Digital Converter. LDC1000-Q1 Datasheet

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LDC1000-Q1 Datasheet
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Part LDC1000-Q1
Description Inductance to Digital Converter
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LDC1000-Q1
SLOS886B – SEPTEMBER 2014 – REVISED OCTOBER 2014
LDC1000-Q1 Inductance to Digital Converter
1 Features
1 Qualified for Automotive Applications
• AEC-Q100 Qualified With the Following Results:
– Device Temperature Grade 0: –40°C to 150°C
Ambient Operating Temperature Range E
– Device Temperature Grade 1: –40°C to 125°C
Ambient Operating Temperature Range Q
– Device HBM ESD Classification Level 2
– Device CDM ESD Classification Level C6
• Magnet-Free Operation
• Sub-Micron Precision
• Adjustable Sensing Range (through Coil Design)
• Lower System Cost
• Remote Sensor Placement (Decoupling the LDC
from Harsh Environments)
• High Durability (by Virtue of Contact-Less
Operation)
• Insensitivity to Environmental Interference (such
as Dirt, Dust, Water, Oil)
• Supply Voltage, Analog: 4.75 to 5.25 V
• Supply Voltage, IO: 1.8 to 5.25 V
• Supply Current (Without LC Tank): 1.7 mA
• RP Resolution: 16-bit
• L Resolution: 24-bit
• LC Frequency Range: 5 kHz to 5 MHz
2 Applications
• Drive-by-Wire Systems
• Gear-Tooth Counting
• Flow Meters
• Push-Button Switches
• Rotational Position Sensor
• Linear Position Sensor
• Pedal Position Sensor
• Throttle Position Sensor
3 Description
Inductive sensing is a contactless, short-range
sensing technology that enables low-cost, high-
resolution sensing of conductive targets in the
presence of dust, dirt, oil, and moisture, making this
technology extremely reliable in harsh environments.
Using a coil that can be created for example on a
PCB as a sensing element, the LDC1000-Q1 device
enables ultra-low cost system solutions.
Inductive sensing technology enables precise
measurement of linear or angular position,
displacement, motion, compression, vibration, metal
composition, and many other applications in markets
including automotive, consumer, computer, industrial,
medical, and communications. Inductive sensing
offers better performance and reliability at lower cost
than other competitive solutions.
The LDC1000-Q1 device is the first automotive-
qualified LDC, offering the benefits of inductive
sensing in a low-power, small-footprint solution. The
product is available in a 16-pin TSSOP package and
offers several modes of operation. An SPI interface
simplifies connection to an MCU.
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
LDC1000-Q1
TSSOP (16)
5.00 mm × 4.40 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Typical Application — Axial Distance Sensing
0.25
0.5
Distance
0.75
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.



Texas Instruments LDC1000-Q1
LDC1000-Q1
SLOS886B – SEPTEMBER 2014 – REVISED OCTOBER 2014
www.ti.com
Table of Contents
1 Features .................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 Handling Ratings....................................................... 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information .................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Timing Requirements ................................................ 6
6.7 Typical Characteristics .............................................. 7
7 Detailed Description .............................................. 8
7.1 Overview ................................................................... 8
7.2 Functional Block Diagram ......................................... 8
7.3 Feature Description................................................... 8
7.4 Device Functional Modes........................................ 12
7.5 Programming........................................................... 14
7.6 Register Map........................................................... 16
8 Application and Implementation ........................ 26
8.1 Application Information............................................ 26
8.2 Typical Application ................................................. 28
9 Power Supply Recommendations...................... 32
10 Layout................................................................... 32
10.1 Layout Guidelines ................................................. 32
10.2 Layout Example .................................................... 33
11 Device and Documentation Support ................. 34
11.1 Trademarks ........................................................... 34
11.2 Electrostatic Discharge Caution ............................ 34
11.3 Glossary ................................................................ 34
12 Mechanical, Packaging, and Orderable
Information ........................................................... 34
4 Revision History
Changes from Revision A (September 2014) to Revision B
Page
• Changed pin configuration image and removed DAP from Pin Functions table .................................................................... 3
Changes from Original (September 2014) to Revision A
Page
• Changed the device status from Product Preview to Production Data ................................................................................. 1
2 Submit Documentation Feedback
Product Folder Links: LDC1000-Q1
Copyright © 2014, Texas Instruments Incorporated



Texas Instruments LDC1000-Q1
www.ti.com
5 Pin Configuration and Functions
LDC1000-Q1
SLOS886B – SEPTEMBER 2014 – REVISED OCTOBER 2014
SCLK
CSB
SDI
VIO
SDO
DGND
CFB
CFA
PW Package
16-Pin TSSOP
Top View
1 16
2 15
3 14
4 13
5 12
6 11
7 10
89
INTB
XOUT
TBCLK/XIN
CLDO
VDD
GND
INB
INA
Pin Functions
PIN TYPE(1)
NO. NAME
DESCRIPTION
1
SCLK
DI SPI clock input. The SCLK pin is used to clock-out and clock-in the data from or into the chip
2
CSB
DI
SPI CSB. Multiple devices can be connected on the same SPI bus and the CSB pin can be used to
select which device is communicated with.
3
SDI
DI
SPI Slave Data In (Master Out Slave In). This pin should be connected to the Master Out Slave In of
the master device.
4 VIO P Digital IO Supply
5
SDO
DO SPI Slave Data Out (Master In Slave Out). This pin is high-Z when the CSB pin is high.
6
DGND
P Digital ground
7
CFB
A LDC filter capacitor
8
CFA
A LDC filter capacitor
9 INA A External LC Tank. Connect this pin to an external LC tank.
10 INB A External LC Tank. Connect this pin to an external LC tank.
11
GND
P Analog ground
12 VDD P Analog supply
13
CLDO
A LDO bypass capacitor. Connect a 56-nF capacitor from this pin to GND.
14 TBCLK/XIN DI/A External time-base clock and XTAL. This pin is either an external clock or is connected to a crystal.
XTAL. Crystal out. Connecting an 8-Mhz crystal between the TBCLK/XIN pin and the XOUT pin with
15
XOUT
A 20-pF capacitor from each pin to ground is recommended. This pin should be floating when an
external clock is used.
16
INTB
DO
Configurable interrupt. This pin can be configured to function in three different ways (threshold detect,
wakeup, or DRDYB) by programing the INT pin mode register.
(1) DO: Digital Output, DI: Digital Input, P: Power, A: Analog
Copyright © 2014, Texas Instruments Incorporated
Product Folder Links: LDC1000-Q1
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