STM32F413ZG MCU+FPU Datasheet

STM32F413ZG Datasheet, PDF, Equivalent


Part Number

STM32F413ZG

Description

Arm-Cortex-M4 32b MCU+FPU

Manufacture

STMicroelectronics

Total Page 30 Pages
Datasheet
Download STM32F413ZG Datasheet


STM32F413ZG
STM32F413xG STM32F413xH
Arm®-Cortex®-M4 32b MCU+FPU, 125 DMIPS, up to 1.5MB Flash,
320KB RAM, USB OTG FS, 1 ADC, 2 DACs, 2 DFSDMs
Datasheet - production data
Features
Dynamic Efficiency Line with eBAM (enhanced
Batch Acquisition Mode)
– 1.7 V to 3.6 V power supply
– -40 °C to 85/105/125 °C temperature range
Core: Arm® 32-bit Cortex®-M4 CPU with FPU,
Adaptive real-time accelerator (ART
Accelerator™) allowing 0-wait state execution
from Flash memory, frequency up to 100 MHz,
memory protection unit, 125 DMIPS/
1.25 DMIPS/MHz (Dhrystone 2.1), and DSP
instructions
Memories
– Up to 1.5 Mbytes of Flash memory
– 320 Kbytes of SRAM
– Flexible external static memory controller
with up to 16-bit data bus: SRAM, PSRAM,
NOR Flash memory
– Dual mode Quad-SPI interface
LCD parallel interface, 8080/6800 modes
Clock, reset and supply management
– 1.7 to 3.6 V application supply and I/Os
– POR, PDR, PVD and BOR
– 4-to-26 MHz crystal oscillator
– Internal 16 MHz factory-trimmed RC
– 32 kHz oscillator for RTC with calibration
– Internal 32 kHz RC with calibration
Power consumption
– Run: 112 µA/MHz (peripheral off)
– Stop (Flash in Stop mode, fast wakeup
time): 42 µA Typ.; 80 µA max @25 °C
– Stop (Flash in Deep power down mode,
slow wakeup time): 15 µA Typ.;
46 µA max @25 °C
– Standby without RTC: 1.1 µA Typ.;
14.7 µA max at @85 °C
– VBAT supply for RTC: 1 µA @25 °C
2x12-bit D/A converters
1×12-bit, 2.4 MSPS ADC: up to 16 channels
6x digital filters for sigma delta modulator,
12x PDM interfaces, with stereo microphone
and sound source localization support
General-purpose DMA: 16-stream DMA
)%*$
WLCSP81
(4.039x3.951 mm)
LQFP64 (10x10mm)
LQFP100 (14x14mm)
LQFP144 (20x20mm)
UFQFPN48
(7x7 mm)
UFBGA100
(7x7mm)
UFBGA144
(10x10mm)
Up to 18 timers: up to twelve 16-bit timers, two
32-bit timers up to 100 MHz each with up to
four IC/OC/PWM or pulse counter and
quadrature (incremental) encoder input, two
watchdog timers (independent and window),
one SysTick timer, and a low-power timer
Debug mode
– Serial wire debug (SWD) & JTAG
– Cortex®-M4 Embedded Trace Macrocell™
Up to 114 I/O ports with interrupt capability
– Up to 109 fast I/Os up to 100 MHz
– Up to 114 five V-tolerant I/Os
Up to 24 communication interfaces
– Up to 4x I2C interfaces (SMBus/PMBus)
– Up to 10 UARTS: 4 USARTs / 6 UARTs
(2 x 12.5 Mbit/s, 2 x 6.25 Mbit/s), ISO 7816
interface, LIN, IrDA, modem control)
– Up to 5 SPI/I2Ss (up to 50 Mbit/s, SPI or
I2S audio protocol), out of which 2 muxed
full-duplex I2S interfaces
– SDIO interface (SD/MMC/eMMC)
– Advanced connectivity: USB 2.0 full-speed
device/host/OTG controller with PHY
– 3x CAN (2.0B Active)
– 1xSAI
True random number generator
CRC calculation unit
96-bit unique ID
RTC: subsecond accuracy, hardware calendar
All packages are ECOPACK®2
Table 1. Device summary
Reference
Part number
STM32F413xH
STM32F413CH STM32F413MH STM32F413RH
STM32F413VH STM32F413ZH
STM32F413xG
STM32F413CG STM32F413MG STM32F413RG
STM32F413VG STM32F413ZG
September 2017
This is information on a product in full production.
DocID029162 Rev 6
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STM32F413ZG
Contents
Contents
STM32F413xG/H
1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.1 Compatibility with STM32F4 series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
3 Functional overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
3.1 Arm® Cortex®-M4 with FPU core with embedded Flash and SRAM . . . . 19
3.2 Adaptive real-time memory accelerator (ART Accelerator™) . . . . . . . . . 19
3.3 Enhanced Batch Acquisition mode (eBAM) . . . . . . . . . . . . . . . . . . . . . . . 19
3.4 Memory protection unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.5 Embedded Flash memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
3.6 CRC (cyclic redundancy check) calculation unit . . . . . . . . . . . . . . . . . . . 20
3.7 Embedded SRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.8 Multi-AHB bus matrix . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
3.9 DMA controller (DMA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
3.10 Flexible static memory controller (FSMC) . . . . . . . . . . . . . . . . . . . . . . . . 22
3.11 Quad-SPI memory interface (QUAD-SPI) . . . . . . . . . . . . . . . . . . . . . . . . 23
3.12 Nested vectored interrupt controller (NVIC) . . . . . . . . . . . . . . . . . . . . . . . 23
3.13 External interrupt/event controller (EXTI) . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.14 Clocks and startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
3.15 Boot modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
3.16 Power supply schemes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
3.17 Power supply supervisor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.17.1 Internal reset ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
3.17.2 Internal reset OFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.18 Voltage regulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
3.18.1 Regulator ON . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.18.2 Regulator OFF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
3.18.3 Regulator ON/OFF and internal reset ON/OFF availability . . . . . . . . . . 31
3.19 Real-time clock (RTC) and backup registers . . . . . . . . . . . . . . . . . . . . . . 31
3.20 Low-power modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
3.21 VBAT operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
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Features STM32F413xG STM32F413xH Arm®-Cortex®- M4 32b MCU+FPU, 125 DMIPS, up to 1.5MB Flash, 320KB RAM, USB OTG FS, 1 ADC, 2 DACs, 2 DFSDMs Datasheet - production d ata Features • Dynamic Efficiency Li ne with eBAM (enhanced Batch Acquisitio n Mode) – 1.7 V to 3.6 V power supply – -40 °C to 85/105/125 °C temperat ure range • Core: Arm® 32-bit Cortex ®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowi ng 0-wait state execution from Flash me mory, frequency up to 100 MHz, memory p rotection unit, 125 DMIPS/ 1.25 DMIPS/M Hz (Dhrystone 2.1), and DSP instruction s • Memories – Up to 1.5 Mbytes of Flash memory – 320 Kbytes of SRAM – Flexible external static memory contro ller with up to 16-bit data bus: SRAM, PSRAM, NOR Flash memory – Dual mode Q uad-SPI interface • LCD parallel inte rface, 8080/6800 modes • Clock, reset and supply management – 1.7 to 3.6 V application supply and I/Os – POR, P DR, PVD and BOR – 4-to-26 MHz crystal oscillator – Internal 16 MHz factory-trimmed RC – 32 kHz os.
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