Haptic Driver. DRV2604 Datasheet

DRV2604 Driver. Datasheet pdf. Equivalent

DRV2604 Datasheet
Recommendation DRV2604 Datasheet
Part DRV2604
Description Haptic Driver
Feature DRV2604; Product Folder Order Now Technical Documents Tools & Software Support & Community DRV2604 SLOS8.
Manufacture etcTI
Datasheet
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Texas Instruments DRV2604
Product
Folder
Order
Now
Technical
Documents
Tools &
Software
Support &
Community
DRV2604
SLOS824C – DECEMBER 2012 – REVISED MARCH 2018
DRV2604 Haptic Driver for ERM and LRA With Internal Memory
and Smart-Loop Architecture
1 Features
1 Flexible Haptic/Vibra Driver
– LRA (Linear Resonance Actuator)
– ERM (Eccentric Rotating Mass)
• I2C Controlled Digital Playback Engine
– Internal RAM for Waveform Storage
– Real-Time Playback Mode through I2C
• Smart-Loop Architecture(1)
– Automatic Overdrive/Braking (ERM/LRA)
– Automatic Resonance Tracking (LRA)
– Automatic Actuator Diagnostic (ERM/LRA)
– Automatic Level Calibration (ERM/LRA)
• Immersion TouchSense® 3000 Compatible
• Optional PWM Input with 0% to 100% Duty Cycle
Control Range
• Optional Analog Input Control
• Optional Hardware Trigger Pin
• Efficient Output Drive
• Fast Startup Time
• Constant Acceleration Over Supply Voltage
• 1.8-V Compatible, VDD-Tolerant Digital Pins
(1) Patent pending control algorithm
The DRV2604 device includes enough integrated
RAM to allow the user to pre-load over 100
customized waveforms. These waveforms can be
instantly played back through I2C or optionally
triggered through a hardware trigger pin. Additionally,
the real-time playback mode allows the host
processor to bypass the library playback engine and
play waveforms directly from the host through I2C.
The DRV2604 device also contains a smart-loop
architecture, which allows effortless auto resonant
drive for LRA as well as feedback-optimized ERM
drive. This feedback gives automatic overdrive and
braking, which creates a simplified input waveform
paradigm as well as reliable motor control and
consistent motor performance.
The DRV2604 device features a trinary-modulated
output stage, providing greater efficiency than linear-
based output drivers. The 9-ball WCSP footprint,
flexible operation, and low component count make
the DRV2604 device the ideal choice for portable and
touch-enabled vibratory and haptic applications.
Device Information(1)
PART NUMBER PACKAGE
BODY SIZE (MAX)
DRV2604
DSBGA (9)
1.50 mm × 1.50 mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
2 Applications
Simplified Schematic
• Mobile Phones
• Tablets
VDD
Supply
correction
RAM
Gate
drive
3 Description
The DRV2604 device is designed to provide
extremely flexible haptic control of ERM and LRA
actuators over a shared I2C compatible bus. This
control relieves the host processor from ever
generating pulse-width modulated (PWM) drive
signals, saving both costly timer interrupts and
SDA
SCL
EN
IN/TRIG
REG
2
I C I/F
REG
Control and
playback engine
Back-EMF
detection
Gate
drive
hardware pins.
GND
OUT+
LRA
M or
ERM
OUTt
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



Texas Instruments DRV2604
DRV2604
SLOS824C – DECEMBER 2012 – REVISED MARCH 2018
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Timing Requirements ................................................ 5
6.7 Switching Characteristics .......................................... 5
6.8 Typical Characteristics .............................................. 7
7 Detailed Description .............................................. 9
7.1 Overview ................................................................... 9
7.2 Functional Block Diagram ......................................... 9
7.3 Feature Description................................................. 10
7.4 Device Functional Modes........................................ 16
7.5 Programming........................................................... 20
7.6 Register Map........................................................... 33
8 Application and Implementation ........................ 48
8.1 Application Information............................................ 48
8.2 Typical Application .................................................. 49
8.3 Initialization Setup ................................................... 52
9 Power Supply Recommendations...................... 53
10 Layout................................................................... 54
10.1 Layout Guidelines ................................................. 54
10.2 Layout Example .................................................... 55
11 Device and Documentation Support ................. 56
11.1 Documentation Support ........................................ 56
11.2 Receiving Notification of Documentation Updates 56
11.3 Community Resources.......................................... 56
11.4 Trademarks ........................................................... 56
11.5 Electrostatic Discharge Caution ............................ 56
11.6 Glossary ................................................................ 56
12 Mechanical, Packaging, and Orderable
Information ........................................................... 56
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision B (December 2015) to Revision C
Page
• Changed the DEFAULT value for bit 5-4 of Table 19 From: 1 To 3 ................................................................................... 44
• Changed the DEFAULT value for bit 3-2 of Table 19 From: 2 To 1 ................................................................................... 44
• Changed the DEFAULT value for bit 1-0 of Table 19 From: 2 To 1 ................................................................................... 44
• Changed the typical value of C(VDD) in Table 27 From: 0.1 µF To: 1 µF .............................................................................. 48
• Changed the input-voltage supply range From: 2 V to 5.2 V To: 2.5 V to 5.5 V in the Power Supply
Recommendations secton .................................................................................................................................................... 53
Changes from Revision A (July 2015) to Revision B
Page
• Changed th(1) Hold time, SCL to SDA from 10 ns to 50 ns in Timing Requirements ............................................................ 5
• Changed the default value of NG_THRESH[1:0] from 1 to 2 in the Register Map ............................................................. 45
Changes from Original (December 2012) to Revision A
Page
• Added Feature bullet Immersion TouchSense 3000 Compatible........................................................................................... 1
• Updated document to new data sheet style .......................................................................................................................... 1
• Full specification release ....................................................................................................................................................... 1
• Changed simplified schematic ............................................................................................................................................... 1
• Changed minimum supported resonant frequency from 50 Hz to 125 Hz ............................................................................ 4
• Added digital pulldown resistance parameter to Electrical Characteristics ............................................................................ 5
• Changed calibration diagram to include DRIVE_TIME into ERM requirements .................................................................. 24
• Changed bitfield name from "LRA_DRIVE_MODE" to "OTP_STATUS".............................................................................. 46
2 Submit Documentation Feedback
Product Folder Links: DRV2604
Copyright © 2012–2018, Texas Instruments Incorporated



Texas Instruments DRV2604
www.ti.com
5 Pin Configuration and Functions
DRV2604
SLOS824C – DECEMBER 2012 – REVISED MARCH 2018
YZF Package
9-Pin DSBGA With 0.5-mm Pitch
(Top View)
123
A
EN
REG
OUT+
B
IN/TRIG
SDA
GND
C
SCL
VDD
OUT±
Not to scale
PIN
NO. NAME
A1 EN
A2 REG
A3 OUT+
B1 IN/TRIG
B2 SDA
B3 GND
C1 SCL
C3 OUT–
C2 VDD
TYPE (1)
I
O
O
I
I/O
P
I
O
P
Pin Functions
DESCRIPTION
Device enable
The REG pin is the 1.8-V regulator output. A 1-µF capacitor is required.
Positive haptic driver differential output
Multi-mode Input. I2C selectable as PWM, analog, or trigger. If not used, this pin should
be connected to GND
I2C data
Supply ground
I2C clock
Negative haptic-driver differential output
Supply input (2.5 to 5.5 V). A 0.1-µF capacitor is required.
(1) I = input, O = output, I/O = input and output, P = power
Copyright © 2012–2018, Texas Instruments Incorporated
Product Folder Links: DRV2604
Submit Documentation Feedback
3





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