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A3G4250D Dataheets PDF



Part Number A3G4250D
Manufacturers STMicroelectronics
Logo STMicroelectronics
Description MEMS motion sensor
Datasheet A3G4250D DatasheetA3G4250D Datasheet (PDF)

A3G4250D MEMS motion sensor: 3-axis digital output gyroscope Features ■ Wide supply voltage: 2.4 V to 3.6 V ■ ±245 dps full scale ■ I2C/SPI digital output interface ■ 16-bit rate value data output ■ 8-bit temperature data output ■ Two digital output lines (interrupt and data ready) ■ Integrated low and high-pass filters with user- selectable bandwidth ■ Ultra-stable over temperature and time ■ Low-voltage-compatible IOs (1.8 V) ■ Embedded power-down and sleep mode ■ Embedded temperature sensor .

  A3G4250D   A3G4250D



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A3G4250D MEMS motion sensor: 3-axis digital output gyroscope Features ■ Wide supply voltage: 2.4 V to 3.6 V ■ ±245 dps full scale ■ I2C/SPI digital output interface ■ 16-bit rate value data output ■ 8-bit temperature data output ■ Two digital output lines (interrupt and data ready) ■ Integrated low and high-pass filters with user- selectable bandwidth ■ Ultra-stable over temperature and time ■ Low-voltage-compatible IOs (1.8 V) ■ Embedded power-down and sleep mode ■ Embedded temperature sensor ■ Embedded FIFO ■ High shock survivability ■ Extended operating temperature range (-40 °C to +85 °C) ■ ECOPACK® RoHS and “Green” compliant ■ AEC-Q100 qualification Applications ■ In-dash car navigation ■ Telematics, e-Tolling ■ Motion control with MMI (man-machine interface) ■ Appliances and robotics LGA-16 (4x4x1.1 mm3) Description The A3G4250D is a low-power 3-axis angular rate sensor able to provide unprecedented stability at zero rate level and sensitivity over temperature and time. It includes a sensing element and an IC interface capable of providing the measured angular rate to the external world through a standard SPI digital interface. An I2C-compatible interface is also available. The sensing element is manufactured using a dedicated micro-machining process developed by STMicroelectronics to produce inertial sensors and actuators on silicon wafers. The IC interface is manufactured using a CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the sensing element characteristics. The A3G4250D has a full scale of ±245 dps and is capable of measuring rates with a userselectable bandwidth. The A3G4250D is available in a plastic land grid array (LGA) package and can operate within a temperature range of -40 °C to +85 °C. Table 1. Device summary Order code Temperature range (°C) A3G4250D -40 to +85 A3G4250DTR -40 to +85 Package LGA-16 (4x4x1.1 mm3) LGA-16 (4x4x1.1 mm3) Packing Tray Tape and reel February 2012 Doc 022768 Rev 3 1/44 www.st.com 44 Contents Contents A3G4250D 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 1.1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 2 Mechanical and electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.3 Temperature sensor characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 2.4 Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.4.1 SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.4.2 I2C - inter IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2.5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.6 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.6.1 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.6.2 Zero-rate level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.6.3 Stability over temperature and time . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 2.7 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3 Main digital blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.2 FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.2.1 Bypass mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.2.2 FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.2.3 Stream mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 3.2.4 Retrieve data from FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4 Application hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5 Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.1 I2C serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 5.1.1 I2C operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5.2 SPI bus interface . . . . . . . . . . . . . . . . . . . . .


ATAES132A A3G4250D IIS328DQ


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