Document
CYStech Electronics Corp.
Spec. No. : C659M3 Issued Date : 2008.06.25 Revised Date : Page No. : 1/6
NPN Epitaxial Planar High Current (High Performance) Transistor
BTD6055M3
Features
• Low VCE(SAT) • Low RCE(SAT), RCE(SAT)=50 mΩ(typically) at IC=5A
• Low operating collector voltage • Excellent current gain characteristics at very low VCE • Suitable for low dropout voltage application • Pb-free package
Symbol
BTD6055M3
Outline
SOT-89
B:Base C:Collector E:Emitter
BB C CE
Absolute Maximum Ratings (Ta=25°C)
Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Continuous Collector Current Peak Collector Current
Symbol VCBO VCEO VEBO IC ICP
Power Dissipation
Pd
Operating and Storage Temperature Range
Tj ; Tstg
Note : 1. When mounted on FR-4 PCB with area measuring 10×10×1 mm
2. When mounted on ceramic with area measuring 40×40×1 mm
BTD6055M3
Limits 15 10 7 6 9 0.6 1 (Note 1) 2 (Note 2)
-55 ~ +150
Unit V V V A A
W
°C
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C659M3 Issued Date : 2008.06.25 Revised Date : Page No. : 2/6
Characteristics (Ta=25°C, unless otherwise specified)
Symbol
Min. Typ. Max. Unit
Test Conditions
BVCEO
10
-
- V IC=1mA, IB=0
ICBO - - 100 nA VCB=12V, IE=0
IEBO - - 100 nA VEB=7V, IC=0
*VCE(sat)
-
- 0.2 V IC=3A, IB=20mA
*VCE(sat)
-
- 0.35 V IC=5A, IB=20mA
*VBE(sat)
-
- 1.2 V IC=3A, IB=60mA
*VBE(on)
-
- 1.2 V VCE=0.3V, IC=3A
*hFE 450 - - - VCE=0.3V, IC=500mA
*hFE 400 - - - VCE=0.3V, IC=1A
*hFE 250 - - - VCE=0.3V, IC=5A
fT 100 -
- MHz VCE=6V, IC=500mA, f=20MHz
Cob - - 50 pF VCB=10V, f=1MHz
*Pulse Test: Pulse Width ≤300μs, Duty Cycle≤2%
Ordering Information
Device BTD6055M3
Package
SOT-89 (Pb-free)
Shipping 1000 pcs / Tape & Reel
Marking D6055
BTD6055M3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C659M3 Issued Date : 2008.06.25 Revised Date : Page No. : 3/6
Characteristic Curves
Current Gain vs Collector Current
1000
VCE=1V
Saturation Voltage vs Collector Current 1000
VCESAT
Saturation Voltage-(mV)
Current Gain---HFE
VCE=0.5V
100 IC=50IB
VCE=0.3V HFE
100 10
100 1000 Collector Current ---IC(mA)
10000
10000
Saturation Voltage vs Collector Current VBESAT@IC=50IB
1000
10
1 10
2.5 2
1.5 1
IC=20IB
100 1000 Collector Current ---IC(mA)
Power Derating Curve
10000
See Note 2 on page 1 See Note 1 on page 1
Power Dissipation---PD(W)
Saturation Voltage-(mV)
0.5
100 10
100 1000 Collector Current--- IC(mA)
10000
0 0 50 100 150 200 Ambient Temperature---TA(℃)
BTD6055M3
CYStek Product Specification
Reel Dimension
CYStech Electronics Corp.
Spec. No. : C659M3 Issued Date : 2008.06.25 Revised Date : Page No. : 4/6
Carrier Tape Dimension
BTD6055M3
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C659M3 Issued Date : 2008.06.25 Revised Date : Page No. : 5/6
Recommended wave soldering condition
Product
Peak Temperature
Pb-free devices
260 +0/-5 °C
Soldering Time 5 +1/-1 seconds
Recommended temperature profile for IR reflow
Profile feature
Sn-Pb eutectic Assembly
Pb-free Assembly
Average ramp-up rate (Tsmax to Tp)
3°C/second max.
3°C/second max.
Preheat
−Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max)
100°C 150°C 60-120 seconds
150°C 200°C 60-180 seconds
Time maintained above:
−Temperature (TL) − Time (tL)
183°C 60-150 seconds
217°C 60-150 seconds
Peak Temperature(TP)
240 +0/-5 °C
260 +0/-5 °C
Time within 5°C of actual peak temperature(tp)
10-30 seconds
20-40 seconds
Ramp down rate
6°C/second max.
6°C/second max.
Time 25 °C to peak temperature
6 minutes max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
BTD6055M3
CYStek Product Specification
CYStech Electronics Corp.
SOT-89 Dimension
A
123
C
BD
Marking:
Product Name
H
Year code : 6→2006,
7→2007,…
Spec. No. : C659M3 Issued Date : 2008.06.25 Revised Date : Page No. : 6/6
Month code: 1~9, A,B,C
E F
G
Style: Pin 1. Base 2. Collector 3. Emitter
I
3-Lead SOT-89 Plastic Surface Mounted Package CYStek Package Code: M3
DIM
Inches Min. Max.
A 0.1732 0.1811
B 0.1594 0.1673
C 0.0591 0.0663
D 0.0945 0.1024
E 0.01417 0.0201
Millimeters Min. Max. 4.40 4.60 4.05 4.25 1.50 1.70 2.40 2.60 0.36 0.51
DIM
Inches Min. Max.
F 0.0583 0.0598
G 0.1165 0.1197
H 0.0551 0.0630
I 0.0138 0.0161
*: Typical
Millimeters Min. Max. 1.48 1.527 2.96 3.04 1.40 1.60 0.35 0.41
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: KFC ; solder plating • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are.