Headphone Amplifier. TPA6120A2 Datasheet

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TPA6120A2 Datasheet
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Part TPA6120A2
Description High Fidelity Headphone Amplifier
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Texas Instruments TPA6120A2
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Sample &
Buy
Technical
Documents
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Software
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TPA6120A2
SLOS431B – MARCH 2004 – REVISED FEBRUARY 2015
TPA6120A2 High Fidelity Headphone Amplifier
1 Features
1 SNR of 128dB A-Weighted.
• THD of 112.5dB
• Current-Feedback Architecture
• Output Voltage Noise of 0.9µVrms at
Gain = 1V/V (16Ω Load)
• Power Supply Range: ±5V to ±15V
• 1300V/µs Slew Rate
• Can be configured for Single Ended or Differential
Inputs
• Independent Power Supplies for Low Crosstalk
2 Applications
• Professional Audio Equipment
• HiFi Smartphone
• Consumer Home Audio Equipment
• Headphone Drivers
3 Description
In applications requiring a high-power output, very
high fidelity headphone amplifier, the TPA6120A2
replaces a costly discrete design and allows music,
not the amplifier, to be heard. The TPA6120A2's
current-feedback AB amplifier architecture delivers
high bandwidth, extremely low noise, and up to
128dB of dynamic range.
Three key features make current-feedback amplifiers
outstanding for audio. The first feature is the high
slew rate that prevents odd order distortion
anomalies. The second feature is current-on-demand
at the output that enables the amplifier to respond
quickly and linearly when necessary without risk of
output distortion. When large amounts of output
power are suddenly needed, the amplifier can
respond extremely quickly without raising the noise
floor of the system and degrading the signal-to-noise
ratio. The third feature is the gain-independent
frequency response that allows the full bandwidth of
the amplifier to be used over a wide range of gain
settings.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPA6120A2
HSOP (20)
VQFN (14)
7.5mm x 12.82mm
3.5mm x 3.5mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
4 Simplified Schematic
PCM
Audio
Data
Source
Controller
AUDIO DAC
LRCK
BCK
DATA
SCK
IOUT L−
IOUT L+
ZEROL
ZEROR
MS
MDI
MC
MDO
RST
PCM1792
or
DSD1792
IOUT R+
IOUT R−
Filter and I/V Gain Stage
1/2 OPA4134
CF 2.7 nF
−IN A
+IN A
RF
+IN B
−IN B
RF
1 kW
OUT A RI
1 kW
OUT B RI
1 kW
1 kW
CF 2.7 nF
1/2 OPA4134
CF 2.7 nF
+IN C
−IN C
+IN D
−IN D
RF 1 kW
OUT C RI
1 kW
OUT D RI
RF 1 kW
1 kW
CF 2.7 nF
Stereo Hi−Fi
Headphone Driver
TPA6120A2
RF
1 kW
LIN−
LIN+
RF
1 kW
RO LOUT
39.2 W
RF
1 kW
RIN+
RIN−
RF
1 kW
RO ROUT
39.2 W DYR > 120 dB
for Whole
System!
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



Texas Instruments TPA6120A2
TPA6120A2
SLOS431B – MARCH 2004 – REVISED FEBRUARY 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Simplified Schematic............................................. 1
5 Revision History..................................................... 2
6 Pin Configuration and Functions ......................... 3
7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information .................................................. 4
7.5 Electrical Characteristics........................................... 5
7.6 Operating Characteristics.......................................... 5
7.7 Typical Characteristics .............................................. 6
8 Parameter Measurement Information .................. 8
9 Detailed Description .............................................. 8
9.1 Overview ................................................................... 8
9.2 Functional Block Diagram ......................................... 8
9.3 Feature Description................................................... 8
9.4 Device Functional Modes.......................................... 9
10 Applications and Implementation........................ 9
10.1 Application Information............................................ 9
10.2 Typical Application .................................................. 9
11 Power Supply Recommendations ..................... 16
11.1 Independent Power Supplies ................................ 16
11.2 Power Supply Decoupling ..................................... 16
12 Layout................................................................... 17
12.1 Layout Guidelines ................................................. 17
12.2 Layout Example .................................................... 18
13 Device and Documentation Support ................. 20
13.1 Documentation Support ........................................ 20
13.2 Trademarks ........................................................... 20
13.3 Electrostatic Discharge Caution ............................ 20
13.4 Glossary ................................................................ 20
14 Mechanical, Packaging, and Orderable
Information ........................................................... 20
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (July 2014) to Revision B
Page
• Changed the Device Information Packages From: DWP (20) and RGY (14) To: HSOP (20) and VQFN (14) ..................... 1
• Changed QFN to VQFN in the Pin Functions table ............................................................................................................... 3
• Added a NOTE to the Applications and Implementation section ........................................................................................... 9
• Added Title: Application Information....................................................................................................................................... 9
• Deleted Title: Application Circuit............................................................................................................................................. 9
• Changed the Design Requirements ..................................................................................................................................... 10
• Deleted Title: Application Circuit........................................................................................................................................... 14
• Moved two paragraphs following Figure 19 to proceed Figure 19 ....................................................................................... 14
Changes from Original (March 2004) to Revision A
Page
• Changed Added ESD Rating table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
• Added the VQFN package information .................................................................................................................................. 1
• Updated Pin descriptions to clarify power supply. ................................................................................................................. 3
• Lowered minimum VIC(±5Vcc) From: ±3.6 To: ±3.4 .............................................................................................................. 5
• Lowered minimum VIC(±15Vcc) From: ±13.4V To: ±13.2V ................................................................................................... 5
• Deleted IMD (Intermodulation Distortion), ±12Vcc data, Dynamic Range (replaced with SNR, in 1V/V gain) ...................... 5
• Changed the THD=N UNIT From: % To: dB .......................................................................................................................... 5
• Changed the SNR to show the latest data from newer QFN based EVM. ........................................................................... 5
2 Submit Documentation Feedback
Product Folder Links: TPA6120A2
Copyright © 2004–2015, Texas Instruments Incorporated



Texas Instruments TPA6120A2
www.ti.com
6 Pin Configuration and Functions
DWP Package
20-Pin HSOP
Top View
LVCC−
LOUT
LVCC+
LIN+
LIN−
NC
NC
NC
NC
NC
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
NC − No internal connection
RVCC−
ROUT
RVCC+
RIN+
RIN−
NC
NC
NC
NC
NC
TPA6120A2
SLOS431B – MARCH 2004 – REVISED FEBRUARY 2015
RGY Package
14-Pin VQFN with Thermal PAD
Top View
LVCC+ 14
LIN+ 1
8 RVCC+
7 RIN+
NAME
LVCC-
LOUT
LVCC+
LIN+
LIN-
NC
RIN-
RIN+
RVCC+
ROUT
RVCC-
Thermal Pad
PIN
HSOP NO.
1
2
3
4
5
6,7,8,9,10,11,
12,13,14,15
16
17
18
19
20
-
VQFN NO.
12
13
14
1
2
3, 4, 5, 11
6
7
8
9
10
-
Pin Functions
I/O DESCRIPTIONS
I
Left channel negative power supply – must be kept at the same
potential as RVCC- if both amplifiers are to be used.
O Left channel output
I
Left channel positive power supply – must be kept at the same
potential as RVCC+ if both amplifiers are to be used.
I Left channel positive input
I Left channel negative input
- Not internally connected
I Right channel negative input
I Right channel positive input
I
Right channel positive power supply - must be kept at the same
potential as LVCC+ if both amplifiers are to be used.
O Right channel output
I
Right channel negative power supply - must be kept at the same
potential as LVCC- if both amplifiers are to be used.
-
Connect to ground. The thermal pad must be soldered down in all
applications to properly secure device on the PCB.
Copyright © 2004–2015, Texas Instruments Incorporated
Product Folder Links: TPA6120A2
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