) simplifies
board design with the use of an ultra-compact
package. The sensing element of the HDC1008 is
placed on the bottom part of the device, which makes
the HDC1008 more robust against dirt, dust, and
other environmental contaminants. The HDC1008 is
functional within the full -40°C to +125°C temperature
range.
Device Information (1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
HDC1008
DSBGA (8-bump) 2.04 mm x 1.59 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
4 Typical Application
3.3V
3.3V
3.3V
RH
TEMPERATURE
HDC1008
ADC
Registers
+
Logic
VDD
SDA
SCL
I2C
DRDYn
ADR0
ADR1
OTP
Calibration Coefficients
GND
GPIO
MCU
I2C
Peripheral
VDD
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



HDC1008
HDC1008
SNAS649B – OCTOBER 2014 – REVISED DECEMBER 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Typical Application ................................................ 1
5 Revision History..................................................... 2
6 Pin Configuration and Functions ......................... 3
7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information .................................................. 4
7.5 Electrical Characteristics........................................... 5
7.6 I2C Interface Electrical Characteristics...................... 6
7.7 I2C Interface Timing Requirements ......................... 6
7.8 Typical Characteristics .............................................. 7
8 Detailed Description .............................................. 9
8.1 Overview ................................................................... 9
8.2 Functional Block Diagram ......................................... 9
8.3 Feature Description................................................... 9
8.4 Device Functional Modes.......................................... 9
8.5 Programming........................................................... 10
8.6 Register Map .......................................................... 14
9 Application and Implementation ........................ 16
9.1 Application Information............................................ 16
9.2 Typical Application ................................................. 16
9.3 Do's and Don'ts ...................................................... 18
10 Power Supply Recommendations ..................... 18
11 Layout................................................................... 19
11.1 Layout Guidelines ................................................. 19
11.2 Layout Example .................................................... 21
12 Device and Documentation Support ................. 22
12.1 Documentation Support ........................................ 22
12.2 Community Resources.......................................... 22
12.3 Trademarks ........................................................... 22
12.4 Electrostatic Discharge Caution ............................ 22
12.5 Glossary ................................................................ 22
13 Mechanical, Packaging, and Orderable
Information ........................................................... 22
5 Revision History
Changes from Revision A (November 2014) to Revision B
Page
• Deleted references to functional and operating temperature ranges. ................................................................................... 1
• Changed wording to clarify ..................................................................................................................................................... 3
• Moved Storage Temperature to Abs Max Rating Table ........................................................................................................ 4
• Changed Handling Ratings table to ESD Ratings table. ....................................................................................................... 4
• Added separate conditions for RH ........................................................................................................................................ 4
• Added RH condition ............................................................................................................................................................... 5
• Added figure reference. ......................................................................................................................................................... 5
• Added condition ..................................................................................................................................................................... 5
• Changed wording to clarify hysteresis definition ................................................................................................................... 5
• Changed recommended operating range .............................................................................................................................. 5
• Changed register reference for supply voltage monitoring. The original reference was incorrect ........................................ 9
• Added recommendation for recovery from soldering. ......................................................................................................... 18
Changes from Original (October 2014) to Revision A
Page
• Changed Datasheet's title ...................................................................................................................................................... 1
• Changed description............................................................................................................................................................... 1
• Changed overview ................................................................................................................................................................. 9
• Changed application information .......................................................................................................................................... 16
• Changed recovery from soldering ....................................................................................................................................... 18
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