FAN3214 Drivers Datasheet

FAN3214 Datasheet, PDF, Equivalent


Part Number

FAN3214

Description

Low-Side Gate Drivers

Manufacture

ON Semiconductor

Total Page 19 Pages
Datasheet
Download FAN3214 Datasheet


FAN3214
FAN3213 / FAN3214
Dual-4 A, High-Speed, Low-Side Gate Drivers
Features
Industry-Standard Pin Out
4.5 to 18 V Operating Range
5 A Peak Sink/Source at VDD = 12 V
4.3 A Sink / 2.8 A Source at VOUT = 6 V
TTL Input Thresholds
Tw o Versions of Dual Independent Drivers:
- Dual Inverting (FAN3213)
- Dual Non-Inverting (FAN3214)
Internal Resistors Turn Driver Off If No Inputs
MillerDrive™ Technology
12 ns / 9 ns Typical Rise/Fall Times w ith 2.2 nF
Load
Typical Propagation Delay Under 20 ns Matched
w ithin 1 ns to the Other Channel
Double Current Capability by Paralleling Channels
Standard SOIC-8 Package
Rated from 40°C to +125°C Ambient
Automotive Qualified to AEC-Q100 (F085 Version)
Applications
Sw itch-Mode Pow er Supplies
High-Efficiency MOSFET Sw itching
Synchronous Rectifier Circuits
DC-to-DC Converters
Motor Control
Automotive-Qualified Systems (F085 version)
Description
The FA N3213 and FAN3214 dual 4 A gate drivers are
designed to drive N-channel enhancement- mode
MOSFETs in low -side sw itching applications by
providing high peak current pulses dur ing the short
sw itching intervals. They are both available w ith TTL
input thresholds. Internal circuitry provides an under-
voltage lockout function by holding the output LOW until
the supply voltage is w ithin the operating range. In
addition, the drivers feature matched internal
propagation delays betw een A and B channels for
applications requir ing dual gate drives w ith critical
timing, such as synchronous rectifiers. This also
enables connecting tw o drivers in parallel to effectively
double the current capability driving a single MOSFET.
The FA N3213/14 drivers incorporate Miller Drive™
architecture for the final output stage. This bipolar-
MOSFET combination provides high current during the
Miller plateau stage of the MOSFET turn-on / turn-off
process to minimize sw itching loss, w hile providing rail-
to-rail voltage sw ing and reverse current capability.
The FAN3213 offers two inverting drivers and the
FA N3214 offers tw o non-inverting drivers. Both are
offered in a standard 8-pin SOIC package.
NC 1
INA 2
GND 3
INB 4
A
B
8 NC
7 OUTA
6 VDD
5 OUTB
NC 1
INA 2
GND 3
INB 4
A
B
8 NC
7 OUTA
6 VDD
5 OUTB
FAN3213
Figure 1. Pin Configurations
FAN3214
© 2008 Semiconductor Components Industries, LLC.
October-2017, Rev.2
Publication Order Number:
FAN3214 /D

FAN3214
Ordering Information
Part Number
Logic
FAN3213TMX
Dual Inverting Channels
FAN3214TMX
Dual Non-Inverting Channels
FA N3213TMX _F085(1)
Dual Inverting Channels
FA N3214TMX _F085(1)
Dual Non-Inverting Channels
Note :
1. Qualified to AEC-Q100
Input
Threshold
Package
Packing Quantity
Method per Reel
TTL
SOIC-8
Tape & Reel 2,500
Package Outlines
18
27
36
45
Figure 2. SOIC-8 (Top View )
Thermal Characteristics(2)
Package
8-Pin Small Outline Integrated Circuit (SOIC)
JL(3)
38
JT(4)
29
JA(5)
87
(6)
JB
41
(7)
JT
2.3
Unit
°C/W
Note s :
2. Estimates derived from thermal simulation; actual values depend on the application.
3. Theta_JL (JL): Thermal resistance betw een the semiconductor junction and the bottom surface of all the leads
(including any thermal pad) that are typically soldered to a PCB.
4. Theta_JT (JT): Thermal resistance betw een the semiconductor junction and the top surface of the package,
assuming it is held at a uniform temperature by a top-side heatsink.
5. Theta_JA (ΘJA): Thermal resistance betw een junction and ambient, dependent on the PCB design, heat sinking,
and airflow . The value given is for natural convection w ith no heatsink, using a 2S2P board, as specified in
JEDEC standards JESD51-2, JESD51-5, and JESD51-7, as appropriate.
6. Psi_JB (JB): Thermal characterization parameter providing correlation betw een semiconductor junction
temperature and an application circuit board reference point for the thermal environment defined in Note 5. For
the SOIC-8 package, the board reference is defined as the PCB copper adjacent to pin 6.
7. Psi_JT (JT): Thermal characterization parameter providing correlation betw een the semiconductor junction
temperature and the center of the top of the package for the thermal environment defined in Note 5.
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Features FAN3213 / FAN3214 — Dual-4A, High-Spee d, Low-Side Gate Drivers FAN3213 / FAN 3214 Dual-4 A, High-Speed, Low-Side Gat e Drivers Features  Industry-Standa rd Pin Out  4.5 to 18 V Operating Ra nge  5 A Peak Sink/Source at VDD = 1 2 V  4.3 A Sink / 2.8 A Source at VO UT = 6 V  TTL Input Thresholds  T w o Versions of Dual Independent Driver s: - Dual Inverting (FAN3213) - Dual No n-Inverting (FAN3214)  Internal Resi stors Turn Driver Off If No Inputs  MillerDrive™ Technology  12 ns / 9 ns Typical Rise/Fall Times w ith 2.2 n F Load  Typical Propagation Delay Un der 20 ns Matched w ithin 1 ns to the O ther Channel  Double Current Capabil ity by Paralleling Channels  Standar d SOIC-8 Package  Rated from –40° C to +125°C Ambient  Automotive Qua lified to AEC-Q100 (F085 Version) Appli cations  Sw itch-Mode Pow er Supplie s  High-Efficiency MOSFET Sw itching  Synchronous Rectifier Circuits  DC-to-DC Converters  Motor Control  Automotive-Qualified Systems (F085 version) Description The FA N321.
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