Audio Codec. TLV320AIC3262 Datasheet

TLV320AIC3262 Codec. Datasheet pdf. Equivalent

Part TLV320AIC3262
Description Ultralow Power Stereo Audio Codec
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TLV320AIC3262
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TLV320AIC3262
SLAS679A – DECEMBER 2011 – REVISED SEPTEMBER 2015
TLV320AIC3262 Ultralow Power Stereo Audio Codec With miniDSP, DirectPath
Headphone, and Stereo Class-D Speaker Amplifier
1 Features
1 Stereo Audio DAC With 101 dB SNR
• 2.7mW Stereo 48kHz DAC Playback
• Stereo Audio ADC With 93 dB SNR
• 5.6mW Stereo 48 kHz ADC Record
• 8 to 192-kHz Playback and Record
• 30-mW DirectPathTM Headphone Driver
Eliminates Large Output DC-Blocking Capacitors
• 128-mW Differential Receiver Output Driver
• Stereo Class-D Speaker Drivers
– 1.7 W (8 Ω , 5.5 V, 10% THDN)
– 1.4 W (8 Ω , 5.5 V, 1% THDN)
• Stereo Line Outputs
• PowerTune™ – Adjusts Power vs. SNR
• Extensive Signal Processing Options
• Eight Single-Ended or 4 Fully-Differential Analog
Inputs
• Stereo Digital and Analog Microphone Inputs
• Low-Power Analog Bypass Mode
• Asynchronous Sample Rate Conversion
• Fully-Programmable Enhanced miniDSP With
PurePath™ Studio Support
– Extensive Algorithm Support for Voice and
Audio Applications
• Three Independent Digital Audio Serial Interfaces
– TDM and Mono PCM Support on All Audio
Serial Interfaces
– 8-Channel Input and Output on Audio Serial
Interface 1
• Programmable PLL, Plus Low-Frequency Clocking
• Programmable 12-Bit SAR ADC
• SPI and I2C Control Interfaces
• 4.81 mm × 4.81 mm × 0.625 mm 81-Ball WCSP
(YZF) Package
2 Applications
• Mobile Handsets
• Tablets and eBooks
• Portable Navigation Devices (PND)
• Portable Media Player (PMP)
• Portable Gaming Systems
• Portable Computing
• Noise Suppression (NS)
• Speaker Protection
• Advanced DSP Algorithms
3 Description
The TLV320AIC3262 (also referred to as the
AIC3262) is a flexible, highly-integrated, low-power,
low-voltage stereo audio codec. The AIC3262
features digital microphone inputs and programmable
outputs, PowerTune capabilities, enhanced fully-
programmable miniDSP, predefined and
parameterizable signal processing blocks, integrated
PLL, and flexible audio interfaces. Extensive register-
based control of power, input and output channel
configuration, gains, effects, pin-multiplexing, and
clocks are included, allowing the device to be
precisely targeted to its application.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TLV320AIC3262
DSBGA (81)
4.81 mm × 4.81 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Simplified Block Diagram
8 SE /
4 Diff
Inputs
Level
Control
Mixer
PGA
SAR
ADC
Three
Audio Buses
CP
ADC
Two
DAC
miniDSP
Engines
ADC
ASRC
DAC
PLL
2
I C/SPI Bus
Mixer
Outputs
Receiver
1.4 W
Stereo
Speaker
(Class-D)
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



TLV320AIC3262
TLV320AIC3262
SLAS679A – DECEMBER 2011 – REVISED SEPTEMBER 2015
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Description (continued)......................................... 3
6 Device Comparison Table..................................... 4
7 Pin Configuration and Functions ......................... 5
8 Specifications....................................................... 12
8.1 Absolute Maximum Ratings .................................... 12
8.2 ESD Ratings............................................................ 12
8.3 Recommended Operating Conditions..................... 12
8.4 Thermal Information ................................................ 13
8.5 Electrical Characteristics, SAR ADC....................... 14
8.6 Electrical Characteristics, ADC ............................... 15
8.7 Electrical Characteristics, Bypass Outputs ............. 17
8.8 Electrical Characteristics, Microphone Interface..... 18
8.9 Electrical Characteristics, Audio DAC Outputs ....... 19
8.10 Electrical Characteristics, Class-D Outputs .......... 22
8.11 Electrical Characteristics, Miscellaneous.............. 23
8.12 Electrical Characteristics, Logic Levels................. 23
8.13 I2S/LJF/RJF Timing in Master Mode (see
Figure 2)................................................................... 24
8.14 I2S/LJF/RJF Timing in Slave Mode (see
Figure 3)................................................................... 24
8.15 DSP/Mono PCM Timing in Slave Mode (see
Figure 5)................................................................... 24
8.16 I2C Interface Timing (see Figure 6)....................... 25
8.17 SPI Interface Timing ............................................. 25
8.18 Dissipation Ratings ............................................... 26
8.19 Typical Characteristics .......................................... 28
9 Parameter Measurement Information ................ 31
10 Detailed Description ........................................... 32
10.1 Overview ............................................................... 32
10.2 Functional Block Diagram ..................................... 33
10.3 Feature Description............................................... 34
10.4 Device Functional Modes...................................... 59
10.5 Register Maps ....................................................... 60
11 Application and Implementation........................ 70
11.1 Application Information.......................................... 70
11.2 Typical Application ............................................... 71
12 Power Supply Recommendations ..................... 74
12.1 Device Power Consumption ................................. 74
13 Layout................................................................... 75
13.1 Layout Guidelines ................................................. 75
13.2 Layout Examples................................................... 75
14 Device and Documentation Support ................. 78
14.1 Documentation Support ........................................ 78
14.2 Community Resources.......................................... 78
14.3 Trademarks ........................................................... 78
14.4 Electrostatic Discharge Caution ............................ 78
14.5 Glossary ................................................................ 78
15 Mechanical, Packaging, and Orderable
Information ........................................................... 78
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (December 2011) to Revision A
Page
• Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
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