TPA6120A2 Amplifier Datasheet

TPA6120A2 Datasheet, PDF, Equivalent


Part Number

TPA6120A2

Description

High Fidelity Headphone Amplifier

Manufacture

etcTI

Total Page 30 Pages
Datasheet
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TPA6120A2
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TPA6120A2
SLOS431B – MARCH 2004 – REVISED FEBRUARY 2015
TPA6120A2 High Fidelity Headphone Amplifier
1 Features
1 SNR of 128dB A-Weighted.
• THD of 112.5dB
• Current-Feedback Architecture
• Output Voltage Noise of 0.9µVrms at
Gain = 1V/V (16Ω Load)
• Power Supply Range: ±5V to ±15V
• 1300V/µs Slew Rate
• Can be configured for Single Ended or Differential
Inputs
• Independent Power Supplies for Low Crosstalk
2 Applications
• Professional Audio Equipment
• HiFi Smartphone
• Consumer Home Audio Equipment
• Headphone Drivers
3 Description
In applications requiring a high-power output, very
high fidelity headphone amplifier, the TPA6120A2
replaces a costly discrete design and allows music,
not the amplifier, to be heard. The TPA6120A2's
current-feedback AB amplifier architecture delivers
high bandwidth, extremely low noise, and up to
128dB of dynamic range.
Three key features make current-feedback amplifiers
outstanding for audio. The first feature is the high
slew rate that prevents odd order distortion
anomalies. The second feature is current-on-demand
at the output that enables the amplifier to respond
quickly and linearly when necessary without risk of
output distortion. When large amounts of output
power are suddenly needed, the amplifier can
respond extremely quickly without raising the noise
floor of the system and degrading the signal-to-noise
ratio. The third feature is the gain-independent
frequency response that allows the full bandwidth of
the amplifier to be used over a wide range of gain
settings.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TPA6120A2
HSOP (20)
VQFN (14)
7.5mm x 12.82mm
3.5mm x 3.5mm
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
4 Simplified Schematic
PCM
Audio
Data
Source
Controller
AUDIO DAC
LRCK
BCK
DATA
SCK
IOUT L−
IOUT L+
ZEROL
ZEROR
MS
MDI
MC
MDO
RST
PCM1792
or
DSD1792
IOUT R+
IOUT R−
Filter and I/V Gain Stage
1/2 OPA4134
CF 2.7 nF
−IN A
+IN A
RF
+IN B
−IN B
RF
1 kW
OUT A RI
1 kW
OUT B RI
1 kW
1 kW
CF 2.7 nF
1/2 OPA4134
CF 2.7 nF
+IN C
−IN C
+IN D
−IN D
RF 1 kW
OUT C RI
1 kW
OUT D RI
RF 1 kW
1 kW
CF 2.7 nF
Stereo Hi−Fi
Headphone Driver
TPA6120A2
RF
1 kW
LIN−
LIN+
RF
1 kW
RO LOUT
39.2 W
RF
1 kW
RIN+
RIN−
RF
1 kW
RO ROUT
39.2 W DYR > 120 dB
for Whole
System!
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.

TPA6120A2
TPA6120A2
SLOS431B – MARCH 2004 – REVISED FEBRUARY 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Simplified Schematic............................................. 1
5 Revision History..................................................... 2
6 Pin Configuration and Functions ......................... 3
7 Specifications......................................................... 4
7.1 Absolute Maximum Ratings ...................................... 4
7.2 ESD Ratings.............................................................. 4
7.3 Recommended Operating Conditions....................... 4
7.4 Thermal Information .................................................. 4
7.5 Electrical Characteristics........................................... 5
7.6 Operating Characteristics.......................................... 5
7.7 Typical Characteristics .............................................. 6
8 Parameter Measurement Information .................. 8
9 Detailed Description .............................................. 8
9.1 Overview ................................................................... 8
9.2 Functional Block Diagram ......................................... 8
9.3 Feature Description................................................... 8
9.4 Device Functional Modes.......................................... 9
10 Applications and Implementation........................ 9
10.1 Application Information............................................ 9
10.2 Typical Application .................................................. 9
11 Power Supply Recommendations ..................... 16
11.1 Independent Power Supplies ................................ 16
11.2 Power Supply Decoupling ..................................... 16
12 Layout................................................................... 17
12.1 Layout Guidelines ................................................. 17
12.2 Layout Example .................................................... 18
13 Device and Documentation Support ................. 20
13.1 Documentation Support ........................................ 20
13.2 Trademarks ........................................................... 20
13.3 Electrostatic Discharge Caution ............................ 20
13.4 Glossary ................................................................ 20
14 Mechanical, Packaging, and Orderable
Information ........................................................... 20
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (July 2014) to Revision B
Page
• Changed the Device Information Packages From: DWP (20) and RGY (14) To: HSOP (20) and VQFN (14) ..................... 1
• Changed QFN to VQFN in the Pin Functions table ............................................................................................................... 3
• Added a NOTE to the Applications and Implementation section ........................................................................................... 9
• Added Title: Application Information....................................................................................................................................... 9
• Deleted Title: Application Circuit............................................................................................................................................. 9
• Changed the Design Requirements ..................................................................................................................................... 10
• Deleted Title: Application Circuit........................................................................................................................................... 14
• Moved two paragraphs following Figure 19 to proceed Figure 19 ....................................................................................... 14
Changes from Original (March 2004) to Revision A
Page
• Changed Added ESD Rating table, Feature Description section, Device Functional Modes, Application and
Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
• Added the VQFN package information .................................................................................................................................. 1
• Updated Pin descriptions to clarify power supply. ................................................................................................................. 3
• Lowered minimum VIC(±5Vcc) From: ±3.6 To: ±3.4 .............................................................................................................. 5
• Lowered minimum VIC(±15Vcc) From: ±13.4V To: ±13.2V ................................................................................................... 5
• Deleted IMD (Intermodulation Distortion), ±12Vcc data, Dynamic Range (replaced with SNR, in 1V/V gain) ...................... 5
• Changed the THD=N UNIT From: % To: dB .......................................................................................................................... 5
• Changed the SNR to show the latest data from newer QFN based EVM. ........................................................................... 5
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Features Product Folder Sample & Buy Technical Documents Tools & Software Support & Community TPA6120A2 SLOS431B – MARCH 2004 – REVISED FEBRUARY 2015 TPA6120 A2 High Fidelity Headphone Amplifier 1 Features •1 SNR of 128dB A-Weighted. • THD of 112.5dB • Current-Feedbac k Architecture • Output Voltage Noise of 0.9µVrms at Gain = 1V/V (16Ω Load ) • Power Supply Range: ±5V to ±15V • 1300V/µs Slew Rate • Can be con figured for Single Ended or Differentia l Inputs • Independent Power Supplies for Low Crosstalk 2 Applications • P rofessional Audio Equipment • HiFi Sm artphone • Consumer Home Audio Equipm ent • Headphone Drivers 3 Descriptio n In applications requiring a high-powe r output, very high fidelity headphone amplifier, the TPA6120A2 replaces a cos tly discrete design and allows music, n ot the amplifier, to be heard. The TPA6 120A2's current-feedback AB amplifier a rchitecture delivers high bandwidth, ex tremely low noise, and up to 128dB of dynamic range. Three key features make current-feedback am.
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