High-Voltage Interface Positive-NAND Gates
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TAPE AND REEL INFORMATION
PACKAGE MATERIALS INFORMATION
14-Jul-2012
*All dimensions are nominal
Device
Pa...
Description
www.ti.com
TAPE AND REEL INFORMATION
PACKAGE MATERIALS INFORMATION
14-Jul-2012
*All dimensions are nominal
Device
Package Package Pins Type Drawing
SN74LS26DR
SOIC
D 14
SPQ 2500
Reel Reel A0 Diameter Width (mm)
(mm) W1 (mm)
330.0 16.4 6.5
B0 (mm)
9.0
K0 (mm)
2.1
P1 (mm)
8.0
W Pin1 (mm) Quadrant
16.0 Q1
Pack Materials-Page 1
www.ti.com
PACKAGE MATERIALS INFORMATION
14-Jul-2012
*All dimensions are nominal Device
SN74LS26DR
Package Type Package Drawing Pins
SOIC
D 14
SPQ 2500
Length (mm) Width (mm) Height (mm)
367.0
367.0
38.0
Pack Materials-Page 2
J0014A
PIN 1 ID (OPTIONAL)
1 12X .100
[2.54]
PACKAGE OUTLINE
CDIP - 5.08 mm max height
SCALE 0.900
CERAMIC DUAL IN LINE PACKAGE
A 4X .005 MIN [0.13]
14 14X .045-.065 [1.15-1.65]
.754-.785 [19.15-19.94]
.015-.060 TYP [0.38-1.52]
14X .014-.026 [0.36-0.66]
.010 [0.25] C A B
78
B .245-.283 [6.22-7.19]
.308-.314 [7.83-7.97] AT GAGE PLANE
.2 MAX TYP [5.08]
C
.13 MIN TYP [3.3]
SEATING PLANE
.015 GAGE PLANE [0.38]
0 -15 TYP
14X .008-.014 [0.2-0.36]
4214771/A 05/2017
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice. 3. This package is hermitically sealed with a ceramic lid using glass frit. 4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal on...
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