FAN3122 Driver Datasheet

FAN3122 Datasheet, PDF, Equivalent


Part Number

FAN3122

Description

Low-Side Gate Driver

Manufacture

ON Semiconductor

Total Page 21 Pages
Datasheet
Download FAN3122 Datasheet


FAN3122
FAN3121 / FAN3122
Single 9-A High-Speed, Low-Side Gate Driver
Features
! Industry-Standard Pin-out with Enable Input
! 4.5-V to 18-V Operating Range
! 11.4 A Peak Sink at VDD = 12 V
! 9.7-A Sink / 7.1-A Source at VOUT = 6 V
! Inverting Configuration (FAN3121) and
Non-Inverting Configuration (FAN3122)
! Internal Resistors Turn Driver Off If No Inputs
! 23-ns / 19-ns Typical Rise/Fall Times (10 nF Load)
! 18 ns to 23 ns Typical Propagation Delay Time
! Choice of TTL or CMOS Input Thresholds
! MillerDrive™ Technology
! Available in Thermally Enhanced 3x3 mm 8-Lead
MLP or 8-Lead SOIC Package (Pb-Free Finish)
! Rated from –40°C to +125°C
! Automotive Qualified to AEC-Q100 (F085 Versions)
Applications
! Synchronous Rectifier Circuits
! High-Efficiency MOSFET Switching
! Switch-Mode Power Supplies
! DC-to-DC Converters
! Motor Control
! Automotive-Qualified Systems (F085 Versions)
Description
The FAN3121 and FAN3122 MOSFET drivers are
designed to drive N-channel enhancement MOSFETs in
low-side switching applications by providing high peak
current pulses. The drivers are available with either TTL
input thresholds (FAN312xT) or VDD-proportional CMOS
input thresholds (FAN312xC). Internal circuitry provides
an under-voltage lockout function by holding the output
low until the supply voltage is within the operating range.
FAN312x drivers incorporate the MillerDrive™
architecture for the final output stage. This bipolar /
MOSFET combination provides the highest peak current
during the Miller plateau stage of the MOSFET turn-on /
turn-off process.
The FAN3121 and FAN3122 drivers implement an
enable function on pin 3 (EN), previously unused in the
industry-standard pin-out. The pin is internally pulled up
to VDD for active HIGH logic and can be left open for
standard operation.
The commercial FAN3121/22 is available in a 3x3 mm
8-lead thermally-enhanced MLP package or an 8-lead
SOIC package. The AEC-Q100 automotive-qualified
versions are available in the 8-lead SOIC package.
VDD 1
IN 2
EN 3
GND 4
8 VDD
7 OUT
6 OUT
5 GND
Figure 1. FAN3121 Pin Configuration
VDD 1
IN 2
EN 3
GND 4
8 VDD
7 OUT
6 OUT
5 GND
Figure 2. FAN3122 Pin Configuration
© 2008 Semiconductor Components Industries, LLC.
October-2017, Rev. 2
Publication Order Number:
FAN3122T-F085/D

FAN3122
Ordering Information
Part Number
Logic
FAN3121CMPX
FAN3121CMX
FAN3121CMX-F085(1)
FAN3121TMPX
FAN3121TMX
Inverting
Channels +
Enable
FAN3121TMX-F085 (1)
FAN3122CMPX
FAN3122CMX
FAN3122CMX-F085(1)
FAN3122TMPX
FAN3122TMX
Non-Inverting
Channels +
Enable
FAN3122TMX-F085(1)
Note:
1. Qualified to AEC-Q100.
Package Outlines
18
27
36
45
Input
Threshold
CMOS
TTL
CMOS
TTL
Package
3x3 mm MLP-8
SOIC-8
SOIC-8
3x3 mm MLP-8
SOIC-8
SOIC-8
3x3 mm MLP-8
SOIC-8
SOIC-8
3x3 mm MLP-8
SOIC-8
SOIC-8
Packing
Method
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Quantity
per Reel
3,000
2,500
2,500
3,000
2,500
2,500
3,000
2,500
2,500
3,000
2,500
2,500
18
27
36
45
Figure 3. 3x3 mm MLP-8 (Top View)
Figure 4. SOIC-8 (Top View)
Thermal Characteristics(2)
Package
Θ
(3)
JL
Θ
(4)
JT
Θ
(5)
JA
Ψ
(6)
JB
Ψ
(7)
JT
Units
8-Lead 3x3 mm Molded Leadless Package (MLP)
1.2 64 42 2.8 0.7 °C/W
8-Pin Small Outline Integrated Circuit (SOIC)
38 29 87 41 2.3 °C/W
Notes:
2. Estimates derived from thermal simulation; actual values depend on the application.
3. Theta_JL (ΘJL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads
(including any thermal pad) that are typically soldered to a PCB.
4. Theta_JT (ΘJT): Thermal resistance between the semiconductor junction and the top surface of the package,
assuming it is held at a uniform temperature by a top-side heatsink.
5. Theta_JA (ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking,
and airflow. The value given is for natural convection with no heatsink, as specified in JEDEC standards
JESD51-2, JESD51-5, and JESD51-7, as appropriate.
6. Psi_JB (ΨJB): Thermal characterization parameter providing correlation between semiconductor junction
temperature and an application circuit board reference point for the thermal environment defined in Note 5. For
the MLP-8 package, the board reference is defined as the PCB copper connected to the thermal pad and
protruding from either end of the package. For the SOIC-8 package, the board reference is defined as the PCB
copper adjacent to pin 6.
7. Psi_JT (ΨJT): Thermal characterization parameter providing correlation between the semiconductor junction
temperature and the center of the top of the package for the thermal environment defined in Note 5.
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Features FAN3121 / FAN3122 — Single 9-A High-Sp eed, Low-Side Gate Driver FAN3121 / FA N3122 Single 9-A High-Speed, Low-Side G ate Driver Features ! Industry-Standar d Pin-out with Enable Input ! 4.5-V to 18-V Operating Range ! 11.4 A Peak Sink at VDD = 12 V ! 9.7-A Sink / 7.1-A Sou rce at VOUT = 6 V ! Inverting Configura tion (FAN3121) and Non-Inverting Config uration (FAN3122) ! Internal Resistors Turn Driver Off If No Inputs ! 23-ns / 19-ns Typical Rise/Fall Times (10 nF Lo ad) ! 18 ns to 23 ns Typical Propagatio n Delay Time ! Choice of TTL or CMOS In put Thresholds ! MillerDrive™ Technol ogy ! Available in Thermally Enhanced 3 x3 mm 8-Lead MLP or 8-Lead SOIC Package (Pb-Free Finish) ! Rated from –40°C to +125°C ! Automotive Qualified to A EC-Q100 (F085 Versions) Applications ! Synchronous Rectifier Circuits ! High-E fficiency MOSFET Switching ! Switch-Mod e Power Supplies ! DC-to-DC Converters ! Motor Control ! Automotive-Qualified Systems (F085 Versions) Description The FAN3121 and FAN3122 MOSFET dri.
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