IMX8QXPAEC Processors Datasheet

IMX8QXPAEC Datasheet, PDF, Equivalent


Part Number

IMX8QXPAEC

Description

Applications Processors

Manufacture

NXP

Total Page 30 Pages
Datasheet
Download IMX8QXPAEC Datasheet


IMX8QXPAEC
NXP Semiconductors
Data Sheet: Technical Data
IMX8QXPAEC
Rev. 1, 5/2019
For part number information,
contact an NXP representative at
nxp.com.
i.MX 8QuadXPlus and
8DualXPlus Automotive
and Infotainment
Applications Processors
Package Information
21 x 21 mm package case outline
17 x 17 mm package case outline
Ordering Information
See Section 1.1Table 5 on page 8
1 Introduction
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 5
This data sheet contains specifications for the
1.2 Package options . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.3 Related resources . . . . . . . . . . . . . . . . . . . . . . . . . . 5
i.MX 8QuadXPlus and 8DualXPlus processors, which,
along with the i.MX 8DualX processor, comprise the
i.MX 8X Family (for i.MX 8DualX specifications, see
2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3 Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1 Special Signal Considerations. . . . . . . . . . . . . . . . 14
i.MX 8DualX Automotive and Infotainment Processors
[IMX8DXAEC]). The i.MX 8X processors consist of
3.2 Recommended Connections for Unused Interfaces14
4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 15
4.1 Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . . 15
three to five Arm cores (two to four Arm Cortex®-A35
and one Cortex®-M4F). All devices include separate
GPU and VPU subsystems as well as a failover-ready
4.2 Power supplies requirements and restrictions. . . . 25
4.3 PLL electrical characteristics. . . . . . . . . . . . . . . . . 27
4.4 On-chip oscillators. . . . . . . . . . . . . . . . . . . . . . . . . 30
4.5 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 33
display controller. Advanced multicore audio processing
is supported by the Arm cores and a high performance
4.6 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 40
4.7 Output Buffer Impedance Parameters. . . . . . . . . . 42
4.8 System Modules Timing . . . . . . . . . . . . . . . . . . . . 47
Tensilica® HiFi 4 DSP for pre- and post-audio
processing as well as voice recognition. The i.MX 8X
4.9 General-Purpose Media Interface (GPMI) Timing. 51
4.10 External Peripheral Interface Parameters . . . . . . . 60
4.11 Analog-to-digital converter (ADC) . . . . . . . . . . . . 108
Family supports up to three displays with multiple
5 Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 111
display output options, including parallel, MIPI-DSI,
and LVDS. Memory interfaces for this device include:
5.1 Boot mode configuration pins . . . . . . . . . . . . . . . 111
5.2 Boot devices interfaces allocation . . . . . . . . . . . . 111
6 Package information and contact assignments. . . . . . . 113
• LPDDR4 (no error correcting code [ECC])
6.1 FCPBGA, 21 x 21 mm, 0.8 mm pitch . . . . . . . . . 113
6.2 FCPBGA, 17 x 17 mm, 0.8 mm pitch . . . . . . . . . 130
• DDR3L (optional ECC)
7 Release notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 147
NXP reserves the right to change the detail specifications as may be required to permit improvements in the design of
its products.

IMX8QXPAEC
Introduction
• 2× Quad SPI or 1× Octal SPI (FlexSPI)
• eMMC 5.1, RAW NAND, and SD 3.0
A wide range of peripheral I/Os such as CAN, parallel or MIPI CSI camera input, Gigabit Ethernet,
USB 2.0 OTG, USB 3.0 (8QuadXPlus/8DualXPlus only), ADC, and PCIe 3.0 provide impressive
flexibility.
The i.MX 8QuadXPlus/8DualXPlus processors offer numerous advanced features as shown in this table.
Table 1. i.MX 8QuadXPlus/8DualXPlus advanced features
Function
Feature
Multicore architecture provides
AArch64 for 64-bit support and new architectural features
2×–4× Cortex-A35 and Cortex-M4F
cores
AArch32 for full backward compatibility with ARMv7
Cortex-A35 cores support ARM virtualization extensions.
Cortex-M4F cores for real-time applications
Graphics Processing Unit (GPU)
4× Vec4 shaders with 16 execution units optimized for higher performance
Supports OpenGL 3.0, 2.1,; OpenGL ES 3.1, 3.0, 2.0, and 1.1; OpenCL 1.2 Full Profile
and 1.1; OpenVG 1.1; and Vulkan
High-performance 2D Blit Engine
H.265 decode (4Kp30)
Video Processing Unit (VPU)
H.264 decode (4Kp30)
WMV9/VC-1 imple decode
MPEG 1 and 2 decode
AVS decode
MPEG4.2 ASP, H.263, Sorenson Spark decode
Divx 3.11 including GMC decode
ON2/Google VP6/VP8 decode
RealVideo 8/9/10 decode
JPEG and MJPEG decode
H.264 encode (1080p30)
Tensilica HiFi 4 DSP for pre- and
post-processing
640 MHz
Fixed-point and vector-floating-point support
32 KB instruction cache, 48 KB data cache, 512 KB SRAM (448 KB of OCRAM and
64 KB of TCM)
i.MX 8QuadXPlus and 8DualXPlus Automotive and Infotainment Applications Processors, Rev. 1, 5/2019
2 NXP Semiconductors


Features NXP Semiconductors Data Sheet: Technical Data IMX8QXPAEC Rev. 1, 5/2019 For pa rt number information, contact an NXP r epresentative at nxp.com. i.MX 8QuadXP lus and 8DualXPlus Automotive and Infot ainment Applications Processors Packag e Information 21 x 21 mm package case o utline 17 x 17 mm package case outline Ordering Information See Section 1.1Tab le 5 on page 8 1 Introduction 1 Intro duction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 5 This data sheet contains specificatio ns for the 1.2 Package options . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.3 Related resources . . . . . . . . . . . . . . . . . . . . . . . . . . 5 i.MX 8QuadXPlus and 8DualXPlus processors, which, along with the i.MX 8DualX processor, comprise the i.MX 8X Family (for i.MX 8DualX specifications , see 2 Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2.1 Block Diag.
Keywords IMX8QXPAEC, datasheet, pdf, NXP, Applications, Processors, MX8QXPAEC, X8QXPAEC, 8QXPAEC, IMX8QXPAE, IMX8QXPA, IMX8QXP, Equivalent, stock, pinout, distributor, price, schematic, inventory, databook, Electronic, Components, Parameters, parts, cross reference, chip, Semiconductor, circuit, Electric, manual, substitute




@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)