i.MX28 Processors Datasheet

i.MX28 Datasheet, PDF, Equivalent


Part Number

i.MX28

Description

Applications Processors

Manufacture

NXP

Total Page 30 Pages
Datasheet
Download i.MX28 Datasheet


i.MX28
NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMX28CEC
Rev. 4, 10/2018
i.MX28
i.MX28 Applications
Processors for Consumer
Products
Package Information
Plastic package
Case MAPBGA-289, 14 x 14 mm, 0.8 mm pitch
Ordering Information
See Table on page 3 for ordering information.
1 Introduction
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Device Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
The i.MX28 is a low-power, high-performance
1.2 Ordering Information and Functional
Part Differences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
applications processor optimized for the general
embedded industrial and consumer markets. The core of
the i.MX28 is NXP's fast, power-efficient
1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Special Signal Considerations. . . . . . . . . . . . . . . . 11
3 Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 11
implementation of the ARM926EJ-S™ core, with
speeds of up to 454 MHz.
3.1 i.MX28 Device-Level Conditions . . . . . . . . . . . . . . 11
3.2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . 18
3.3 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 19
The device is suitable for a wide range of applications,
3.4 I/O AC Timing and Parameters . . . . . . . . . . . . . . . 22
3.5 Module Timing and Electrical Parameters. . . . . . . 27
including the following:
• Human-machine interface (HMI) panels:
4 Package Information and Contact Assignments . . . . . . . 59
4.1 Case MAPBGA-289, 14 x 14 mm, 0.8 mm Pitch. . 59
4.2 Ground, Power, Sense, and Reference Contact
industrial, home
Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
4.3 Signal Contact Assignments . . . . . . . . . . . . . . . . . 61
• Industrial drive, PLC, I/O control display, factory
robotics display, graphical remote controls
4.4 i.MX280 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 63
4.5 i.MX283 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 65
4.6 i.MX286 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 67
• Handheld scanners and printers
• Patient-monitoring, portable medical devices
4.7 i.MX287 Ball Map . . . . . . . . . . . . . . . . . . . . . . . . . 69
5 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
• Smart energy meters, energy gateways
• Media phones, media gateways
The integrated power management unit (PMU) on the
i.MX28 is composed of a triple output DC-DC switching
converter and multiple linear regulators. These provide
NXP reserves the right to change the detail specifications as may be required
to permit improvements in the design of its products.

i.MX28
Introduction
power sequencing for the device and its I/O peripherals such as memories and SD cards, as well as provide
battery charging capability for Li-Ion batteries.
The i.MX28 processor includes an additional 128-Kbyte on-chip SRAM to make the device ideal for
eliminating external RAM in applications with small footprint RTOS.
The i.MX28 supports connections to various types of external memories, such as mobile DDR, DDR2 and
LV-DDR2, SLC and MLC NAND Flash.
The i.MX28 can be connected to a variety of external devices such as high-speed USB2.0 OTG, CAN,
10/100 Ethernet, and SD/SDIO/MMC.
1.1 Device Features
The following lists the features of the i.MX28:
• ARM926EJ-S CPU running at 454 MHz:
— 16-Kbyte instruction cache and 32-Kbyte data cache
— Arm embedded trace macrocell (CoreSight™ ETM9™)
— Parallel JTAG interface
• 128 KBytes of integrated low-power on-chip SRAM
• 128 KBytes of integrated mask-programmable on-chip ROM
• 1280 bits of on-chip one-time-programmable (OCOTP) ROM
• 16-bit mobile DDR (mDDR) (1.8 V), DDR2 (1.8 V) and LV-DDR2 (1.5 V), up to 205 MHz DDR
clock frequency with voltage overdrive
• Support for up to eight NAND Flash memory devices with up to 20-bit BCH ECC
• Four synchronous serial ports (SSP) for SDIO/MMC/MS/SPI: SSP0, SSP1, SSP2, and SSP3. SSP0
and SSP1 can support three modes,1-bit, 4-bit, and 8-bit, whereas SSP2 and SSP3 can support only
1-bit and 4-bit modes.
• 10/100-Mbps Ethernet MAC compatible with IEEE Std 802.3™:
— Single 10/100 Ethernet with GMII/RMII or Dual 10/100 Ethernet with RMII interface
— Supporting IEEE Std 1588™-compatible hardware timestamp
— Supporting 50-MHz/25-MHz clock output for external Ethernet PHY
• Two 2.0B protocol-compatible Controller Area Network (CAN) interfaces
• One USB2.0 OTG device/host controller and PHY
• One USB2.0 host controller and PHY
• LCD controller, up to 24-bit RGB (DOTCK) modes and 24-bit system-mode
• Pixel-processing pipeline (PXP) supports full path from color-space conversion, scaling,
alpha-blending to rotation without intermediate memory access.
• SPDIF transmitter
• Dual serial audio interface (SAIF) to support full-duplex transmit and receive operations; each
SAIF supports three stereo pairs
i.MX28 Applications Processors for Consumer Products, Rev. 4, 10/2018
2 NXP Semiconductors


Features NXP Semiconductors Data Sheet: Technical Data Document Number: IMX28CEC Rev. 4 , 10/2018 i.MX28 i.MX28 Applications P rocessors for Consumer Products Packag e Information Plastic package Case MAPB GA-289, 14 x 14 mm, 0.8 mm pitch Order ing Information See Table on page 3 for ordering information. 1 Introduction 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 Device Features . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 The i.MX28 is a low-power, h igh-performance 1.2 Ordering Informati on and Functional Part Differences . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 applications pr ocessor optimized for the general embed ded industrial and consumer markets. Th e core of the i.MX28 is NXP's fast, pow er-efficient 1.3 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 Special Signal Considerations. . ..
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