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STM32F413ZG Dataheets PDF



Part Number STM32F413ZG
Manufacturers STMicroelectronics
Logo STMicroelectronics
Description Arm-Cortex-M4 32b MCU+FPU
Datasheet STM32F413ZG DatasheetSTM32F413ZG Datasheet (PDF)

STM32F413xG STM32F413xH Arm®-Cortex®-M4 32b MCU+FPU, 125 DMIPS, up to 1.5MB Flash, 320KB RAM, USB OTG FS, 1 ADC, 2 DACs, 2 DFSDMs Datasheet - production data Features • Dynamic Efficiency Line with eBAM (enhanced Batch Acquisition Mode) – 1.7 V to 3.6 V power supply – -40 °C to 85/105/125 °C temperature range • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protectio.

  STM32F413ZG   STM32F413ZG



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STM32F413xG STM32F413xH Arm®-Cortex®-M4 32b MCU+FPU, 125 DMIPS, up to 1.5MB Flash, 320KB RAM, USB OTG FS, 1 ADC, 2 DACs, 2 DFSDMs Datasheet - production data Features • Dynamic Efficiency Line with eBAM (enhanced Batch Acquisition Mode) – 1.7 V to 3.6 V power supply – -40 °C to 85/105/125 °C temperature range • Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from Flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/ 1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions • Memories – Up to 1.5 Mbytes of Flash memory – 320 Kbytes of SRAM – Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory – Dual mode Quad-SPI interface • LCD parallel interface, 8080/6800 modes • Clock, reset and supply management – 1.7 to 3.6 V application supply and I/Os – POR, PDR, PVD and BOR – 4-to-26 MHz crystal oscillator – Internal 16 MHz factory-trimmed RC – 32 kHz oscillator for RTC with calibration – Internal 32 kHz RC with calibration • Power consumption – Run: 112 µA/MHz (peripheral off) – Stop (Flash in Stop mode, fast wakeup time): 42 µA Typ.; 80 µA max @25 °C – Stop (Flash in Deep power down mode, slow wakeup time): 15 µA Typ.; 46 µA max @25 °C – Standby without RTC: 1.1 µA Typ.; 14.7 µA max at @85 °C – VBAT supply for RTC: 1 µA @25 °C • 2x12-bit D/A converters • 1×12-bit, 2.4 MSPS ADC: up to 16 channels • 6x digital filters for sigma delta modulator, 12x PDM interfaces, with stereo microphone and sound source localization support • General-purpose DMA: 16-stream DMA )%*$ WLCSP81 (4.039x3.951 mm) LQFP64 (10x10mm) LQFP100 (14x14mm) LQFP144 (20x20mm) UFQFPN48 (7x7 mm) UFBGA100 (7x7mm) UFBGA144 (10x10mm) • Up to 18 timers: up to twelve 16-bit timers, two 32-bit timers up to 100 MHz each with up to four IC/OC/PWM or pulse counter and quadrature (incremental) encoder input, two watchdog timers (independent and window), one SysTick timer, and a low-power timer • Debug mode – Serial wire debug (SWD) & JTAG – Cortex®-M4 Embedded Trace Macrocell™ • Up to 114 I/O ports with interrupt capability – Up to 109 fast I/Os up to 100 MHz – Up to 114 five V-tolerant I/Os • Up to 24 communication interfaces – Up to 4x I2C interfaces (SMBus/PMBus) – Up to 10 UARTS: 4 USARTs / 6 UARTs (2 x 12.5 Mbit/s, 2 x 6.25 Mbit/s), ISO 7816 interface, LIN, IrDA, modem control) – Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or I2S audio protocol), out of which 2 muxed full-duplex I2S interfaces – SDIO interface (SD/MMC/eMMC) – Advanced connectivity: USB 2.0 full-speed device/host/OTG controller with PHY – 3x CAN (2.0B Active) – 1xSAI • True random number generator • CRC calculation unit • 96-bit unique ID • RTC: subsecond accuracy, hardware calendar • All packages are ECOPACK®2 Table 1. Device summary Reference Part number STM32F413xH STM32F413CH STM32F413MH STM32F413RH STM32F413VH STM32F413ZH STM32F413xG STM32F413CG STM32F413MG STM32F413RG STM32F413VG STM32F413ZG September 2017 This is information on a product in full production. DocID029162 Rev 6 1/208 www.st.com Contents Contents STM32F413xG/H 1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.1 Compatibility with STM32F4 series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3 Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 3.1 Arm® Cortex®-M4 with FPU core with embedded Flash and SRAM . . . . 19 3.2 Adaptive real-time memory accelerator (ART Accelerator™) . . . . . . . . . 19 3.3 Enhanced Batch Acquisition mode (eBAM) . . . . . . . . . . . . . . . . . . . . . . . 19 3.4 Memory protection unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.5 Embedded Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 3.6 CRC (cyclic redundancy check) calculation unit . . . . . . . . . . . . . . . . . . . 20 3.7 Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.8 Multi-AHB bus matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 3.9 DMA controller (DMA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 3.10 Flexible static memory controller (FSMC) . . . . . . . . . . . . . . . . . . . . . . . . 22 3.11 Quad-SPI memory interface (QUAD-SPI) . . . . . . . . . . . . . . . . . . . . . . . . 23 3.12 Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . . 23 3.13 External interrupt/event controller (EXTI) . . . . . . . . . . . . . . . . . . . . . . . . . 23 3.14 Clocks and startup . . ..


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