Haptic Driver. DRV2605 Datasheet

DRV2605 Driver. Datasheet pdf. Equivalent

Part DRV2605
Description Haptic Driver
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DRV2605
Product
Folder
Order
Now
Technical
Documents
Tools &
Software
Support &
Community
DRV2605
SLOS825E – DECEMBER 2012 – REVISED APRIL 2018
DRV2605 Haptic Driver for ERM and LRA With Built-In Library and Smart-Loop
Architecture
1 Features
1 Flexible Haptic/Vibra Driver
– LRA (Linear Resonance Actuator)
– ERM (Eccentric Rotating Mass)
• I2C Controlled Digital Playback Engine
– Real-Time Playback Mode via I2C
• Smart Loop Architecture(1)
– Automatic Overdrive/Braking (ERM/LRA)
– Automatic Resonance Tracking (LRA)
– Automatic Actuator Diagnostic (ERM/LRA)
– Automatic Level Calibration (ERM/LRA)
• Licensed Immersion™ TouchSense® 2200
features:
– Integrated Immersion Effect Library
– Audio to Vibe
• Optional PWM Input with 0% to 100% Duty Cycle
Control Range
• Optional Analog Input Control
• Optional Hardware Trigger Pin
• Efficient Output Drive
• Fast Start Up Time
• Constant Acceleration Over Supply Voltage
• 1.8 V Compatible, VDD Tolerant Digital Pins
(1) Patent pending control algorithm
2 Applications
• Mobile Phones and Tablets
• Watches and Wearable Technology
• Remote Controls, Mice, and Peripheral Devices
• Touch-Enabled Devices
• Human-Machine Interfaces
3 Description
The DRV2605 device is designed to provide
extremely-flexible haptic control of ERM and LRA
actuators over a shared I2C-compatible bus. This
control relieves the host processor from ever
generating pulse-width modulated (PWM) drive
signals, saving both costly timer interrupts and
hardware pins.
The DRV2605 device provides an extensive
integrated library over 100 licensed effects from
Immersion for ERM and LRA which eliminates the
need to design haptics waveforms.
The DRV2605 device offers a licensed version of the
TouchSense 2200 software from Immersion, which
includes the 2200 Effects Library, and 2200 audio-to-
vibe features. Additionally, the real-time playback
mode allows the host processor to bypass the library
playback engine and play waveforms directly from the
host through I2C.
The DRV2605 device also contains a smart-loop
architecture, which allows effortless auto resonant
drive for LRA as well as feedback-optimized ERM
drive. This feedback provides automatic overdrive
and braking, which creates a simplified input
waveform paradigm as well as reliable motor control
and consistent motor performance. The audio-to-
haptics mode automatically converts an audio input
signal to meaningful haptic effects.
The DRV2605 device features a trinary-modulated
output stage, providing greater efficiency than linear-
based output drivers. The 9-ball WCSP footprint,
flexible operation, and low component count make
the DRV2605 device the ideal choice for portable and
touch-enabled vibratory and haptic applications.
For an important notice regarding Immersion
software, see the Legal Notice section.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (MAX)
DRV2605
DSBGA (9)
1.50 mm × 1.50 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
VDD
Supply
correction
ROM
Gate
drive
OUT+
SDA
SCL
EN
IN/TRIG
REG
2
I C I/F
REG
Control and
playback
engine
Back-EMF
detection
Gate
drive
LRA
M or
ERM
OUT±
GND
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



DRV2605
DRV2605
SLOS825E – DECEMBER 2012 – REVISED APRIL 2018
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 4
6 Specifications......................................................... 5
6.1 Absolute Maximum Ratings ...................................... 5
6.2 ESD Ratings.............................................................. 5
6.3 Recommended Operating Conditions....................... 5
6.4 Thermal Information .................................................. 5
6.5 Electrical Characteristics........................................... 6
6.6 Timing Requirements ................................................ 6
6.7 Switching Characteristics .......................................... 6
6.8 Typical Characteristics .............................................. 8
7 Detailed Description ............................................ 10
7.1 Overview ................................................................. 10
7.2 Functional Block Diagram ....................................... 10
7.3 Feature Description................................................. 11
7.4 Device Functional Modes........................................ 18
7.5 Programming........................................................... 22
7.6 Register Map........................................................... 33
8 Application and Implementation ........................ 49
8.1 Application Information............................................ 49
8.2 Typical Application .................................................. 50
8.3 Initialization Setup ................................................... 53
9 Power Supply Recommendations...................... 54
10 Layout................................................................... 55
10.1 Layout Guidelines ................................................. 55
10.2 Layout Example .................................................... 56
11 Device and Documentation Support ................. 57
11.1 Legal Notice .......................................................... 57
11.2 Waveform Library Effects List ............................... 57
11.3 Receiving Notification of Documentation Updates 58
11.4 Community Resources.......................................... 58
11.5 Trademarks ........................................................... 58
11.6 Electrostatic Discharge Caution ............................ 58
11.7 Glossary ................................................................ 58
12 Mechanical, Packaging, and Orderable
Information ........................................................... 58
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (December 2015) to Revision E
Page
• Changed the DEFAULT value for bit 5-4 of Table 25 From: 1 To 3 ................................................................................... 46
• Changed the DEFAULT value for bit 3-2 of Table 25 From: 2 To 1 ................................................................................... 46
• Changed the DEFAULT value for bit 1-0 of Table 25 From: 2 To 1 ................................................................................... 46
• Changed the typical value of C(VDD) in Table 30 From: 0.1 µF To: 1 µF .............................................................................. 49
• Changed C(VDD) from 0.1 to 1 µF in Figure 56...................................................................................................................... 50
• Changed the input-voltage supply range From: 2 V to 5.2 V To: 2.5 V to 5.5 V in the Power Supply
Recommendations secton .................................................................................................................................................... 54
Changes from Revision C (September 2014) to Revision D
Page
• Changed th(1) Hold time, SCL to SDA from 10 ns to 50 ns in Timing Requirements ............................................................. 6
• Changed the default value of NG_THRESH[1:0] from 1 to 2 in the Register Map Control3 Register Field Descriptions ... 47
Changes from Revision B (February 2014) to Revision C
Page
• Changed Features bullet from Royalty-Free Integrated Immersion Library to Waveform Event Sequencer and
Trigger ................................................................................................................................................................................... 1
• Changed Feature bullet from Audio To Haptics Mode to Top Level: Licensed Immersion TouchSense 2200 features: ..... 1
• Changed from Audio To Haptics Mode to Audio to Vibe ...................................................................................................... 1
• Changed second paragraph of Description for clarification.................................................................................................... 1
• Updated document to new datasheet style ............................................................................................................................ 4
• Deleted Operating free-air temperature range, TA (information replaced by Thermal Information table) ............................. 5
• Changed EN pulldown resistance added to Electrical Characteristics .................................................................................. 6
• Changed connection terminal of input impedance from GND to V(CM_ANA) in Electrical Characteristics section .................... 6
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