QRE1113GR

QRE1113, QRE1113GR, QRE1114GR Miniature Reflective Object Sensor Features Phototransistor Output No Contact Surface Sensing Miniature Package Lead Form Style: Gull Wing Two Leadform Options: ♦ Through Hole (QRE1113) ♦ SMT Gull Wing (QRE1113GR & QRE1114GR) Two Packaging Options: ♦ Tube (QRE1113) ♦ Tape and Reel (QRE1113GR & QRE1114GR) MAXIMUM RATINGS (TA = 25°C unless otherwise noted) Symbol Parameter Value Unit TOPR TSTG TSOL−I Operating Temperature Storage Temperature Soldering Temperature (Iron) (Notes 2, 3, 4) −40 to +85 °C −40 to +90 °C 240 for 5 s °C TSOL−F Soldering Temperature (Flow) (Notes 3, 4) 260 for 10 s °C EMITTER IF VR IFP PD SENSOR Continuous Forward Current Reverse Voltage Peak Forward Current (Note 5) Power Dissipation (Note 1) 50 mA 5 V 1 A 75 mW VCEO Collector-Emitter Voltage 30 V VECO Emitter-Collector Voltage 5 V IC Collector Current 20 mA PD Power Dissipation (Note 1) 50 mW Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Derate power dissipation linearly 1.00 mW/°C above 25°C. 2. RMA flux is recommended. 3. Methanol or isopropyl alcohols are recommended as cleaning agents. 4. Soldering iron 1/16″ (1.6 mm) from housing. 5. Pulse conditions: tp = 100 ms; T = 10 ms. This document, and the information contained herein, is CONFIDENTI...